Effects of curing condition and solder mask on substrate warpage: an experimental and simulation study
The warpage of the package substrate mainly originates from the material property and size variations of individual components, especially when multiple components are involved. To maintain the substrate warpage within acceptable limits, it’s crucial to fine-tune component parameters carefully, choo...
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| Veröffentlicht in: | Journal of materials science. Materials in electronics 2024-09, Vol.35 (26), p.1734, Article 1734 |
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| container_title | Journal of materials science. Materials in electronics |
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| creator | Fan, Guowei Hu, Zengming Xu, Jie Tang, Junqi Liu, Dashun Fang, Zeming Luo, Li Liu, Qianfa Lu, Dong Xue, Ke Wang, Ke |
| description | The warpage of the package substrate mainly originates from the material property and size variations of individual components, especially when multiple components are involved. To maintain the substrate warpage within acceptable limits, it’s crucial to fine-tune component parameters carefully, choosing appropriate materials and processing conditions. The current study investigates the factors influencing substrate warpage and explores the methods to mitigate it with the assistance of finite element analysis. Glass fiber reinforced epoxy-based substrates were prepared under different curing temperatures, and characterized by thermo-mechanical analysis and mechanical testing. A finite element simulation model of the bare carrier board was developed using ABAQUS software. The results show that the curing temperature impacts the coefficient of thermal expansion (CTE), strength and modulus of the substrate. The differences in CTE and dimensional parameters among the component materials strongly influence substrate warpage. While the curing conditions affect bare carrier board warpage to some extent, the type and thickness of solder mask have more significant effects and warpage can be mitigated by properly choosing and applying solder masks. |
| doi_str_mv | 10.1007/s10854-024-13499-z |
| format | Article |
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To maintain the substrate warpage within acceptable limits, it’s crucial to fine-tune component parameters carefully, choosing appropriate materials and processing conditions. The current study investigates the factors influencing substrate warpage and explores the methods to mitigate it with the assistance of finite element analysis. Glass fiber reinforced epoxy-based substrates were prepared under different curing temperatures, and characterized by thermo-mechanical analysis and mechanical testing. A finite element simulation model of the bare carrier board was developed using ABAQUS software. The results show that the curing temperature impacts the coefficient of thermal expansion (CTE), strength and modulus of the substrate. The differences in CTE and dimensional parameters among the component materials strongly influence substrate warpage. While the curing conditions affect bare carrier board warpage to some extent, the type and thickness of solder mask have more significant effects and warpage can be mitigated by properly choosing and applying solder masks.</description><identifier>ISSN: 0957-4522</identifier><identifier>EISSN: 1573-482X</identifier><identifier>DOI: 10.1007/s10854-024-13499-z</identifier><language>eng</language><publisher>New York: Springer US</publisher><subject>Characterization and Evaluation of Materials ; Chemistry and Materials Science ; Composite materials ; Computer simulation ; Curing ; Design optimization ; Epoxy resins ; Fiber reinforced polymers ; Finite element analysis ; Finite element method ; Glass fiber reinforced plastics ; Glass substrates ; Glass-epoxy composites ; Heat resistance ; Manufacturing ; Material properties ; Materials Science ; Mechanical analysis ; Mechanical tests ; Optical and Electronic Materials ; Packaging ; Parameters ; Product reliability ; Residual stress ; Semiconductors ; Simulation ; Simulation models ; Solders ; Temperature ; Thermal expansion ; Thermal simulation ; Thermomechanical analysis ; Warpage</subject><ispartof>Journal of materials science. Materials in electronics, 2024-09, Vol.35 (26), p.1734, Article 1734</ispartof><rights>The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature 2024. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c200t-f054d4be7550d73834794fc15cdf0c89cdf1145528f0e7e9e3d5c991b64f41933</cites><orcidid>0000-0001-8221-3488</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s10854-024-13499-z$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s10854-024-13499-z$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,780,784,27924,27925,41488,42557,51319</link.rule.ids></links><search><creatorcontrib>Fan, Guowei</creatorcontrib><creatorcontrib>Hu, Zengming</creatorcontrib><creatorcontrib>Xu, Jie</creatorcontrib><creatorcontrib>Tang, Junqi</creatorcontrib><creatorcontrib>Liu, Dashun</creatorcontrib><creatorcontrib>Fang, Zeming</creatorcontrib><creatorcontrib>Luo, Li</creatorcontrib><creatorcontrib>Liu, Qianfa</creatorcontrib><creatorcontrib>Lu, Dong</creatorcontrib><creatorcontrib>Xue, Ke</creatorcontrib><creatorcontrib>Wang, Ke</creatorcontrib><title>Effects of curing condition and solder mask on