Advancements in Biodegradable Printed Circuit Boards: Review of Material Properties, Fabrication Methods, Applications and Challenges

As electronic waste poses environmental challenges, exploring eco-friendly alternatives becomes imperative. In this review, the introduction reveals the disposal problem of existing printed circuit boards (PCBs) and the potential impacts of implementing biodegradable PCBs towards the United Nations...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:International journal of precision engineering and manufacturing 2024, Vol.25 (9), p.1925-1954
Hauptverfasser: Soon, Chin Fhong, Yee, See Khee, Nordin, Anis Nurashikin, Rahim, Rosminazuin Ab, Ma, Nyuk Ling, Hamed, Intan Sue Liana Abd, Tee, Kian Sek, Azmi, Nur Hanisah, Sunar, Norshuhaila Mohamed, Heng, Chris
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page 1954
container_issue 9
container_start_page 1925
container_title International journal of precision engineering and manufacturing
container_volume 25
creator Soon, Chin Fhong
Yee, See Khee
Nordin, Anis Nurashikin
Rahim, Rosminazuin Ab
Ma, Nyuk Ling
Hamed, Intan Sue Liana Abd
Tee, Kian Sek
Azmi, Nur Hanisah
Sunar, Norshuhaila Mohamed
Heng, Chris
description As electronic waste poses environmental challenges, exploring eco-friendly alternatives becomes imperative. In this review, the introduction reveals the disposal problem of existing printed circuit boards (PCBs) and the potential impacts of implementing biodegradable PCBs towards the United Nations Sustainable Development Goals. Various biodegradable materials, including polylactic acid, cellulose/cellulose acetate, silk proteins, gelatin, polyvinyl alcohol, mycelium, and wood, were evaluated for their properties and suitability in PCB manufacturing. Each material is scrutinised for its suitability in creating environmentally friendly circuit boards. The study meticulously analyses these biodegradable PCBs' electrical, mechanical, thermal and decomposition properties, providing insights into their performance under various conditions. The article also explores different fabrication methods and their advantages and limitations for manufacturing biodegradable PCBs. Solvent and non-solvent based decomposition of the biodegradable PCBs were revealed. The research outcome on a balance between hygroscopic property and degradability of biodegradable PCBs is revealed. The narrative extends to encompass the challenges and issues associated with the Design-for-Manufacturing processes and life cycle assessment of biodegradable PCBs, shedding light on potential hurdles and areas for improvement. The article concludes with a forward-looking perspective on the future of biodegradable printed circuit boards, environmentally friendly fire-retardants, a proposal for alternative standards for biodegradable PCBs, and their increasing role in sustainable electronics.
doi_str_mv 10.1007/s12541-024-01027-2
format Article
fullrecord <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_journals_3098773618</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>3098773618</sourcerecordid><originalsourceid>FETCH-LOGICAL-c270t-e06953e2b9d0c7ac8371be54bed6b7fec9f46fb7533434f722f5d2841a14fc3f3</originalsourceid><addsrcrecordid>eNp9kM1KxDAUhYsoOKgv4Crg1mr-2rTuZgb_QFFE1yFNbmYinaYmGcUH8L2NzoA7V_dy-M653FMUxwSfEYzFeSS04qTElJeYYCpKulNMKMZVyWtMd_NOGS9F1bL94ihG12FGaM2qpp4UX1PzrgYNKxhSRG5AM-cNLIIyqusBPQY3JDBo7oJeu4RmXgUTL9ATvDv4QN6ie5UgONVn1I8QkoN4iq5UF5xWyfkB3UNaepPF6Tj2WzEiNeTQpep7GBYQD4s9q_oIR9t5ULxcXT7Pb8q7h-vb-fSu1FTgVAKu24oB7VqDtVC6YYJ0UPEOTN0JC7q1vLadqBjjjFtBqa0MbThRhFvNLDsoTja5Y_Bva4hJvvp1GPJJyXDbCMFq0mSKbigdfIwBrByDW6nwKQmWP43LTeMyNy5_G5c0m9jGFDOcfwp_0f-4vgEG14U5</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>3098773618</pqid></control><display><type>article</type><title>Advancements in Biodegradable Printed Circuit Boards: Review of Material Properties, Fabrication Methods, Applications and Challenges</title><source>Springer Nature - Complete Springer Journals</source><creator>Soon, Chin Fhong ; Yee, See Khee ; Nordin, Anis Nurashikin ; Rahim, Rosminazuin Ab ; Ma, Nyuk Ling ; Hamed, Intan Sue Liana Abd ; Tee, Kian Sek ; Azmi, Nur Hanisah ; Sunar, Norshuhaila Mohamed ; Heng, Chris</creator><creatorcontrib>Soon, Chin Fhong ; Yee, See Khee ; Nordin, Anis Nurashikin ; Rahim, Rosminazuin Ab ; Ma, Nyuk Ling ; Hamed, Intan Sue Liana Abd ; Tee, Kian Sek ; Azmi, Nur Hanisah ; Sunar, Norshuhaila Mohamed ; Heng, Chris</creatorcontrib><description>As