Design and modeling of film bulk acoustic resonator considering temperature compensation for 5G communication

The new generation of communication systems requires radio frequency (RF) filters with better performance indicators, and traditional RF filters can no longer satisfy the requirements of increasingly sophisticated wireless communication equipment. Piezoelectric Film bulk acoustic resonators (FBARs)...

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Veröffentlicht in:Analog integrated circuits and signal processing 2024-02, Vol.118 (2), p.219-230
Hauptverfasser: Wu, Xiushan, Xu, Lin, Shi, Ge, Zhou, Xiaowei, Cai, Jianping
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Xu, Lin
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Zhou, Xiaowei
Cai, Jianping
description The new generation of communication systems requires radio frequency (RF) filters with better performance indicators, and traditional RF filters can no longer satisfy the requirements of increasingly sophisticated wireless communication equipment. Piezoelectric Film bulk acoustic resonators (FBARs) have gradually become a focus of communication system research. In this study, the temperature effect was considered in the FBAR electrical model. SiO 2 with a positive temperature coefficient was placed under the bottom electrode to perform temperature compensation. COMSOL software was used to study the shape of the electrode of the FBAR unit, the irregular shape of the electrode could obtain a smoother resonant frequency curve, and the common cavity and back erosion structure of the FBAR unit were studied, to extract the corresponding dielectric loss and mechanical loss of the piezoelectric layer, and to optimize the one-dimensional electrical model further. The optimized electrical model was used to design an FBAR filter. The center frequency was 3.52 GHz, the bandwidth was 115 MHz, the insertion loss was 0.87 dB, the in-band ripple was 1.32 dB, the out-of-band rejection was better than − 40 dB, and the absolute value of temperature coefficient of frequency was 7.09 ppm/°C, basically achieving the expected performance, which can be applied to the design of RF filters in mobile phones and other wireless terminals where the temperature requirement is harsh, and provides a solution for frequency selection and control in the field of high frequency communication.
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fullrecord <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_journals_2930595284</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>2930595284</sourcerecordid><originalsourceid>FETCH-LOGICAL-c319t-989b96e1d940c21eb5196cfe5f244c70105f6aa865545e3187e94fb726cd71723</originalsourceid><addsrcrecordid>eNp9kE1LxDAQhoMouK7-AU8Bz9XJV9McxY9VWPCi55CmydK1TWrSHvz3dreCNw_DDC_vO8M8CF0TuCUA8i4T4BIKoGwuSqCQJ2hFhGQFUVKdohUoKgoCDM7RRc57AKCSwwr1jy63u4BNaHAfG9e1YYejx77telxP3Sc2Nk55bC1OLsdgxpiwjSG3jUsH7-j6wSUzTsnN-jyHbMY2Buxno9gctH4KrT2Kl-jMmy67q9--Rh_PT-8PL8X2bfP6cL8tLCNqLFSlalU60igOlhJXC6JK653wlHMrgYDwpTFVKQQXjpFKOsV9LWlpG0kkZWt0s-wdUvyaXB71Pk4pzCc1VQyEErTis4suLptizsl5PaS2N-lbE9AHrHrBqmes-ohVyznEllAeDv-79Lf6n9QPNDl7nw</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2930595284</pqid></control><display><type>article</type><title>Design and modeling of film bulk acoustic resonator considering temperature compensation for 5G communication</title><source>Springer Nature - Complete Springer Journals</source><creator>Wu, Xiushan ; Xu, Lin ; Shi, Ge ; Zhou, Xiaowei ; Cai, Jianping</creator><creatorcontrib>Wu, Xiushan ; Xu, Lin ; Shi, Ge ; Zhou, Xiaowei ; Cai, Jianping</creatorcontrib><description>The new generation of communication systems requires radio frequency (RF) filters with better performance indicators, and traditional RF filters can no longer satisfy the requirements of increasingly sophisticated wireless communication equipment. Piezoelectric Film bulk acoustic resonators (FBARs) have gradually become a focus of communication system research. In this study, the temperature effect was considered in the FBAR electrical model. SiO 2 with a positive temperature coefficient was placed under the bottom electrode to perform temperature compensation. COMSOL software was used to study the shape of the electrode of the FBAR unit, the irregular shape of the electrode could obtain a smoother resonant frequency curve, and the common cavity and back erosion structure of the FBAR unit were studied, to extract the corresponding dielectric loss and mechanical loss of the piezoelectric layer, and to optimize the one-dimensional electrical model further. The optimized electrical model was used to design an FBAR filter. The center frequency was 3.52 GHz, the bandwidth was 115 MHz, the insertion loss was 0.87 dB, the in-band ripple was 1.32 dB, the out-of-band rejection was better than − 40 dB, and the absolute value of temperature coefficient of frequency was 7.09 ppm/°C, basically achieving the expected performance, which can be applied to the design of RF filters in mobile phones and other wireless terminals where the temperature requirement is harsh, and provides a solution for frequency selection and control in the field of high frequency communication.