Electroless Deposition of Ni-Sn Layers Having High Sn Content（＞ 30 at.%）on Fe Substrates（3）: Examination of bath additives to prevent the formation of cracks and pinholes on the Ni-Sn layers
This study investigated plating bath additive effects on the improvement of electroless Ni-Sn plating film resistance against aqueous sodium hypochlorite solutions. Surfaces of conventional electroless Ni-Sn coatings show numerous cracks and pinholes. Through these gaps, a sodium hypochlorite aqueou...
Gespeichert in:
| Veröffentlicht in: | Hyōmen gijutsu 2024/11/01, Vol.75(11), pp.530-537 |
|---|---|
| Hauptverfasser: | , , , , , |
| Format: | Artikel |
| Sprache: | eng ; jpn |
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 537 |
|---|---|
| container_issue | 11 |
| container_start_page | 530 |
| container_title | Hyōmen gijutsu |
| container_volume | 75 |
| creator | IWAMOTO, Takayuki MIZUSHINA, Manato KARIYA, Shiho KAWAI, Akimasa FUKUNISHI, Mika MATSUMOTO, Futoshi |
| description | This study investigated plating bath additive effects on the improvement of electroless Ni-Sn plating film resistance against aqueous sodium hypochlorite solutions. Surfaces of conventional electroless Ni-Sn coatings show numerous cracks and pinholes. Through these gaps, a sodium hypochlorite aqueous solution can corrode the substrate, thereby decreasing the chemical resistance of the plated coating. A plating solution bath to which a combination of thiourea and hydroquinone had been added reduced the internal stress of the plating film, suppressed the rate of crack formation on the film surface, and reduced pinhole formation. Findings also revealed that the resultant film had higher resistance than conventional Ni-Sn films. |
| doi_str_mv | 10.4139/sfj.75.530 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_journals_3144518367</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>3144518367</sourcerecordid><originalsourceid>FETCH-LOGICAL-c1187-d68b77932c8fac5482790c1ae0a1d03bd2b35d167f2cdf8ef33d69fd62fd80ac3</originalsourceid><addsrcrecordid>eNo9kNFKwzAUhoMoOOZufIKAeCO05jRNm94IMjcnDL2YXoc0TbaO2s4kE_YG-hI-yd5pr2Bkc1cH_vP958CH0CWQOAVa3DqzjHMWM0pOUA84TyOakuIU9UgBLAKeFedo4FxdkoRRlgCkPaRHjVbedo12Dj_oVedqX3ct7gx-rqNZi6dyo63DE_lZt3M8qecLHNJh13rd-t32a7f9wZRg6ePr3fY7NMcaz9al81Z67QJAQ3yBzoxsnB4cZh-9jUevw0k0fXl8Gt5PIwXA86jKeJnnBU0UN1KxlCd5QRRITSRUhJZVUlJWQZabRFWGa0NplRWmyhJTcSIV7aOr_d2V7T7W2nmx7Na2DS8FhTRlwGmWB-pmTynbOWe1EStbv0u7EUDEn0kRTIqciWAywHd7eOm8nOsjKq2vVaP_UYBD4bhQC2mFbukvlXiBrA</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>3144518367</pqid></control><display><type>article</type><title>Electroless Deposition of Ni-Sn Layers Having High Sn Content（＞ 30 at.%）on Fe Substrates（3）: Examination of bath additives to prevent the formation of cracks and pinholes on the Ni-Sn layers</title><source>J-STAGE (Japan Science & Technology Information Aggregator, Electronic) Freely Available Titles - Japanese</source><creator>IWAMOTO, Takayuki ; MIZUSHINA, Manato ; KARIYA, Shiho ; KAWAI, Akimasa ; FUKUNISHI, Mika ; MATSUMOTO, Futoshi</creator><creatorcontrib>IWAMOTO, Takayuki ; MIZUSHINA, Manato ; KARIYA, Shiho ; KAWAI, Akimasa ; FUKUNISHI, Mika ; MATSUMOTO, Futoshi</creatorcontrib><description>This study investigated plating bath additive effects on the improvement of electroless Ni-Sn plating film resistance against aqueous sodium hypochlorite solutions. Surfaces of conventional electroless Ni-Sn coatings show numerous cracks and pinholes. Through these gaps, a sodium hypochlorite aqueous solution can corrode the substrate, thereby decreasing the chemical resistance of the plated coating. A plating solution bath to which a combination of thiourea and hydroquinone had been added reduced the internal stress of the plating film, suppressed the rate of crack formation on the film surface, and reduced pinhole formation. Findings also revealed that the resultant film had higher resistance than conventional Ni-Sn films.