Performance of heat-resisting functional polypropylene/hollow silica substrates for 6th generation wireless communication
The effects of density and shape of hollow silica (functionalized silica hollow tubes (FSHT) or hollow glass microspheres (FHGM)) on dielectric constant (ε r ) and dielectric loss (tan δ) of hindered phenol (HP) grafted functional polypropylene (FPP)/FSHT, heat-treated FPP (HTFPP)/FSHT, FPP/FHGM or...
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| Veröffentlicht in: | Journal of polymer research 2024-10, Vol.31 (10), Article 309 |
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| creator | Yang, Kai-ru Ouyang, Shuang Ma, Ning Hsu, Tim Huang, Ya-qiong Yeh, Jen-taut |
| description | The effects of density and shape of hollow silica (functionalized silica hollow tubes (FSHT) or hollow glass microspheres (FHGM)) on dielectric constant (ε
r
) and dielectric loss (tan δ) of hindered phenol (HP) grafted functional polypropylene (FPP)/FSHT, heat-treated FPP (HTFPP)/FSHT, FPP/FHGM or HTFPP/FHGM substrate films were systematically investigated. The dielectric or free-volume-hole characteristics of FPP/FSHT, FPP/FHGM, HTFPP/FSHT, or HTFPP/FHGM films decrease to a minimum, as FSHT or FHGM contents approach an optimal value of 4wt% or 8wt%, respectively, and their dielectric or free-volume-hole characteristics decrease or increase gradually with increasing HP molar%. The minimum ε
r
and tan δ of FPP/FSHT or HTFPP/FSHT films decrease significantly with decreasing FSHT’s densities. By filling with 0.46 g/cm
3
identical density of hollow silica fillers, the minimum ε
r
or tan δ procured for FPP/FSHT or HTFPP/FSHT films are somewhat smaller than those of corresponding FPP/FHGM or HTFPP/FHGM films. The linear coefficient of thermal expansion (LCTE) or onset degradation temperature (DT
onset
) of FPP/FSHT, HTFPP/FSHT, FPP/FHGM or HTFPP/FHGM films reduce or increase visibly with increasing FSHT or FHGM contents, respectively. All DT
onset
values of HTFPP/hollow silica films are ~ 150℃ higher than those of conventional PP polymers. Satisfactorily low ε
r
/tan δ (1.74/0.0019, 1.83/0.0020, 1.83/0.0024 and 1.92/0.0028 at 1 MHz), LCTE (95 × 10
–6
/℃, 89 × 10
–6
/℃, 80 × 10
–6
/℃ and 74 × 10
–6
/℃) and pleasing heat-resisting properties for 6G ultrarapid communication are acquired for properly prepared FPP/FSHT, HTFPP/FSHT FPP/FHGM or HTFPP/FHGM substrate films having 1.2 HP molar% and 0.46 g/cm
3
density of FSHT and FHGM fillers. Probable reasons accounting for these reduced dielectric, LCTE and improved heat-resisting characteristics are proposed. |
| doi_str_mv | 10.1007/s10965-024-04147-5 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_journals_3114485085</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>3114485085</sourcerecordid><originalsourceid>FETCH-LOGICAL-c200t-1ee00d6ca1fd5409153135707828295e631dd1ebe8743c7fee304aa0946da4b93</originalsourceid><addsrcrecordid>eNp9kE9Lw0AQxYMoWKtfwNOC57Wz2d1scpTiPyjoQc_LNpm0KWk27iSUfnu3RvDmaYbH-z1mXpLcCrgXAGZBAopMc0gVByWU4fosmQltUp4XUp_HHdKUFyaDy-SKaAegtcnyWXJ8x1D7sHddiczXbItu4AGpoaHpNqweu3JofOda1vv22AffH1vscLH1besPjJq2KR2jcU1DcAMSi2EsG7ZsE11RiSw7NAFbJGKl3-_HLgIn-Tq5qF1LePM758nn0-PH8oWv3p5flw8rXqYAAxeIAFVWOlFXWkEhtBRSGzB5mqeFxkyKqhK4xtwoWZoaUYJyDgqVVU6tCzlP7qbcePzXiDTYnR9D_IisFEKpXEOuoyudXGXwRAFr24dm78LRCrCniu1UsY0V25-K7QmSE0TR3G0w_EX_Q30DEOCBzw</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>3114485085</pqid></control><display><type>article</type><title>Performance of heat-resisting functional polypropylene/hollow silica substrates for 6th generation wireless communication</title><source>Springer Nature - Complete Springer Journals</source><creator>Yang, Kai-ru ; Ouyang, Shuang ; Ma, Ning ; Hsu, Tim ; Huang, Ya-qiong ; Yeh, Jen-taut</creator><creatorcontrib>Yang, Kai-ru ; Ouyang, Shuang ; Ma, Ning ; Hsu, Tim ; Huang, Ya-qiong ; Yeh, Jen-taut</creatorcontrib><description>The effects of density and shape of hollow silica (functionalized silica hollow tubes (FSHT) or hollow glass microspheres (FHGM)) on dielectric constant (ε
