Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications
In this paper, a novel through mold via (TMV)-embedded fan-out wafer-level package (FOWLP) technology was demonstrated to manufacture the well-designed Antenna in Package (AiP) with ultrathin thickness (0.04 λ0). Double-sided redistribution layers (RDLs) were employed to build the patch antenna, whi...
Gespeichert in:
| Veröffentlicht in: | Electronics (Basel) 2024-03, Vol.13 (5), p.839 |
|---|---|
| Hauptverfasser: | , , , , , , , |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | 5 |
| container_start_page | 839 |
| container_title | Electronics (Basel) |
| container_volume | 13 |
| creator | Yin, Yuhang Xia, Chenhui Liu, Shuli Zhang, Zhimo Chen, Chen Wang, Gang Wang, Chenqian Wu, Yafei |
| description | In this paper, a novel through mold via (TMV)-embedded fan-out wafer-level package (FOWLP) technology was demonstrated to manufacture the well-designed Antenna in Package (AiP) with ultrathin thickness (0.04 λ0). Double-sided redistribution layers (RDLs) were employed to build the patch antenna, while a TMV interposer was used to connect the front and back RDLs. By optimizing the AiP’s parameters, the patch antenna can achieve a wide impedance bandwidth of 17.8% from 24.2 to 28.5 GHz, which can cover the 5G frequency bands. Compared with previous works, the proposed AiP has significant benefits in terms of its ultralow profile, easy processing, and high gain. Hence, the TMV-embedded FOWLP should be a promising technology for fifth generation (5G) millimeter wave (mm-Wave) applications. |
| doi_str_mv | 10.3390/electronics13050839 |
| format | Article |
| fullrecord | <record><control><sourceid>gale_proqu</sourceid><recordid>TN_cdi_proquest_journals_2955513777</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><galeid>A786435793</galeid><sourcerecordid>A786435793</sourcerecordid><originalsourceid>FETCH-LOGICAL-c311t-c14f5b780b92f0e94a6a728d448b6fab6e5d7b4f8a18af578c9ffce2239191253</originalsourceid><addsrcrecordid>eNptUMtOwzAQtBBIVNAv4GKJc4ofcWwfQ9UWpKL20NJj5Dh2cUnsYqdI_D1B5cCB3cM-NDOrHQDuMJpQKtGDaY3uY_BOJ0wRQ4LKCzAiiMtMEkku__TXYJzSAQ0hMRUUjcBm2_ZR9W_Ow9L3xnuVOZ-tlX5XewMfVTINDB5uXl6zWVebphnm-Wq3XEMbImQL2HXZTn0aWB6PrdOqd8GnW3BlVZvM-LfegO18tpk-ZcvV4nlaLjNNMe4zjXPLai5QLYlFRuaqUJyIJs9FXVhVF4Y1vM6tUFgoy7jQ0lptCKESS0wYvQH3Z91jDB8nk_rqEE7RDycrIhljmHLOB9TkjNqr1lTO2zB8rIdsTOd08Ma6YV9yUeSUcUkHAj0TdAwpRWOrY3Sdil8VRtWP5dU_ltNvW6N1cA</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2955513777</pqid></control><display><type>article</type><title>Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications</title><source>MDPI - Multidisciplinary Digital Publishing Institute</source><source>Elektronische Zeitschriftenbibliothek - Frei zugängliche E-Journals</source><creator>Yin, Yuhang ; Xia, Chenhui ; Liu, Shuli ; Zhang, Zhimo ; Chen, Chen ; Wang, Gang ; Wang, Chenqian ; Wu, Yafei</creator><creatorcontrib>Yin, Yuhang ; Xia, Chenhui ; Liu, Shuli ; Zhang, Zhimo ; Chen, Chen ; Wang, Gang ; Wang, Chenqian ; Wu, Yafei</creatorcontrib><description>In this paper, a novel through mold via (TMV)-embedded fan-out wafer-level package (FOWLP) technology was demonstrated to manufacture the well-designed Antenna in Package (AiP) with ultrathin thickness (0.04 λ0). Double-sided redistribution layers (RDLs) were employed to build the patch antenna, while a TMV interposer was used to connect the front and back RDLs. By optimizing the AiP’s parameters, the patch antenna can achieve a wide impedance bandwidth of 17.8% from 24.2 to 28.5 GHz, which can cover the 5G frequency bands. Compared with previous works, the proposed AiP has significant benefits in terms of its ultralow profile, easy processing, and high gain. Hence, the TMV-embedded FOWLP should be a promising technology for fifth generation (5G) millimeter wave (mm-Wave) applications.