Effects of curing condition and solder mask on substrate warpage: an experimental and simulation study

The warpage of the package substrate mainly originates from the material property and size variations of individual components, especially when multiple components are involved. To maintain the substrate warpage within acceptable limits, it’s crucial to fine-tune component parameters carefully, choo...

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Veröffentlicht in:	Journal of materials science. Materials in electronics 2024-09, Vol.35 (26), p.1734, Article 1734
Hauptverfasser:	Fan, Guowei, Hu, Zengming, Xu, Jie, Tang, Junqi, Liu, Dashun, Fang, Zeming, Luo, Li, Liu, Qianfa, Lu, Dong, Xue, Ke, Wang, Ke
Format:	Artikel
Sprache:	eng
Schlagworte:	Characterization and Evaluation of Materials Chemistry and Materials Science Composite materials Computer simulation Curing Design optimization Epoxy resins Fiber reinforced polymers Finite element analysis Finite element method Glass fiber reinforced plastics Glass substrates Glass-epoxy composites Heat resistance Manufacturing Material properties Materials Science Mechanical analysis Mechanical tests Optical and Electronic Materials Packaging Parameters Product reliability Residual stress Semiconductors Simulation Simulation models Solders Temperature Thermal expansion Thermal simulation Thermomechanical analysis Warpage
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