Effect of Cu interlayer with different thickness on microstructure and properties of Al2O3/Kovar joints brazed with Cu–Ti/Cu/BNi-2 composite filler
In this study, a Cu–Ti/Cu/BNi-2 composite filler was employed to braze Al 2 O 3 ceramics and Kovar alloy, aiming to prevent excessive reaction between active Ti and Kovar alloy. The investigation focused on the effects of varying Cu interlayer thickness on microstructure and mechanical properties. T...
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| Veröffentlicht in: | Journal of materials science. Materials in electronics 2024-03, Vol.35 (9), p.660, Article 660 |
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| container_title | Journal of materials science. Materials in electronics |
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| creator | Li, Anhang Wang, Tao Chen, Xiaoguang Guo, Weibing Xue, Haitao Chen, Cuixin |
| description | In this study, a Cu–Ti/Cu/BNi-2 composite filler was employed to braze Al
2
O
3
ceramics and Kovar alloy, aiming to prevent excessive reaction between active Ti and Kovar alloy. The investigation focused on the effects of varying Cu interlayer thickness on microstructure and mechanical properties. The results show that the typical microstructure of the joint is Al
2
O
3
/Ti–O/Cu
3
Ti
3
O /Ti-rich + Cu(s, s)/Ni
3
Ti + TiB
2
/CrB + Ni(s, s)/Kovar alloy. Notably, when the thickness of the Cu layer was 100 μm, the joint strength significantly increased to 128 ± 7 MPa, which represented a remarkable 50.5% improvement compared to the Cu–Ti filler. This enhancement in joint strength can be attributed to the addition of Cu/BNi-2, effectively preventing direct contact between Ti and Kovar alloy, thereby inhibiting their reaction and reducing the formation of brittle Fe-Ti phases within the joint. At the same time, Cu foil also contributed to alleviating the residual stress of the joint. However, as the Cu foil thickness increased, the fracture of the Cu
3
Ti
3
O reaction layer worsened, resulting in weaker bonding with ceramics and a decrease in joint strength. The study also discussed the microstructure evolution of the Al
2
O
3
/Cu–Ti/Cu/BNi-2/Kovar joint. This study provided an idea for the application of Cu-based filler. |
| doi_str_mv | 10.1007/s10854-024-12437-3 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_journals_3013906905</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>3013906905</sourcerecordid><originalsourceid>FETCH-LOGICAL-c270t-78006563e80b610683784ac4d1b653fa899fafed887d1ce924afd7b52059a1383</originalsourceid><addsrcrecordid>eNp9kE1uFDEQhS0EUobABbKyxNqMf9vuZdIKJEpENkFiZ3m6y8RDT3tiu0FhxR1QLpiTxEMjsWNVi3rvq3oPoRNG3zNK9TozapQklEvCuBSaiBdoxZQWRBr-5SVa0VZpIhXnR-h1zltKaSOFWaHHc--hLzh63M04TAXS6B4g4R-h3OEh1G2CqeByF_pvE-SM44R3oU8xlzT3ZU6A3TTgfYp7SCVAPqBOR34j1lfxu0t4Gys1401yP2FYsN389Ov3bVh38_rsUyAc93G3jzkUwD6MI6Q36JV3Y4a3f-cx-vzh_La7INc3Hy-702vSc00L0abGUI0AQzcNo40R2kjXy4FtGiW8M23rnYfBGD2wHlounR_0RnGqWseEEcfo3cKt79_PkIvdxjlN9aQVlImWNi1VVcUX1SF1TuDtPoWdSw-WUXuo3y7121q__VO_FdUkFlOu4ukrpH_o_7ieAdEjijM</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>3013906905</pqid></control><display><type>article</type><title>Effect of Cu interlayer with different thickness on microstructure and properties of Al2O3/Kovar joints brazed with Cu–Ti/Cu/BNi-2 composite filler</title><source>SpringerLink Journals - AutoHoldings</source><creator>Li, Anhang ; Wang, Tao ; Chen, Xiaoguang ; Guo, Weibing ; Xue, Haitao ; Chen, Cuixin</creator><creatorcontrib>Li, Anhang ; Wang, Tao ; Chen, Xiaoguang ; Guo, Weibing ; Xue, Haitao ; Chen, Cuixin</creatorcontrib><description>In this study, a Cu–Ti/Cu/BNi-2 composite filler was employed to braze Al
2
O
3