</description><identifier>ISSN: 2079-9292</identifier><identifier>EISSN: 2079-9292</identifier><identifier>DOI: 10.3390/electronics13050839</identifier><language>eng</language><publisher>Basel: MDPI AG</publisher><subject>5G mobile communication ; Antennas ; Antennas (Electronics) ; Bandwidths ; Design ; Design and construction ; Efficiency ; Electronic packaging ; Embedded systems ; Fanout ; Frequencies ; High gain ; Integrated circuit fabrication ; Interconnect ; Methods ; Millimeter wave communication systems ; Millimeter waves ; Moisture absorption ; Patch antennas ; Radiation ; Silicon ; Technology ; Wireless communications</subject><ispartof>Electronics (Basel), 2024-03, Vol.13 (5), p.839</ispartof><rights>COPYRIGHT 2024 MDPI AG</rights><rights>2024 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c311t-c14f5b780b92f0e94a6a728d448b6fab6e5d7b4f8a18af578c9ffce2239191253</cites><orcidid>0000-0003-4421-1734</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,776,780,27901,27902</link.rule.ids></links><search><creatorcontrib>Yin, Yuhang</creatorcontrib><creatorcontrib>Xia, Chenhui</creatorcontrib><creatorcontrib>Liu, Shuli</creatorcontrib><creatorcontrib>Zhang, Zhimo</creatorcontrib><creatorcontrib>Chen, Chen</creatorcontrib><creatorcontrib>Wang, Gang</creatorcontrib><creatorcontrib>Wang, Chenqian</creatorcontrib><creatorcontrib>Wu, Yafei</creatorcontrib><title>Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications</title><title>Electronics (Basel)</title><description>In this paper, a novel through mold via (TMV)-embedded fan-out wafer-level package (FOWLP) technology was demonstrated to manufacture the well-designed Antenna in Package (AiP) with ultrathin thickness (0.04 λ0). Double-sided redistribution layers (RDLs) were employed to build the patch antenna, while a TMV interposer was used to connect the front and back RDLs. By optimizing the AiP’s parameters, the patch antenna can achieve a wide impedance bandwidth of 17.8% from 24.2 to 28.5 GHz, which can cover the 5G frequency bands. Compared with previous works, the proposed AiP has significant benefits in terms of its ultralow profile, easy processing, and high gain. Hence, the TMV-embedded FOWLP should be a promising technology for fifth generation (5G) millimeter wave (mm-Wave) applications.</description><subject>5G mobile communication</subject><subject>Antennas</subject><subject>Antennas (Electronics)</subject><subject>Bandwidths</subject><subject>Design</subject><subject>Design and construction</subject><subject>Efficiency</subject><subject>Electronic packaging</subject><subject>Embedded systems</subject><subject>Fanout</subject><subject>Frequencies</subject><subject>High gain</subject><subject>Integrated circuit fabrication</subject><subject>Interconnect</subject><subject>Methods</subject><subject>Millimeter wave communication systems</subject><subject>Millimeter waves</subject><subject>Moisture absorption</subject><subject>Patch antennas</subject><subject>Radiation</subject><subject>Silicon</subject><subject>Technology</subject><subject>Wireless communications</subject><issn>2079-9292</issn><issn>2079-9292</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2024</creationdate><recordtype>article</recordtype><sourceid>BENPR</sourceid><recordid>eNptUMtOwzAQtBBIVNAv4GKJc4ofcWwfQ9UWpKL20NJj5Dh2cUnsYqdI_D1B5cCB3cM-NDOrHQDuMJpQKtGDaY3uY_BOJ0wRQ4LKCzAiiMtMEkku__TXYJzSAQ0hMRUUjcBm2_ZR9W_Ow9L3xnuVOZ-tlX5XewMfVTINDB5uXl6zWVebphnm-Wq3XEMbImQL2HXZTn0aWB6PrdOqd8GnW3BlVZvM-LfegO18tpk-ZcvV4nlaLjNNMe4zjXPLai5QLYlFRuaqUJyIJs9FXVhVF4Y1vM6tUFgoy7jQ0lptCKESS0wYvQH3Z91jDB8nk_rqEE7RDycrIhljmHLOB9TkjNqr1lTO2zB8rIdsTOd08Ma6YV9yUeSUcUkHAj0TdAwpRWOrY3Sdil8VRtWP5dU_ltNvW6N1cA</recordid><startdate>20240301</startdate><enddate>20240301</enddate><creator>Yin, Yuhang</creator><creator>Xia, Chenhui</creator><creator>Liu, Shuli</creator><creator>Zhang, Zhimo</creator><creator>Chen, Chen</creator><creator>Wang, Gang</creator><creator>Wang, Chenqian</creator><creator>Wu, Yafei</creator><general>MDPI AG</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>DWQXO</scope><scope>HCIFZ</scope><scope>L7M</scope><scope>P5Z</scope><scope>P62</scope><scope>PIMPY</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><orcidid>https://orcid.org/0000-0003-4421-1734</orcidid></search><sort><creationdate>20240301</creationdate><title>Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications</title><author>Yin, Yuhang ; Xia, Chenhui ; Liu, Shuli ; Zhang, Zhimo ; Chen, Chen ; Wang, Gang ; Wang, Chenqian ; Wu, Yafei</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c311t-c14f5b780b92f0e94a6a728d448b6fab6e5d7b4f8a18af578c9ffce2239191253</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2024</creationdate><topic>5G mobile communication</topic><topic>Antennas</topic><topic>Antennas (Electronics)</topic><topic>Bandwidths</topic><topic>Design</topic><topic>Design