</description><identifier>ISSN: 0915-1869</identifier><identifier>EISSN: 1884-3409</identifier><identifier>DOI: 10.4139/sfj.75.530</identifier><language>eng ; jpn</language><publisher>Tokyo: The Surface Finishing Society of Japan</publisher><subject>Additives ; Aqueous solutions ; Corrosion resistance ; Crack ; Electroless Deposition ; Electroless plating ; Hole Formation ; Hydroquinone ; Ni-Sn ; Pinholes ; Plating baths ; Residual stress ; Sodium hypochlorite ; Substrates ; Thiourea ; Tin plating</subject><ispartof>Journal of The Surface Finishing Society of Japan, 2024/11/01, Vol.75(11), pp.530-537</ispartof><rights>by The Surface Finishing Society of Japan</rights><rights>Copyright Japan Science and Technology Agency 2024</rights><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c1187-d68b77932c8fac5482790c1ae0a1d03bd2b35d167f2cdf8ef33d69fd62fd80ac3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,777,781,1877,27905,27906</link.rule.ids></links><search><creatorcontrib>IWAMOTO, Takayuki</creatorcontrib><creatorcontrib>MIZUSHINA, Manato</creatorcontrib><creatorcontrib>KARIYA, Shiho</creatorcontrib><creatorcontrib>KAWAI, Akimasa</creatorcontrib><creatorcontrib>FUKUNISHI, Mika</creatorcontrib><creatorcontrib>MATSUMOTO, Futoshi</creatorcontrib><title>Electroless Deposition of Ni-Sn Layers Having High Sn Content（＞ 30 at.%）on Fe Substrates（3）: Examination of bath additives to prevent the formation of cracks and pinholes on the Ni-Sn layers</title><title>Hyōmen gijutsu</title><addtitle>Journal of The Surface Finishing Society of Japan</addtitle><description>This study investigated plating bath additive effects on the improvement of electroless Ni-Sn plating film resistance against aqueous sodium hypochlorite solutions. Surfaces of conventional electroless Ni-Sn coatings show numerous cracks and pinholes. Through these gaps, a sodium hypochlorite aqueous solution can corrode the substrate, thereby decreasing the chemical resistance of the plated coating. A plating solution bath to which a combination of thiourea and hydroquinone had been added reduced the internal stress of the plating film, suppressed the rate of crack formation on the film surface, and reduced pinhole formation. Findings also revealed that the resultant film had higher resistance than conventional Ni-Sn films.</description><subject>Additives</subject><subject>Aqueous solutions</subject><subject>Corrosion resistance</subject><subject>Crack</subject><subject>Electroless Deposition</subject><subject>Electroless plating</subject><subject>Hole Formation</subject><subject>Hydroquinone</subject><subject>Ni-Sn</subject><subject>Pinholes</subject><subject>Plating baths</subject><subject>Residual stress</subject><subject>Sodium hypochlorite</subject><subject>Substrates</subject><subject>Thiourea</subject><subject>Tin plating</subject><issn>0915-1869</issn><issn>1884-3409</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2024</creationdate><recordtype>article</recordtype><recordid>eNo9kNFKwzAUhoMoOOZufIKAeCO05jRNm94IMjcnDL2YXoc0TbaO2s4kE_YG-hI-yd5pr2Bkc1cH_vP958CH0CWQOAVa3DqzjHMWM0pOUA84TyOakuIU9UgBLAKeFedo4FxdkoRRlgCkPaRHjVbedo12Dj_oVedqX3ct7gx-rqNZi6dyo63DE_lZt3M8qecLHNJh13rd-t32a7f9wZRg6ePr3fY7NMcaz9al81Z67QJAQ3yBzoxsnB4cZh-9jUevw0k0fXl8Gt5PIwXA86jKeJnnBU0UN1KxlCd5QRRITSRUhJZVUlJWQZabRFWGa0NplRWmyhJTcSIV7aOr_d2V7T7W2nmx7Na2DS8FhTRlwGmWB-pmTynbOWe1EStbv0u7EUDEn0kRTIqciWAywHd7eOm8nOsjKq2vVaP_UYBD4bhQC2mFbukvlXiBrA</recordid><startdate>20241101</startdate><enddate>20241101</enddate><creator>IWAMOTO, Takayuki</creator><creator>MIZUSHINA, Manato</creator><creator>KARIYA, Shiho</creator><creator>KAWAI, Akimasa</creator><creator>FUKUNISHI, Mika</creator><creator>MATSUMOTO, Futoshi</creator><general>The Surface Finishing Society of Japan</general><general>Japan Science and Technology Agency</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20241101</creationdate><title>Electroless Deposition of Ni-Sn Layers Having High Sn Content（＞ 30 at.