ceramics and Kovar alloy, aiming to prevent excessive reaction between active Ti and Kovar alloy. The investigation focused on the effects of varying Cu interlayer thickness on microstructure and mechanical properties. The results show that the typical microstructure of the joint is Al
2
O
3
/Ti–O/Cu
3
Ti
3
O /Ti-rich + Cu(s, s)/Ni
3
Ti + TiB
2
/CrB + Ni(s, s)/Kovar alloy. Notably, when the thickness of the Cu layer was 100 μm, the joint strength significantly increased to 128 ± 7 MPa, which represented a remarkable 50.5% improvement compared to the Cu–Ti filler. This enhancement in joint strength can be attributed to the addition of Cu/BNi-2, effectively preventing direct contact between Ti and Kovar alloy, thereby inhibiting their reaction and reducing the formation of brittle Fe-Ti phases within the joint. At the same time, Cu foil also contributed to alleviating the residual stress of the joint. However, as the Cu foil thickness increased, the fracture of the Cu
3
Ti
3
O reaction layer worsened, resulting in weaker bonding with ceramics and a decrease in joint strength. The study also discussed the microstructure evolution of the Al
2
O
3
/Cu–Ti/Cu/BNi-2/Kovar joint. This study provided an idea for the application of Cu-based filler.</description><identifier>ISSN: 0957-4522</identifier><identifier>EISSN: 1573-482X</identifier><identifier>DOI: 10.1007/s10854-024-12437-3</identifier><language>eng</language><publisher>New York: Springer US</publisher><subject>Alloys ; Alumina-Titanium ; Aluminum oxide ; Bonded joints ; Bonding strength ; Brazed joints ; Ceramics ; Characterization and Evaluation of Materials ; Chemistry and Materials Science ; Copper ; Decomposition ; Fillers ; Interlayers ; Intermetallic compounds ; Kovar (trademark) ; Materials Science ; Mechanical properties ; Metal foils ; Metals ; Microscopy ; Microstructure ; Morphology ; Optical and Electronic Materials ; Oxidation ; Residual stress ; Screen printing ; Shear strength ; Shear tests ; Thickness ; Titanium</subject><ispartof>Journal of materials science. Materials in electronics, 2024-03, Vol.35 (9), p.660, Article 660</ispartof><rights>The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature 2024. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c270t-78006563e80b610683784ac4d1b653fa899fafed887d1ce924afd7b52059a1383</cites><orcidid>0000-0002-1634-7557</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s10854-024-12437-3$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s10854-024-12437-3$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,780,784,27924,27925,41488,42557,51319</link.rule.ids></links><search><creatorcontrib>Li, Anhang</creatorcontrib><creatorcontrib>Wang, Tao</creatorcontrib><creatorcontrib>Chen, Xiaoguang</creatorcontrib><creatorcontrib>Guo, Weibing</creatorcontrib><creatorcontrib>Xue, Haitao</creatorcontrib><creatorcontrib>Chen, Cuixin</creatorcontrib><title>Effect of Cu interlayer with different thickness on microstructure and properties of Al2O3/Kovar joints brazed with Cu–Ti/Cu/BNi-2 composite filler</title><title>Journal of materials science. Materials in electronics</title><addtitle>J Mater Sci: Mater Electron</addtitle><description>In this study, a Cu–Ti/Cu/BNi-2 composite filler was employed to braze Al
2
O
3
ceramics and Kovar alloy, aiming to prevent excessive reaction between active Ti and Kovar alloy. The investigation focused on the effects of varying Cu interlayer thickness on microstructure and mechanical properties. The results show that the typical microstructure of the joint is Al
2
O
3
/Ti–O/Cu
3
Ti
3
O /Ti-rich + Cu(s, s)/Ni
3
Ti + TiB
2
/CrB + Ni(s, s)/Kovar alloy. Notably, when the thickness of the Cu layer was 100 μm, the joint strength significantly increased to 128 ± 7 MPa, which represented a remarkable 50.5% improvement compared to the Cu–Ti filler. This enhancement in joint strength can be attributed to the addition of Cu/BNi-2, effectively preventing direct contact between Ti and Kovar alloy, thereby inhibiting their reaction and reducing the formation of brittle Fe-Ti phases within the joint. At the same time, Cu foil also contributed to alleviating the residual stress of the joint. However, as the Cu foil thickness increased, the fracture of the Cu