r
) and dielectric loss (tan δ) of hindered phenol (HP) grafted functional polypropylene (FPP)/FSHT, heat-treated FPP (HTFPP)/FSHT, FPP/FHGM or HTFPP/FHGM substrate films were systematically investigated. The dielectric or free-volume-hole characteristics of FPP/FSHT, FPP/FHGM, HTFPP/FSHT, or HTFPP/FHGM films decrease to a minimum, as FSHT or FHGM contents approach an optimal value of 4wt% or 8wt%, respectively, and their dielectric or free-volume-hole characteristics decrease or increase gradually with increasing HP molar%. The minimum ε
r
and tan δ of FPP/FSHT or HTFPP/FSHT films decrease significantly with decreasing FSHT’s densities. By filling with 0.46 g/cm
3
identical density of hollow silica fillers, the minimum ε
r
or tan δ procured for FPP/FSHT or HTFPP/FSHT films are somewhat smaller than those of corresponding FPP/FHGM or HTFPP/FHGM films. The linear coefficient of thermal expansion (LCTE) or onset degradation temperature (DT
onset
) of FPP/FSHT, HTFPP/FSHT, FPP/FHGM or HTFPP/FHGM films reduce or increase visibly with increasing FSHT or FHGM contents, respectively. All DT
onset
values of HTFPP/hollow silica films are ~ 150℃ higher than those of conventional PP polymers. Satisfactorily low ε
r
/tan δ (1.74/0.0019, 1.83/0.0020, 1.83/0.0024 and 1.92/0.0028 at 1 MHz), LCTE (95 × 10
–6
/℃, 89 × 10
–6
/℃, 80 × 10
–6
/℃ and 74 × 10
–6
/℃) and pleasing heat-resisting properties for 6G ultrarapid communication are acquired for properly prepared FPP/FSHT, HTFPP/FSHT FPP/FHGM or HTFPP/FHGM substrate films having 1.2 HP molar% and 0.46 g/cm
3
density of FSHT and FHGM fillers. Probable reasons accounting for these reduced dielectric, LCTE and improved heat-resisting characteristics are proposed.</description><identifier>ISSN: 1022-9760</identifier><identifier>EISSN: 1572-8935</identifier><identifier>DOI: 10.1007/s10965-024-04147-5</identifier><language>eng</language><publisher>Dordrecht: Springer Netherlands</publisher><subject>Characterization and Evaluation of Materials ; Chemistry ; Chemistry and Materials Science ; Density ; Dielectric loss ; Fillers ; Heat treatment ; Industrial Chemistry/Chemical Engineering ; Microspheres ; Original Paper ; Polymer Sciences ; Polypropylene ; Shape effects ; Silica glass ; Silicon dioxide ; Substrates ; Thermal expansion ; Tubes ; Wireless communications</subject><ispartof>Journal of polymer research, 2024-10, Vol.31 (10), Article 309</ispartof><rights>The Polymer Society, Taipei 2024. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c200t-1ee00d6ca1fd5409153135707828295e631dd1ebe8743c7fee304aa0946da4b93</cites><orcidid>0000-0002-1249-0858</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s10965-024-04147-5$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s10965-024-04147-5$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,776,780,27901,27902,41464,42533,51294</link.rule.ids></links><search><creatorcontrib>Yang, Kai-ru</creatorcontrib><creatorcontrib>Ouyang, Shuang</creatorcontrib><creatorcontrib>Ma, Ning</creatorcontrib><creatorcontrib>Hsu, Tim</creatorcontrib><creatorcontrib>Huang, Ya-qiong</creatorcontrib><creatorcontrib>Yeh, Jen-taut</creatorcontrib><title>Performance of heat-resisting functional polypropylene/hollow silica substrates for 6th generation wireless communication</title><title>Journal of polymer research</title><addtitle>J Polym Res</addtitle><description>The effects of density and shape of hollow silica (functionalized silica hollow tubes (FSHT) or hollow glass microspheres (FHGM)) on dielectric constant (ε
r
) and dielectric loss (tan δ) of hindered phenol (HP) grafted functional polypropylene (FPP)/FSHT, heat-treated FPP (HTFPP)/FSHT, FPP/FHGM or HTFPP/FHGM substrate films were systematically investigated. The dielectric or free-volume-hole characteristics of FPP/FSHT, FPP/FHGM, HTFPP/FSHT, or HTFPP/FHGM films decrease to a minimum, as FSHT or FHGM contents approach an optimal value of 4wt% or 8wt%, respectively, and their dielectric or free-volume-hole characteristics decrease or increase gradually with increasing HP molar%. The minimum ε
