Magnetic Field and Moisture Diffusivity Effects on Photo-Elasto-Thermodiffusion Waves in Excited Semiconductor Materials

In this article, a novel model was studied that explains the interaction between the equations governing the photo-thermoelasticity theory in the case of the presence of the diffusion of moisture of the semiconductor medium with the electromagnetic field. The photo-thermoelasticity theory is used to...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:SILICON 2024-09, Vol.16 (13-14), p.5301-5315
Hauptverfasser: Nassar, Tarek E. I., Raddadi, Merfat H., Lotfy, Khaled
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:In this article, a novel model was studied that explains the interaction between the equations governing the photo-thermoelasticity theory in the case of the presence of the diffusion of moisture of the semiconductor medium with the electromagnetic field. The photo-thermoelasticity theory is used to investigate the photothermal excitation process for an elastic semiconductor medium in a one-dimensional deformation. This article discusses the effect of the magnetic field on conductive moisture diffusivity. The coupling interactions between magneto-thermo-elastic stresses and moisture diffusivity are investigated. According to some initial conditions, the governing equations are investigated using the Laplace transform technique to calculate the numerical solution of the key physical field contribution in the Laplace domain. The basic quantities for the process in the Laplace domain are calculated using all mechanical stresses, thermal conditions, and plasma boundary surface conditions. To obtain complete solutions in the time domain for the main problems, the numerical method approach is used to invert the Laplace transform. Some comparisons are made under the influence of different parameters to show the wave propagation of the main fields.
ISSN:1876-990X
1876-9918
DOI:10.1007/s12633-024-03042-4