Three‐dimensional skeleton assembled by nickel foam/silicon carbide as filler in polyurethane composites with high thermal conductivity and electrical insulation

High thermally conductive polymer composites have garnered significant attention due to their exceptional performance, given the ever‐decreasing size of electronic devices and the rise in power densities. Herein, a new three‐dimensional (3D) thermal conductivity network structure has been successful...

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Veröffentlicht in:	Polymer engineering and science 2024-06, Vol.64 (6), p.2530-2540
Hauptverfasser:	Zhu, Jincheng, Ren, Mengqing, Chen, Ming, Wu, Lili
Format:	Artikel
Sprache:	eng
Schlagworte:	Analysis Composition Conducting polymers Electric properties Electrical conductivity Electrical insulation Electrical resistivity Electronic devices Fillers Heat conductivity Heat transfer Mechanical properties Metal foams Nickel Nickel compounds Nickel products Polymer matrix composites Polymers polyurethane Polyurethane foam Polyurethanes Semiconductors Silicon carbide Synergistic effect thermal conduction network Thermal conductivity thermal management material Thermal properties Thermodynamic properties
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