electronic waste poses environmental challenges, exploring eco-friendly alternatives becomes imperative. In this review, the introduction reveals the disposal problem of existing printed circuit boards (PCBs) and the potential impacts of implementing biodegradable PCBs towards the United Nations Sustainable Development Goals. Various biodegradable materials, including polylactic acid, cellulose/cellulose acetate, silk proteins, gelatin, polyvinyl alcohol, mycelium, and wood, were evaluated for their properties and suitability in PCB manufacturing. Each material is scrutinised for its suitability in creating environmentally friendly circuit boards. The study meticulously analyses these biodegradable PCBs' electrical, mechanical, thermal and decomposition properties, providing insights into their performance under various conditions. The article also explores different fabrication methods and their advantages and limitations for manufacturing biodegradable PCBs. Solvent and non-solvent based decomposition of the biodegradable PCBs were revealed. The research outcome on a balance between hygroscopic property and degradability of biodegradable PCBs is revealed. The narrative extends to encompass the challenges and issues associated with the Design-for-Manufacturing processes and life cycle assessment of biodegradable PCBs, shedding light on potential hurdles and areas for improvement. The article concludes with a forward-looking perspective on the future of biodegradable printed circuit boards, environmentally friendly fire-retardants, a proposal for alternative standards for biodegradable PCBs, and their increasing role in sustainable electronics.</description><identifier>ISSN: 2234-7593</identifier><identifier>EISSN: 2005-4602</identifier><identifier>DOI: 10.1007/s12541-024-01027-2</identifier><language>eng</language><publisher>Seoul: Korean Society for Precision Engineering</publisher><subject>Cellulose acetate ; Circuit boards ; Decomposition ; Design for manufacturability ; Electronic waste ; Engineering ; Gelatin ; Industrial and Production Engineering ; Life cycle assessment ; Manufacturing ; Material properties ; Materials Science ; Polylactic acid ; Polyvinyl alcohol ; Printed circuit boards ; Printed circuits ; Retardants ; Review ; Solvents ; Sustainable development</subject><ispartof>International journal of precision engineering and manufacturing, 2024, Vol.25 (9), p.1925-1954</ispartof><rights>The Author(s), under exclusive licence to Korean Society for Precision Engineering 2024. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c270t-e06953e2b9d0c7ac8371be54bed6b7fec9f46fb7533434f722f5d2841a14fc3f3</cites><orcidid>0000-0002-4972-5729</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s12541-024-01027-2$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s12541-024-01027-2$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,778,782,27911,27912,41475,42544,51306</link.rule.ids></links><search><creatorcontrib>Soon, Chin Fhong</creatorcontrib><creatorcontrib>Yee, See Khee</creatorcontrib><creatorcontrib>Nordin, Anis Nurashikin</creatorcontrib><creatorcontrib>Rahim, Rosminazuin Ab</creatorcontrib><creatorcontrib>Ma, Nyuk Ling</creatorcontrib><creatorcontrib>Hamed, Intan Sue Liana Abd</creatorcontrib><creatorcontrib>Tee, Kian Sek</creatorcontrib><creatorcontrib>Azmi, Nur Hanisah</creatorcontrib><creatorcontrib>Sunar, Norshuhaila Mohamed</creatorcontrib><creatorcontrib>Heng, Chris</creatorcontrib><title>Advancements in Biodegradable Printed Circuit Boards: Review of Material Properties, Fabrication Methods, Applications and Challenges</title><title>International journal of precision engineering and manufacturing</title><addtitle>Int. J. Precis. Eng. Manuf</addtitle><description>As electronic waste poses environmental challenges, exploring eco-friendly alternatives becomes imperative. In this review, the introduction reveals the disposal problem of existing printed circuit boards (PCBs) and the potential impacts of implementing biodegradable PCBs towards the United Nations Sustainable Development Goals. Various biodegradable materials, including polylactic acid, cellulose/cellulose acetate, silk proteins, gelatin, polyvinyl alcohol, mycelium, and wood, were evaluated for their properties and suitability in PCB manufacturing. Each material is scrutinised for its suitability in creating environmentally friendly circuit boards. The study meticulously analyses these biodegradable