Transient topology optimization for efficient design of actively cooled microvascular materials

Microvascular materials containing internal microchannels are able to achieve multi-functionality by flowing different fluids through vasculature. Active cooling is one application to protect structural components and devices from thermal overload, which is critical to modern technology including el...

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Veröffentlicht in:Structural and multidisciplinary optimization 2024-04, Vol.67 (4), p.60, Article 60
Hauptverfasser: Gorman, Jonathan, Pejman, Reza, Kumar, Sandeep R., Patrick, Jason F., Najafi, Ahmad R.
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container_issue 4
container_start_page 60
container_title Structural and multidisciplinary optimization
container_volume 67
creator Gorman, Jonathan
Pejman, Reza
Kumar, Sandeep R.
Patrick, Jason F.
Najafi, Ahmad R.
description Microvascular materials containing internal microchannels are able to achieve multi-functionality by flowing different fluids through vasculature. Active cooling is one application to protect structural components and devices from thermal overload, which is critical to modern technology including electric vehicle battery packaging and solar panels on space probes. Creating thermally efficient vascular network designs requires state-of-the-art computational tools. Prior optimization schemes have only considered steady-state cooling, rendering a knowledge gap for time-varying heat transfer behavior. In this study, a transient topology optimization framework is presented to maximize the active-cooling performance and mitigate computational cost. Here, we optimize the channel layout so that coolant flowing within the vascular network can remove heat quickly and also provide a lower steady-state temperature. An objective function for this new transient formulation is proposed that minimizes the area beneath the average temperature versus time curve to simultaneously reduce the temperature and cooling time. The thermal response of the system is obtained through a transient Geometric Reduced Order Finite Element Model (GRO-FEM). The model is verified via a conjugate heat transfer simulation in commercial software and validated by an active-cooling experiment conducted on a 3D-printed microvascular metal. A transient sensitivity analysis is derived to provide the optimizer with analytical gradients of the objective function for further computational efficiency. Example problems are solved demonstrating the method’s ability to enhance cooling performance along with a comparison of transient versus steady-state optimization results. In this comparison, both the steady-state and transient frameworks delivered different designs with similar performance characteristics for the problems considered in this study. This latest computational framework provides a new thermal regulation toolbox for microvascular material designers.
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subjects Computational efficiency
Computational Mathematics and Numerical Analysis
Computing costs
Cooling
Design
Design optimization
Electric vehicles
Engineering
Engineering Design
Finite element method
Heat
Heat transfer
Mathematical models
Microchannels
Optimization
Reduced order models
Research Paper
Sensitivity analysis
Software
Space probes
Steady state
Theoretical and Applied Mechanics
Thermal response
Three dimensional printing
Topology optimization
title Transient topology optimization for efficient design of actively cooled microvascular materials
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