and construction</topic><topic>Efficiency</topic><topic>Electronic packaging</topic><topic>Embedded systems</topic><topic>Fanout</topic><topic>Frequencies</topic><topic>High gain</topic><topic>Integrated circuit fabrication</topic><topic>Interconnect</topic><topic>Methods</topic><topic>Millimeter wave communication systems</topic><topic>Millimeter waves</topic><topic>Moisture absorption</topic><topic>Patch antennas</topic><topic>Radiation</topic><topic>Silicon</topic><topic>Technology</topic><topic>Wireless communications</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Yin, Yuhang</creatorcontrib><creatorcontrib>Xia, Chenhui</creatorcontrib><creatorcontrib>Liu, Shuli</creatorcontrib><creatorcontrib>Zhang, Zhimo</creatorcontrib><creatorcontrib>Chen, Chen</creatorcontrib><creatorcontrib>Wang, Gang</creatorcontrib><creatorcontrib>Wang, Chenqian</creatorcontrib><creatorcontrib>Wu, Yafei</creatorcontrib><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest Central UK/Ireland</collection><collection>Advanced Technologies & Aerospace Collection</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Central Korea</collection><collection>SciTech Premium Collection</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Advanced Technologies & Aerospace Database</collection><collection>ProQuest Advanced Technologies & Aerospace Collection</collection><collection>Publicly Available Content Database</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><jtitle>Electronics (Basel)</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Yin, Yuhang</au><au>Xia, Chenhui</au><au>Liu, Shuli</au><au>Zhang, Zhimo</au><au>Chen, Chen</au><au>Wang, Gang</au><au>Wang, Chenqian</au><au>Wu, Yafei</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications</atitle><jtitle>Electronics (Basel)</jtitle><date>2024-03-01</date><risdate>2024</risdate><volume>13</volume><issue>5</issue><spage>839</spage><pages>839-</pages><issn>2079-9292</issn><eissn>2079-9292</eissn><abstract>In this paper, a novel through mold via (TMV)-embedded fan-out wafer-level package (FOWLP) technology was demonstrated to manufacture the well-designed Antenna in Package (AiP) with ultrathin thickness (0.04 λ0). Double-sided redistribution layers (RDLs) were employed to build the patch antenna, while a TMV interposer was used to connect the front and back RDLs. By optimizing the AiP’s parameters, the patch antenna can achieve a wide impedance bandwidth of 17.8% from 24.2 to 28.5 GHz, which can cover the 5G frequency bands. Compared with previous works, the proposed AiP has significant benefits in terms of its ultralow profile, easy processing, and high gain. Hence, the TMV-embedded FOWLP should be a promising technology for fifth generation (5G) millimeter wave (mm-Wave) applications.</abstract><cop>Basel</cop><pub>MDPI AG</pub><doi>10.3390/electronics13050839</doi><orcidid>https://orcid.org/0000-0003-4421-1734</orcidid><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 2079-9292 |
| ispartof | Electronics (Basel), 2024-03, Vol.13 (5), p.839 |
| issn | 2079-9292 2079-9292 |
| language | eng |
| recordid | cdi_proquest_journals_2955513777 |
| source | MDPI - Multidisciplinary Digital Publishing Institute; Elektronische Zeitschriftenbibliothek - Frei zugängliche E-Journals |
| subjects | 5G mobile communication Antennas Antennas (Electronics) Bandwidths Design Design and construction Efficiency Electronic packaging Embedded systems Fanout Frequencies High gain Integrated circuit fabrication Interconnect Methods Millimeter wave communication systems Millimeter waves Moisture absorption Patch antennas Radiation Silicon Technology Wireless communications |
| title | Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-10T01%3A47%3A43IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-gale_proqu&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Ultrathin%20Antenna-in-Package%20Based%20on%20TMV-Embedded%20FOWLP%20for%205G%20mm-Wave%20Applications&rft.jtitle=Electronics%20(Basel)&rft.au=Yin,%20Yuhang&rft.date=2024-03-01&rft.volume=13&rft.issue=5&rft.spage=839&rft.pages=839-&rft.issn=2079-9292&rft.eissn=2079-9292&rft_id=info:doi/10.3390/electronics13050839&rft_dat=%3Cgale_proqu%3EA786435793%3C/gale_proqu%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=2955513777&rft_id=info:pmid/&rft_galeid=A786435793&rfr_iscdi=true |