r
and tan δ of FPP/FSHT or HTFPP/FSHT films decrease significantly with decreasing FSHT’s densities. By filling with 0.46 g/cm
3
identical density of hollow silica fillers, the minimum ε
r
or tan δ procured for FPP/FSHT or HTFPP/FSHT films are somewhat smaller than those of corresponding FPP/FHGM or HTFPP/FHGM films. The linear coefficient of thermal expansion (LCTE) or onset degradation temperature (DT
onset
) of FPP/FSHT, HTFPP/FSHT, FPP/FHGM or HTFPP/FHGM films reduce or increase visibly with increasing FSHT or FHGM contents, respectively. All DT
onset
values of HTFPP/hollow silica films are ~ 150℃ higher than those of conventional PP polymers. Satisfactorily low ε
r
/tan δ (1.74/0.0019, 1.83/0.0020, 1.83/0.0024 and 1.92/0.0028 at 1 MHz), LCTE (95 × 10
–6
/℃, 89 × 10
–6
/℃, 80 × 10
–6
/℃ and 74 × 10
–6
/℃) and pleasing heat-resisting properties for 6G ultrarapid communication are acquired for properly prepared FPP/FSHT, HTFPP/FSHT FPP/FHGM or HTFPP/FHGM substrate films having 1.2 HP molar% and 0.46 g/cm
3
density of FSHT and FHGM fillers. Probable reasons accounting for these reduced dielectric, LCTE and improved heat-resisting characteristics are proposed.</description><subject>Characterization and Evaluation of Materials</subject><subject>Chemistry</subject><subject>Chemistry and Materials Science</subject><subject>Density</subject><subject>Dielectric loss</subject><subject>Fillers</subject><subject>Heat treatment</subject><subject>Industrial Chemistry/Chemical Engineering</subject><subject>Microspheres</subject><subject>Original Paper</subject><subject>Polymer Sciences</subject><subject>Polypropylene</subject><subject>Shape effects</subject><subject>Silica glass</subject><subject>Silicon dioxide</subject><subject>Substrates</subject><subject>Thermal expansion</subject><subject>Tubes</subject><subject>Wireless communications</subject><issn>1022-9760</issn><issn>1572-8935</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2024</creationdate><recordtype>article</recordtype><recordid>eNp9kE9Lw0AQxYMoWKtfwNOC57Wz2d1scpTiPyjoQc_LNpm0KWk27iSUfnu3RvDmaYbH-z1mXpLcCrgXAGZBAopMc0gVByWU4fosmQltUp4XUp_HHdKUFyaDy-SKaAegtcnyWXJ8x1D7sHddiczXbItu4AGpoaHpNqweu3JofOda1vv22AffH1vscLH1besPjJq2KR2jcU1DcAMSi2EsG7ZsE11RiSw7NAFbJGKl3-_HLgIn-Tq5qF1LePM758nn0-PH8oWv3p5flw8rXqYAAxeIAFVWOlFXWkEhtBRSGzB5mqeFxkyKqhK4xtwoWZoaUYJyDgqVVU6tCzlP7qbcePzXiDTYnR9D_IisFEKpXEOuoyudXGXwRAFr24dm78LRCrCniu1UsY0V25-K7QmSE0TR3G0w_EX_Q30DEOCBzw</recordid><startdate>20241001</startdate><enddate>20241001</enddate><creator>Yang, Kai-ru</creator><creator>Ouyang, Shuang</creator><creator>Ma, Ning</creator><creator>Hsu, Tim</creator><creator>Huang, Ya-qiong</creator><creator>Yeh, Jen-taut</creator><general>Springer Netherlands</general><general>Springer Nature B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>8FD</scope><scope>JG9</scope><orcidid>https://orcid.org/0000-0002-1249-0858</orcidid></search><sort><creationdate>20241001</creationdate><title>Performance of heat-resisting functional polypropylene/hollow silica substrates for 6th generation wireless communication</title><author>Yang, Kai-ru ; Ouyang, Shuang ; Ma, Ning ; Hsu, Tim ; Huang, Ya-qiong ; Yeh, Jen-taut</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c200t-1ee00d6ca1fd5409153135707828295e631dd1ebe8743c7fee304aa0946da4b93</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2024</creationdate><topic>Characterization and Evaluation of Materials</topic><topic>Chemistry</topic><topic>Chemistry and Materials Science</topic><topic>Density</topic><topic>Dielectric loss</topic><topic>Fillers</topic><topic>Heat treatment</topic><topic>Industrial Chemistry/Chemical Engineering</topic><topic>Microspheres</topic><topic>Original