Solid–Liquid Diffusion Stresses Leading to Voiding

This paper discusses cavitation within a two-phase solid–liquid enclosed system due to interdiffusion. This mechanism is discussed within the context of solid–liquid interdiffusion bonding for metal systems and the voids which are caused by this mechanism. A case study composed of liquid (Sn), Ni 3 Sn 4 , and (Ni) phases was used. The mechanical tension and bubble volume resulting from the mechanically enclosed system during isothermal solidification at 250 °C were calculated using a fitted 1D growth model coupled with thermodynamics. Thermodynamic energy calculations showed that it becomes favorable for cavitation after 6 seconds for a starting liquid pocket of 5 µ m 3 . The critical pressure for this cavitation was − 0.029 GPa. The volumetric change for the reaction was determined to be − 12.3 vol pct by a partial molar volume balance. While the volumetric change determined by the thermodynamics found − 7.2 vol pct. The likely presence of unwettable inclusions in non-pure liquids would circumvent this cavitation mechanism, even though cavitation conditions are present. Meaning cavitation for these systems can only be expected when the liquid metal purity is sufficient. Lastly, the bubble growth is attributed to a combination of thermodynamic bubble growth and Kirkendall vacancies.