Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications

In this paper, a novel through mold via (TMV)-embedded fan-out wafer-level package (FOWLP) technology was demonstrated to manufacture the well-designed Antenna in Package (AiP) with ultrathin thickness (0.04 λ0). Double-sided redistribution layers (RDLs) were employed to build the patch antenna, whi...

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Veröffentlicht in:	Electronics (Basel) 2024-03, Vol.13 (5), p.839
Hauptverfasser:	Yin, Yuhang, Xia, Chenhui, Liu, Shuli, Zhang, Zhimo, Chen, Chen, Wang, Gang, Wang, Chenqian, Wu, Yafei
Format:	Artikel
Sprache:	eng
Schlagworte:	5G mobile communication Antennas Antennas (Electronics) Bandwidths Design Design and construction Efficiency Electronic packaging Embedded systems Fanout Frequencies High gain Integrated circuit fabrication Interconnect Methods Millimeter wave communication systems Millimeter waves Moisture absorption Patch antennas Radiation Silicon Technology Wireless communications
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