PCBs' electrical, mechanical, thermal and decomposition properties, providing insights into their performance under various conditions. The article also explores different fabrication methods and their advantages and limitations for manufacturing biodegradable PCBs. Solvent and non-solvent based decomposition of the biodegradable PCBs were revealed. The research outcome on a balance between hygroscopic property and degradability of biodegradable PCBs is revealed. The narrative extends to encompass the challenges and issues associated with the Design-for-Manufacturing processes and life cycle assessment of biodegradable PCBs, shedding light on potential hurdles and areas for improvement. The article concludes with a forward-looking perspective on the future of biodegradable printed circuit boards, environmentally friendly fire-retardants, a proposal for alternative standards for biodegradable PCBs, and their increasing role in sustainable electronics.</description><subject>Cellulose acetate</subject><subject>Circuit boards</subject><subject>Decomposition</subject><subject>Design for manufacturability</subject><subject>Electronic waste</subject><subject>Engineering</subject><subject>Gelatin</subject><subject>Industrial and Production Engineering</subject><subject>Life cycle assessment</subject><subject>Manufacturing</subject><subject>Material properties</subject><subject>Materials Science</subject><subject>Polylactic acid</subject><subject>Polyvinyl alcohol</subject><subject>Printed circuit boards</subject><subject>Printed circuits</subject><subject>Retardants</subject><subject>Review</subject><subject>Solvents</subject><subject>Sustainable development</subject><issn>2234-7593</issn><issn>2005-4602</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2024</creationdate><recordtype>article</recordtype><recordid>eNp9kM1KxDAUhYsoOKgv4Crg1mr-2rTuZgb_QFFE1yFNbmYinaYmGcUH8L2NzoA7V_dy-M653FMUxwSfEYzFeSS04qTElJeYYCpKulNMKMZVyWtMd_NOGS9F1bL94ihG12FGaM2qpp4UX1PzrgYNKxhSRG5AM-cNLIIyqusBPQY3JDBo7oJeu4RmXgUTL9ATvDv4QN6ie5UgONVn1I8QkoN4iq5UF5xWyfkB3UNaepPF6Tj2WzEiNeTQpep7GBYQD4s9q_oIR9t5ULxcXT7Pb8q7h-vb-fSu1FTgVAKu24oB7VqDtVC6YYJ0UPEOTN0JC7q1vLadqBjjjFtBqa0MbThRhFvNLDsoTja5Y_Bva4hJvvp1GPJJyXDbCMFq0mSKbigdfIwBrByDW6nwKQmWP43LTeMyNy5_G5c0m9jGFDOcfwp_0f-4vgEG14U5</recordid><startdate>2024</startdate><enddate>2024</enddate><creator>Soon, Chin Fhong</creator><creator>Yee, See Khee</creator><creator>Nordin, Anis Nurashikin</creator><creator>Rahim, Rosminazuin Ab</creator><creator>Ma, Nyuk Ling</creator><creator>Hamed, Intan Sue Liana Abd</creator><creator>Tee, Kian Sek</creator><creator>Azmi, Nur Hanisah</creator><creator>Sunar, Norshuhaila Mohamed</creator><creator>Heng, Chris</creator><general>Korean Society for Precision Engineering</general><general>Springer Nature B.V</general><scope>AAYXX</scope><scope>CITATION</scope><orcidid>https://orcid.org/0000-0002-4972-5729</orcidid></search><sort><creationdate>2024</creationdate><title>Advancements in Biodegradable Printed Circuit Boards: Review of Material Properties, Fabrication Methods, Applications and Challenges</title><author>Soon, Chin Fhong ; Yee, See Khee ; Nordin, Anis Nurashikin ; Rahim, Rosminazuin Ab ; Ma, Nyuk Ling ; Hamed, Intan Sue Liana Abd ; Tee, Kian Sek ; Azmi, Nur Hanisah ; Sunar, Norshuhaila Mohamed ; Heng, Chris</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c270t-e06953e2b9d0c7ac8371be54bed6b7fec9f46fb7533434f722f5d2841a14fc3f3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2024</creationdate><topic>Cellulose acetate</topic><topic>Circuit boards</topic><topic>Decomposition</topic><topic>Design for manufacturability</topic><topic>Electronic waste</topic><topic>Engineering</topic><topic>Gelatin</topic><topic>Industrial and Production Engineering</topic><topic>Life cycle assessment</topic><topic>Manufacturing</topic><topic>Material properties</topic><topic>Materials Science</topic><topic>Polylactic acid</topic><topic>Polyvinyl alcohol</topic><topic>Printed circuit boards</topic><topic>Printed circuits</topic><topic>Retardants</topic><topic>Review</topic><topic>Solvents</topic><topic>Sustainable development</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Soon, Chin Fhong</creatorcontrib><creatorcontrib>Yee, See Khee</creatorcontrib><creatorcontrib>Nordin, Anis Nurashikin</creatorcontrib><creatorcontrib>Rahim, Rosminazuin Ab</creatorcontrib><creatorcontrib>Ma, Nyuk Ling</creatorcontrib><creatorcontrib>Hamed, Intan Sue Liana Abd</creatorcontrib><creatorcontrib>Tee, Kian