Strategies for optimizing interfacial thermal resistance of thermally conductive hexagonal boron nitride/polymer composites: A review

With the continuous development of high‐end electronic information technologies such as 5G communications, thermal management is an urgent issue in the electronic and circuit industries due to the miniaturization, functionalization and integration. Recently, polymer‐based composites with the fillers...

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Veröffentlicht in:	Polymer composites 2024-08, Vol.45 (12), p.10587-10618
Hauptverfasser:	Jia, Pingping, An, Lulu, Yu, Lang, Pan, Yaokun, Fan, Huiqing, Qin, Luchang
Format:	Artikel
Sprache:	eng
Schlagworte:	Boron Boron nitride Composite materials composites Crystal defects Fillers Heat transfer hexagonal boron nitride Incompatibility Information management interfacial thermal resistance Phonons polymer Polymer matrix composites Polymers Thermal conductivity Thermal management Thermal resistance Thickness
Online-Zugang:	Volltext
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