Design of Thermal Interface Materials with Excellent Interfacial Heat/Force Transfer Ability via Hierarchical Energy Dissipation

Interfaces play an important role in the heat and stress transfer within applications such as electronic cooling. The coexistence of apparently contradictory properties between heat dissipation and adhesion at interfaces poses a constant challenge for existing interface materials. Herein, a thermal...

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Veröffentlicht in:	Advanced functional materials 2024-10, Vol.34 (41), p.n/a
Hauptverfasser:	Zeng, Chen, Zeng, Xiangliang, Cheng, Xiaxia, Pang, Yunsong, Xu, Jianbin, Sun, Rong, Zeng, Xiaoliang
Format:	Artikel
Sprache:	eng
Schlagworte:	Adhesion adhesion energy Aluminum Chemical bonds Cooling Energy dissipation Fillers interface materials Interface stability Interfaces Light emitting diodes Molecular chains Polydimethylsiloxane Stress transfer Thermal conductivity
Online-Zugang:	Volltext
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