A Comprehensive Design Method for Multichip Double-Sided Cooling Power Module With Multidimensional Self-and Mutual Inductances

The double-sided cooling (DSC) packaging configuration, distinguished by its low loop inductance and superior thermal performance, presents a promising solution for multichip silicon carbide (SiC) modules. Nevertheless, challenges persist in the design aspects of current balancing and thermal coupli...

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Veröffentlicht in:	IEEE transactions on power electronics 2024-08, Vol.39 (8), p.9526-9539
Hauptverfasser:	Wang, Jianing, Yu, Shaolin, Zhou, Weinan
Format:	Artikel
Sprache:	eng
Schlagworte:	Bridges Cooling Couplings Design optimization Design techniques Double-sided cooling (DSC) Electronic packaging Field effect transistors Inductance Metal oxide semiconductors Modules MOSFET MOSFETs Multichip modules multichip sic module multiphysics field Packaging design Parasitics (electronics) pressure-assisted silver sintering Process parameters self-and-mutual inductances Semiconductor devices Silicon carbide Silver Temperature Temperature gradients Thermal coupling
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