substrate warpage: an experimental and simulation study</title><title>Journal of materials science. Materials in electronics</title><addtitle>J Mater Sci: Mater Electron</addtitle><description>The warpage of the package substrate mainly originates from the material property and size variations of individual components, especially when multiple components are involved. To maintain the substrate warpage within acceptable limits, it’s crucial to fine-tune component parameters carefully, choosing appropriate materials and processing conditions. The current study investigates the factors influencing substrate warpage and explores the methods to mitigate it with the assistance of finite element analysis. Glass fiber reinforced epoxy-based substrates were prepared under different curing temperatures, and characterized by thermo-mechanical analysis and mechanical testing. A finite element simulation model of the bare carrier board was developed using ABAQUS software. The results show that the curing temperature impacts the coefficient of thermal expansion (CTE), strength and modulus of the substrate. The differences in CTE and dimensional parameters among the component materials strongly influence substrate warpage. While the curing conditions affect bare carrier board warpage to some extent, the type and thickness of solder mask have more significant effects and warpage can be mitigated by properly choosing and applying solder masks.</description><subject>Characterization and Evaluation of Materials</subject><subject>Chemistry and Materials Science</subject><subject>Composite materials</subject><subject>Computer simulation</subject><subject>Curing</subject><subject>Design optimization</subject><subject>Epoxy resins</subject><subject>Fiber reinforced polymers</subject><subject>Finite element analysis</subject><subject>Finite element method</subject><subject>Glass fiber reinforced plastics</subject><subject>Glass substrates</subject><subject>Glass-epoxy composites</subject><subject>Heat resistance</subject><subject>Manufacturing</subject><subject>Material properties</subject><subject>Materials Science</subject><subject>Mechanical analysis</subject><subject>Mechanical tests</subject><subject>Optical and Electronic Materials</subject><subject>Packaging</subject><subject>Parameters</subject><subject>Product reliability</subject><subject>Residual stress</subject><subject>Semiconductors</subject><subject>Simulation</subject><subject>Simulation models</subject><subject>Solders</subject><subject>Temperature</subject><subject>Thermal expansion</subject><subject>Thermal simulation</subject><subject>Thermomechanical analysis</subject><subject>Warpage</subject><issn>0957-4522</issn><issn>1573-482X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2024</creationdate><recordtype>article</recordtype><recordid>eNp9kMtKAzEUhoMoWKsv4CrgevTk1pm4k1IvUHCj4C6kuZSp05kxyaDt0xs7gjtXBw7_95_Dh9AlgWsCUN5EApXgBVBeEMalLPZHaEJEyQpe0bdjNAEpyoILSk_RWYwbAJhxVk2QX3jvTIq489gMoW7X2HStrVPdtVi3FseusS7grY7vOK_isIop6OTwpw69XrvbnMLuq3eh3ro26Wak6u3Q6ENJTIPdnaMTr5voLn7nFL3eL17mj8Xy-eFpfrcsDAVIhQfBLV-5UgiwJasYLyX3hghjPZhK5kEIF4JWHlzppGNWGCnJasY9J5KxKboae_vQfQwuJrXphtDmk4oREEJIyWlO0TFlQhdjcF71-XsddoqA-vGpRp8q-1QHn2qfITZCsf_R5MJf9T_UN_TxekQ</recordid><startdate>20240901</startdate><enddate>20240901</enddate><creator>Fan, Guowei</creator><creator>Hu, Zengming</creator><creator>Xu, Jie</creator><creator>Tang, Junqi</creator><creator>Liu, Dashun</creator><creator>Fang, Zeming</creator><creator>Luo, Li</creator><creator>Liu, Qianfa</creator><creator>Lu, Dong</creator><creator>Xue, Ke</creator><creator>Wang, Ke</creator><general>Springer US</general><general>Springer Nature B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>F28</scope><scope>FR3</scope><scope>JG9</scope><scope>L7M</scope><orcidid>https://orcid.org/0000-0001-8221-3488</orcidid></search><sort><creationdate>20240901</creationdate><title>Effects of curing condition and solder mask on substrate warpage: an experimental and simulation study</title><author>Fan, Guowei ; 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Materials in electronics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Fan, Guowei</au><au>Hu, Zengming</au><au>Xu, Jie</au><au>Tang, Junqi</au><au>Liu, Dashun</au><au>Fang, Zeming</au><au>Luo, Li</au><au>Liu, Qianfa</au><au>Lu, Dong</au><au>Xue, Ke</au><au>Wang, Ke</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Effects of curing condition and solder mask on substrate warpage: an experimental and simulation study</atitle><jtitle>Journal of materials science. 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| subjects | Characterization and Evaluation of Materials Chemistry and Materials Science Composite materials Computer simulation Curing Design optimization Epoxy resins Fiber reinforced polymers Finite element analysis Finite element method Glass fiber reinforced plastics Glass substrates Glass-epoxy composites Heat resistance Manufacturing Material properties Materials Science Mechanical analysis Mechanical tests Optical and Electronic Materials Packaging Parameters Product reliability Residual stress Semiconductors Simulation Simulation models Solders Temperature Thermal expansion Thermal simulation Thermomechanical analysis Warpage |
| title | Effects of curing condition and solder mask on substrate warpage: an experimental and simulation study |
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