3
Ti
3
O reaction layer worsened, resulting in weaker bonding with ceramics and a decrease in joint strength. The study also discussed the microstructure evolution of the Al
2
O
3
/Cu–Ti/Cu/BNi-2/Kovar joint. This study provided an idea for the application of Cu-based filler.</description><subject>Alloys</subject><subject>Alumina-Titanium</subject><subject>Aluminum oxide</subject><subject>Bonded joints</subject><subject>Bonding strength</subject><subject>Brazed joints</subject><subject>Ceramics</subject><subject>Characterization and Evaluation of Materials</subject><subject>Chemistry and Materials Science</subject><subject>Copper</subject><subject>Decomposition</subject><subject>Fillers</subject><subject>Interlayers</subject><subject>Intermetallic compounds</subject><subject>Kovar (trademark)</subject><subject>Materials Science</subject><subject>Mechanical properties</subject><subject>Metal foils</subject><subject>Metals</subject><subject>Microscopy</subject><subject>Microstructure</subject><subject>Morphology</subject><subject>Optical and Electronic Materials</subject><subject>Oxidation</subject><subject>Residual stress</subject><subject>Screen printing</subject><subject>Shear strength</subject><subject>Shear tests</subject><subject>Thickness</subject><subject>Titanium</subject><issn>0957-4522</issn><issn>1573-482X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2024</creationdate><recordtype>article</recordtype><recordid>eNp9kE1uFDEQhS0EUobABbKyxNqMf9vuZdIKJEpENkFiZ3m6y8RDT3tiu0FhxR1QLpiTxEMjsWNVi3rvq3oPoRNG3zNK9TozapQklEvCuBSaiBdoxZQWRBr-5SVa0VZpIhXnR-h1zltKaSOFWaHHc--hLzh63M04TAXS6B4g4R-h3OEh1G2CqeByF_pvE-SM44R3oU8xlzT3ZU6A3TTgfYp7SCVAPqBOR34j1lfxu0t4Gys1401yP2FYsN389Ov3bVh38_rsUyAc93G3jzkUwD6MI6Q36JV3Y4a3f-cx-vzh_La7INc3Hy-702vSc00L0abGUI0AQzcNo40R2kjXy4FtGiW8M23rnYfBGD2wHlounR_0RnGqWseEEcfo3cKt79_PkIvdxjlN9aQVlImWNi1VVcUX1SF1TuDtPoWdSw-WUXuo3y7121q__VO_FdUkFlOu4ukrpH_o_7ieAdEjijM</recordid><startdate>20240301</startdate><enddate>20240301</enddate><creator>Li, Anhang</creator><creator>Wang, Tao</creator><creator>Chen, Xiaoguang</creator><creator>Guo, Weibing</creator><creator>Xue, Haitao</creator><creator>Chen, Cuixin</creator><general>Springer US</general><general>Springer Nature B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>F28</scope><scope>FR3</scope><scope>JG9</scope><scope>L7M</scope><orcidid>https://orcid.org/0000-0002-1634-7557</orcidid></search><sort><creationdate>20240301</creationdate><title>Effect of Cu interlayer with different thickness on microstructure and properties of Al2O3/Kovar joints brazed with Cu–Ti/Cu/BNi-2 composite filler</title><author>Li, Anhang ; Wang, Tao ; Chen, Xiaoguang ; Guo, Weibing ; Xue, Haitao ; Chen, Cuixin</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c270t-78006563e80b610683784ac4d1b653fa899fafed887d1ce924afd7b52059a1383</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2024</creationdate><topic>Alloys</topic><topic>Alumina-Titanium</topic><topic>Aluminum oxide</topic><topic>Bonded joints</topic><topic>Bonding strength</topic><topic>Brazed joints</topic><topic>Ceramics</topic><topic>Characterization and Evaluation of Materials</topic><topic>Chemistry and Materials Science</topic><topic>Copper</topic><topic>Decomposition</topic><topic>Fillers</topic><topic>Interlayers</topic><topic>Intermetallic compounds</topic><topic>Kovar (trademark)</topic><topic>Materials Science</topic><topic>Mechanical properties</topic><topic>Metal foils</topic><topic>Metals</topic><topic>Microscopy</topic><topic>Microstructure</topic><topic>Morphology</topic><topic>Optical