%）on Fe Substrates（3）</title><author>IWAMOTO, Takayuki ; MIZUSHINA, Manato ; KARIYA, Shiho ; KAWAI, Akimasa ; FUKUNISHI, Mika ; MATSUMOTO, Futoshi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c1187-d68b77932c8fac5482790c1ae0a1d03bd2b35d167f2cdf8ef33d69fd62fd80ac3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng ; jpn</language><creationdate>2024</creationdate><topic>Additives</topic><topic>Aqueous solutions</topic><topic>Corrosion resistance</topic><topic>Crack</topic><topic>Electroless Deposition</topic><topic>Electroless plating</topic><topic>Hole Formation</topic><topic>Hydroquinone</topic><topic>Ni-Sn</topic><topic>Pinholes</topic><topic>Plating baths</topic><topic>Residual stress</topic><topic>Sodium hypochlorite</topic><topic>Substrates</topic><topic>Thiourea</topic><topic>Tin plating</topic><toplevel>online_resources</toplevel><creatorcontrib>IWAMOTO, Takayuki</creatorcontrib><creatorcontrib>MIZUSHINA, Manato</creatorcontrib><creatorcontrib>KARIYA, Shiho</creatorcontrib><creatorcontrib>KAWAI, Akimasa</creatorcontrib><creatorcontrib>FUKUNISHI, Mika</creatorcontrib><creatorcontrib>MATSUMOTO, Futoshi</creatorcontrib><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Hyōmen gijutsu</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>IWAMOTO, Takayuki</au><au>MIZUSHINA, Manato</au><au>KARIYA, Shiho</au><au>KAWAI, Akimasa</au><au>FUKUNISHI, Mika</au><au>MATSUMOTO, Futoshi</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Electroless Deposition of Ni-Sn Layers Having High Sn Content（＞ 30 at.%）on Fe Substrates（3）: Examination of bath additives to prevent the formation of cracks and pinholes on the Ni-Sn layers</atitle><jtitle>Hyōmen gijutsu</jtitle><addtitle>Journal of The Surface Finishing Society of Japan</addtitle><date>2024-11-01</date><risdate>2024</risdate><volume>75</volume><issue>11</issue><spage>530</spage><epage>537</epage><pages>530-537</pages><issn>0915-1869</issn><eissn>1884-3409</eissn><abstract>This study investigated plating bath additive effects on the improvement of electroless Ni-Sn plating film resistance against aqueous sodium hypochlorite solutions. Surfaces of conventional electroless Ni-Sn coatings show numerous cracks and pinholes. Through these gaps, a sodium hypochlorite aqueous solution can corrode the substrate, thereby decreasing the chemical resistance of the plated coating. A plating solution bath to which a combination of thiourea and hydroquinone had been added reduced the internal stress of the plating film, suppressed the rate of crack formation on the film surface, and reduced pinhole formation. Findings also revealed that the resultant film had higher resistance than conventional Ni-Sn films.</abstract><cop>Tokyo</cop><pub>The Surface Finishing Society of Japan</pub><doi>10.4139/sfj.75.530</doi><tpages>8</tpages><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0915-1869 |
| ispartof | Journal of The Surface Finishing Society of Japan, 2024/11/01, Vol.75(11), pp.530-537 |
| issn | 0915-1869 1884-3409 |
| language | eng ; jpn |
| recordid | cdi_proquest_journals_3144518367 |
| source | J-STAGE (Japan Science & Technology Information Aggregator, Electronic) Freely Available Titles - Japanese |
| subjects | Additives Aqueous solutions Corrosion resistance Crack Electroless Deposition Electroless plating Hole Formation Hydroquinone Ni-Sn Pinholes Plating baths Residual stress Sodium hypochlorite Substrates Thiourea Tin plating |
| title | Electroless Deposition of Ni-Sn Layers Having High Sn Content（＞ 30 at.%）on Fe Substrates（3）: Examination of bath additives to prevent the formation of cracks and pinholes on the Ni-Sn layers |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-18T07%3A01%3A35IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Electroless%20Deposition%20of%20Ni-Sn%20Layers%20Having%20High%20Sn%20Content%EF%BC%88%EF%BC%9E%2030%20at.%25%EF%BC%89on%20Fe%20Substrates%EF%BC%883%EF%BC%89:%20Examination%20of%20bath%20additives%20to%20prevent%20the%20formation%20of%20cracks%20and%20pinholes%20on%20the%20Ni-Sn%20layers&rft.jtitle=Hy%C5%8Dmen%20gijutsu&rft.au=IWAMOTO,%20Takayuki&rft.date=2024-11-01&rft.volume=75&rft.issue=11&rft.spage=530&rft.epage=537&rft.pages=530-537&rft.issn=0915-1869&rft.eissn=1884-3409&rft_id=info:doi/10.4139/sfj.75.530&rft_dat=%3Cproquest_cross%3E3144518367%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=3144518367&rft_id=info:pmid/&rfr_iscdi=true |