Effect of butanedione oxime, 3-mercapto-2-propanesulfonate, and histidine on growth and magnetic properties of electrodeposited cobalt on copper substrate

Shorter electron mean free path, lower thermal expansion coefficient, and higher melting point compared to copper have made cobalt a promising alternative to copper in the post-Moore era. It has been extensively explored as a magnetic alloy material for downsized magnetic electronic components, stor...

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Veröffentlicht in:	Journal of materials science. Materials in electronics 2024-12, Vol.35 (36), p.2268, Article 2268
Hauptverfasser:	Cao, Wei, Zhu, Zonghan, Li, Qinyuan, Xie, Jie, Cui, Liangduan, Zhu, Min, Zhang, Han, He, Wei, Huang, Qing, Wang, Yuecong, Chen, Yuanming
Format:	Artikel
Sprache:	eng
Schlagworte:	Additives Adsorption Characterization and Evaluation of Materials Chemistry and Materials Science Cobalt Cobalt plating Coercivity Copper Copper plating Electrodeposition Electron density Electronic components Electroplating Energy distribution Functional groups Histidine Imidazole Magnetic alloys Magnetic properties Magnetic saturation Materials Science Melting points Optical and Electronic Materials Quantum chemistry Substrates Sulfonic acid Thermal expansion
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