and Electronic Materials</topic><topic>Oxidation</topic><topic>Residual stress</topic><topic>Screen printing</topic><topic>Shear strength</topic><topic>Shear tests</topic><topic>Thickness</topic><topic>Titanium</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Li, Anhang</creatorcontrib><creatorcontrib>Wang, Tao</creatorcontrib><creatorcontrib>Chen, Xiaoguang</creatorcontrib><creatorcontrib>Guo, Weibing</creatorcontrib><creatorcontrib>Xue, Haitao</creatorcontrib><creatorcontrib>Chen, Cuixin</creatorcontrib><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Journal of materials science. Materials in electronics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Li, Anhang</au><au>Wang, Tao</au><au>Chen, Xiaoguang</au><au>Guo, Weibing</au><au>Xue, Haitao</au><au>Chen, Cuixin</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Effect of Cu interlayer with different thickness on microstructure and properties of Al2O3/Kovar joints brazed with Cu–Ti/Cu/BNi-2 composite filler</atitle><jtitle>Journal of materials science. Materials in electronics</jtitle><stitle>J Mater Sci: Mater Electron</stitle><date>2024-03-01</date><risdate>2024</risdate><volume>35</volume><issue>9</issue><spage>660</spage><pages>660-</pages><artnum>660</artnum><issn>0957-4522</issn><eissn>1573-482X</eissn><abstract>In this study, a Cu–Ti/Cu/BNi-2 composite filler was employed to braze Al
2
O
3
ceramics and Kovar alloy, aiming to prevent excessive reaction between active Ti and Kovar alloy. The investigation focused on the effects of varying Cu interlayer thickness on microstructure and mechanical properties. The results show that the typical microstructure of the joint is Al
2
O
3
/Ti–O/Cu
3
Ti
3
O /Ti-rich + Cu(s, s)/Ni
3
Ti + TiB
2
/CrB + Ni(s, s)/Kovar alloy. Notably, when the thickness of the Cu layer was 100 μm, the joint strength significantly increased to 128 ± 7 MPa, which represented a remarkable 50.5% improvement compared to the Cu–Ti filler. This enhancement in joint strength can be attributed to the addition of Cu/BNi-2, effectively preventing direct contact between Ti and Kovar alloy, thereby inhibiting their reaction and reducing the formation of brittle Fe-Ti phases within the joint. At the same time, Cu foil also contributed to alleviating the residual stress of the joint. However, as the Cu foil thickness increased, the fracture of the Cu
3
Ti
3
O reaction layer worsened, resulting in weaker bonding with ceramics and a decrease in joint strength. The study also discussed the microstructure evolution of the Al
2
O
3
/Cu–Ti/Cu/BNi-2/Kovar joint. This study provided an idea for the application of Cu-based filler.</abstract><cop>New York</cop><pub>Springer US</pub><doi>10.1007/s10854-024-12437-3</doi><orcidid>https://orcid.org/0000-0002-1634-7557</orcidid></addata></record> |
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| ispartof | Journal of materials science. Materials in electronics, 2024-03, Vol.35 (9), p.660, Article 660 |
| issn | 0957-4522 1573-482X |
| language | eng |
| recordid | cdi_proquest_journals_3013906905 |
| source | SpringerLink Journals - AutoHoldings |
| subjects | Alloys Alumina-Titanium Aluminum oxide Bonded joints Bonding strength Brazed joints Ceramics Characterization and Evaluation of Materials Chemistry and Materials Science Copper Decomposition Fillers Interlayers Intermetallic compounds Kovar (trademark) Materials Science Mechanical properties Metal foils Metals Microscopy Microstructure Morphology Optical and Electronic Materials Oxidation Residual stress Screen printing Shear strength Shear tests Thickness Titanium |
| title | Effect of Cu interlayer with different thickness on microstructure and properties of Al2O3/Kovar joints brazed with Cu–Ti/Cu/BNi-2 composite filler |
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