Slotted vertical wall for decoupling and beam tilt correction

An intra-band pattern-corrected decoupling vertical conducting wall is realized by dielectric substrate with conductor cladding on both side wall between two tightly spaced H-plane microstrip patches with λ0/20 edge-to-edge spacing. The wall is grounded and two symmetrical slots are etched on the ve...

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Bibliographische Detailangaben

Veröffentlicht in:	International journal of microwave and wireless technologies 2024-02, Vol.16 (1), p.162-166
Hauptverfasser:	Wang, Yiying, Zhang, Shengfei, Wang, Bo, Zhang, Hongxin, Jiang, Yannan, Pan, Wanghua, Kishk, Ahmed A.
Format:	Artikel
Sprache:	eng
Schlagworte:	Antenna Design, Modelling and Measurements Antennas Conduction Decoupling Mutual coupling Radiation Simulation Substrates
Online-Zugang:	Volltext
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