Corrosion behavior of lead-free SAC-type solder alloys in liquid media

New lead-free solders are developed for electronic assemblies as a replacement for traditional Pb-containing alloys. The main goal of this study was to investigate the corrosion resistance of ternary Sn-Ag-Cu (SAC) alloys in the air-saturated aqueous solutions of NaCl (including sea water) and conta...

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Veröffentlicht in:	Archives of Civil and Mechanical Engineering 2015-01, Vol.15 (1), p.206-213
Hauptverfasser:	Wierzbicka-Miernik, A., Guspiel, J., Zabdyr, L.
Format:	Artikel
Sprache:	eng
Schlagworte:	Aqueous solutions Chemical composition Civil Engineering Copper Copper base alloys Corrosion potential Corrosion products Corrosion rate Corrosion resistance Electronic assemblies Engineering Eutectic alloys Eutectic composition Lead free Mechanical Engineering Original Research Article Seawater Silver Solders Structural Materials Tin Tin base alloys
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