Paper</topic><topic>Polymer Sciences</topic><topic>Polypropylene</topic><topic>Shape effects</topic><topic>Silica glass</topic><topic>Silicon dioxide</topic><topic>Substrates</topic><topic>Thermal expansion</topic><topic>Tubes</topic><topic>Wireless communications</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Yang, Kai-ru</creatorcontrib><creatorcontrib>Ouyang, Shuang</creatorcontrib><creatorcontrib>Ma, Ning</creatorcontrib><creatorcontrib>Hsu, Tim</creatorcontrib><creatorcontrib>Huang, Ya-qiong</creatorcontrib><creatorcontrib>Yeh, Jen-taut</creatorcontrib><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Journal of polymer research</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Yang, Kai-ru</au><au>Ouyang, Shuang</au><au>Ma, Ning</au><au>Hsu, Tim</au><au>Huang, Ya-qiong</au><au>Yeh, Jen-taut</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Performance of heat-resisting functional polypropylene/hollow silica substrates for 6th generation wireless communication</atitle><jtitle>Journal of polymer research</jtitle><stitle>J Polym Res</stitle><date>2024-10-01</date><risdate>2024</risdate><volume>31</volume><issue>10</issue><artnum>309</artnum><issn>1022-9760</issn><eissn>1572-8935</eissn><abstract>The effects of density and shape of hollow silica (functionalized silica hollow tubes (FSHT) or hollow glass microspheres (FHGM)) on dielectric constant (ε
r
) and dielectric loss (tan δ) of hindered phenol (HP) grafted functional polypropylene (FPP)/FSHT, heat-treated FPP (HTFPP)/FSHT, FPP/FHGM or HTFPP/FHGM substrate films were systematically investigated. The dielectric or free-volume-hole characteristics of FPP/FSHT, FPP/FHGM, HTFPP/FSHT, or HTFPP/FHGM films decrease to a minimum, as FSHT or FHGM contents approach an optimal value of 4wt% or 8wt%, respectively, and their dielectric or free-volume-hole characteristics decrease or increase gradually with increasing HP molar%. The minimum ε
r
and tan δ of FPP/FSHT or HTFPP/FSHT films decrease significantly with decreasing FSHT’s densities. By filling with 0.46 g/cm
3
identical density of hollow silica fillers, the minimum ε
r
or tan δ procured for FPP/FSHT or HTFPP/FSHT films are somewhat smaller than those of corresponding FPP/FHGM or HTFPP/FHGM films. The linear coefficient of thermal expansion (LCTE) or onset degradation temperature (DT
onset
) of FPP/FSHT, HTFPP/FSHT, FPP/FHGM or HTFPP/FHGM films reduce or increase visibly with increasing FSHT or FHGM contents, respectively. All DT
onset
values of HTFPP/hollow silica films are ~ 150℃ higher than those of conventional PP polymers. Satisfactorily low ε
r
/tan δ (1.74/0.0019, 1.83/0.0020, 1.83/0.0024 and 1.92/0.0028 at 1 MHz), LCTE (95 × 10
–6
/℃, 89 × 10
–6
/℃, 80 × 10
–6
/℃ and 74 × 10
–6
/℃) and pleasing heat-resisting properties for 6G ultrarapid communication are acquired for properly prepared FPP/FSHT, HTFPP/FSHT FPP/FHGM or HTFPP/FHGM substrate films having 1.2 HP molar% and 0.46 g/cm
3
density of FSHT and FHGM fillers. Probable reasons accounting for these reduced dielectric, LCTE and improved heat-resisting characteristics are proposed.</abstract><cop>Dordrecht</cop><pub>Springer Netherlands</pub><doi>10.1007/s10965-024-04147-5</doi><orcidid>https://orcid.org/0000-0002-1249-0858</orcidid></addata></record> |
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| source | Springer Nature - Complete Springer Journals |
| subjects | Characterization and Evaluation of Materials Chemistry Chemistry and Materials Science Density Dielectric loss Fillers Heat treatment Industrial Chemistry/Chemical Engineering Microspheres Original Paper Polymer Sciences Polypropylene Shape effects Silica glass Silicon dioxide Substrates Thermal expansion Tubes Wireless communications |
| title | Performance of heat-resisting functional polypropylene/hollow silica substrates for 6th generation wireless communication |
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