Sek</creatorcontrib><creatorcontrib>Azmi, Nur Hanisah</creatorcontrib><creatorcontrib>Sunar, Norshuhaila Mohamed</creatorcontrib><creatorcontrib>Heng, Chris</creatorcontrib><collection>CrossRef</collection><jtitle>International journal of precision engineering and manufacturing</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Soon, Chin Fhong</au><au>Yee, See Khee</au><au>Nordin, Anis Nurashikin</au><au>Rahim, Rosminazuin Ab</au><au>Ma, Nyuk Ling</au><au>Hamed, Intan Sue Liana Abd</au><au>Tee, Kian Sek</au><au>Azmi, Nur Hanisah</au><au>Sunar, Norshuhaila Mohamed</au><au>Heng, Chris</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Advancements in Biodegradable Printed Circuit Boards: Review of Material Properties, Fabrication Methods, Applications and Challenges</atitle><jtitle>International journal of precision engineering and manufacturing</jtitle><stitle>Int. J. Precis. Eng. Manuf</stitle><date>2024</date><risdate>2024</risdate><volume>25</volume><issue>9</issue><spage>1925</spage><epage>1954</epage><pages>1925-1954</pages><issn>2234-7593</issn><eissn>2005-4602</eissn><abstract>As electronic waste poses environmental challenges, exploring eco-friendly alternatives becomes imperative. In this review, the introduction reveals the disposal problem of existing printed circuit boards (PCBs) and the potential impacts of implementing biodegradable PCBs towards the United Nations Sustainable Development Goals. Various biodegradable materials, including polylactic acid, cellulose/cellulose acetate, silk proteins, gelatin, polyvinyl alcohol, mycelium, and wood, were evaluated for their properties and suitability in PCB manufacturing. Each material is scrutinised for its suitability in creating environmentally friendly circuit boards. The study meticulously analyses these biodegradable PCBs' electrical, mechanical, thermal and decomposition properties, providing insights into their performance under various conditions. The article also explores different fabrication methods and their advantages and limitations for manufacturing biodegradable PCBs. Solvent and non-solvent based decomposition of the biodegradable PCBs were revealed. The research outcome on a balance between hygroscopic property and degradability of biodegradable PCBs is revealed. The narrative extends to encompass the challenges and issues associated with the Design-for-Manufacturing processes and life cycle assessment of biodegradable PCBs, shedding light on potential hurdles and areas for improvement. The article concludes with a forward-looking perspective on the future of biodegradable printed circuit boards, environmentally friendly fire-retardants, a proposal for alternative standards for biodegradable PCBs, and their increasing role in sustainable electronics.</abstract><cop>Seoul</cop><pub>Korean Society for Precision Engineering</pub><doi>10.1007/s12541-024-01027-2</doi><tpages>30</tpages><orcidid>https://orcid.org/0000-0002-4972-5729</orcidid></addata></record>
fulltext fulltext
identifier ISSN: 2234-7593
ispartof International journal of precision engineering and manufacturing, 2024, Vol.25 (9), p.1925-1954
issn 2234-7593
2005-4602
language eng
recordid cdi_proquest_journals_3098773618
source Springer Nature - Complete Springer Journals
subjects Cellulose acetate
Circuit boards
Decomposition
Design for manufacturability
Electronic waste
Engineering
Gelatin
Industrial and Production Engineering
Life cycle assessment
Manufacturing
Material properties
Materials Science
Polylactic acid
Polyvinyl alcohol
Printed circuit boards
Printed circuits
Retardants
Review
Solvents
Sustainable development
title Advancements in Biodegradable Printed Circuit Boards: Review of Material Properties, Fabrication Methods, Applications and Challenges
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-15T15%3A53%3A25IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Advancements%20in%20Biodegradable%20Printed%20Circuit%20Boards:%20Review%20of%20Material%20Properties,%20Fabrication%20Methods,%20Applications%20and%20Challenges&rft.jtitle=International%20journal%20of%20precision%20engineering%20and%20manufacturing&rft.au=Soon,%20Chin%20Fhong&rft.date=2024&rft.volume=25&rft.issue=9&rft.spage=1925&rft.epage=1954&rft.pages=1925-1954&rft.issn=2234-7593&rft.eissn=2005-4602&rft_id=info:doi/10.1007/s12541-024-01027-2&rft_dat=%3Cproquest_cross%3E3098773618%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=3098773618&rft_id=info:pmid/&rfr_iscdi=true