</description><identifier>ISSN: 0925-1030</identifier><identifier>EISSN: 1573-1979</identifier><identifier>DOI: 10.1007/s10470-023-02210-7</identifier><language>eng</language><publisher>New York: Springer US</publisher><subject>Bulk acoustic wave devices ; Cell phones ; Circuits and Systems ; Communication ; Communications equipment ; Communications systems ; Compensation ; Design ; Dielectric loss ; Electrical Engineering ; Electrodes ; Engineering ; Filters ; Insertion loss ; Piezoelectric films ; Positive temperature coefficient ; Radio frequency ; Resonant frequencies ; Resonators ; Signal,Image and Speech Processing ; Silicon dioxide ; Temperature compensation ; Temperature effects ; Wireless communications</subject><ispartof>Analog integrated circuits and signal processing, 2024-02, Vol.118 (2), p.219-230</ispartof><rights>The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c319t-989b96e1d940c21eb5196cfe5f244c70105f6aa865545e3187e94fb726cd71723</citedby><cites>FETCH-LOGICAL-c319t-989b96e1d940c21eb5196cfe5f244c70105f6aa865545e3187e94fb726cd71723</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s10470-023-02210-7$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s10470-023-02210-7$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,776,780,27901,27902,41464,42533,51294</link.rule.ids></links><search><creatorcontrib>Wu, Xiushan</creatorcontrib><creatorcontrib>Xu, Lin</creatorcontrib><creatorcontrib>Shi, Ge</creatorcontrib><creatorcontrib>Zhou, Xiaowei</creatorcontrib><creatorcontrib>Cai, Jianping</creatorcontrib><title>Design and modeling of film bulk acoustic resonator considering temperature compensation for 5G communication</title><title>Analog integrated circuits and signal processing</title><addtitle>Analog Integr Circ Sig Process</addtitle><description>The new generation of communication systems requires radio frequency (RF) filters with better performance indicators, and traditional RF filters can no longer satisfy the requirements of increasingly sophisticated wireless communication equipment. Piezoelectric Film bulk acoustic resonators (FBARs) have gradually become a focus of communication system research. In this study, the temperature effect was considered in the FBAR electrical model. SiO 2 with a positive temperature coefficient was placed under the bottom electrode to perform temperature compensation. COMSOL software was used to study the shape of the electrode of the FBAR unit, the irregular shape of the electrode could obtain a smoother resonant frequency curve, and the common cavity and back erosion structure of the FBAR unit were studied, to extract the corresponding dielectric loss and mechanical loss of the piezoelectric layer, and to optimize the one-dimensional electrical model further. The optimized electrical model was used to design an FBAR filter. The center frequency was 3.52 GHz, the bandwidth was 115 MHz, the insertion loss was 0.87 dB, the in-band ripple was 1.32 dB, the out-of-band rejection was better than − 40 dB, and the absolute value of temperature coefficient of frequency was 7.09 ppm/°C, basically achieving the expected performance, which can be applied to the design of RF filters in mobile phones and other wireless terminals where the temperature requirement is harsh, and provides a solution for frequency selection and control in the field of high frequency communication.</description><subject>Bulk acoustic wave devices</subject><subject>Cell phones</subject><subject>Circuits and Systems</subject><subject>Communication</subject><subject>Communications equipment</subject><subject>Communications systems</subject><subject>Compensation</subject><subject>Design</subject><subject>Dielectric loss</subject><subject>Electrical Engineering</subject><subject>Electrodes</subject><subject>Engineering</subject><subject>Filters</subject><subject>Insertion loss</subject><subject>Piezoelectric films</subject><subject>Positive temperature coefficient</subject><subject>Radio frequency</subject><subject>Resonant frequencies</subject><subject>Resonators</subject><subject>Signal,Image and Speech Processing</subject><subject>Silicon dioxide</subject><subject>Temperature compensation</subject><subject>Temperature effects</subject><subject>Wireless communications</subject><issn>0925-1030</issn><issn>1573-1979</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2024</creationdate><recordtype>article</recordtype><recordid>eNp9kE1LxDAQhoMouK7-AU8Bz9XJV9McxY9VWPCi55CmydK1TWrSHvz3dreCNw_DDC_vO8M8CF0TuCUA8i4T4BIKoGwuSqCQJ2hFhGQFUVKdohUoKgoCDM7RRc57AKCSwwr1jy63u4BNaHAfG9e1YYejx77telxP3Sc2Nk55bC1OLsdgxpiwjSG3jUsH7-j6wSUzTsnN-jyHbMY2Buxno9gctH4KrT2Kl-jMmy67q9--Rh_PT-8PL8X2bfP6cL8tLCNqLFSlalU60igOlhJXC6JK653wlHMrgYDwpTFVKQQXjpFKOsV9LWlpG0kkZWt0s-wdUvyaXB71Pk4pzCc1VQyEErTis4suLptizsl5PaS2N-lbE9AHrHrBqmes-ohVyznEllAeDv-79Lf6n9QPNDl7nw</recordid><startdate>20240201</startdate><enddate>20240201</enddate><creator>Wu, Xiushan</creator><creator>Xu, Lin</creator><creator>Shi, Ge</creator><creator>Zhou, Xiaowei</creator><creator>Cai, Jianping</creator><general>Springer US</general><general>Springer Nature B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7TG</scope><scope>8FD</scope><scope>KL.</scope><scope>L7M</scope></search><sort><creationdate>20240201</creationdate><title>Design and modeling of film bulk acoustic resonator considering temperature compensation for 5G communication</title><author>Wu, Xiushan ; Xu, Lin ; Shi, Ge ; Zhou, Xiaowei ; Cai, Jianping</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c319t-989b96e1d940c21eb5196cfe5f244c70105f6aa865545e3187e94fb726cd71723</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2024</creationdate><topic>Bulk acoustic wave devices</topic><topic>Cell phones</topic><topic>Circuits and Systems</topic><topic>Communication</topic><topic>Communications equipment</topic><topic>Communications systems</topic><topic>Compensation</topic><topic>Design</topic><topic>Dielectric loss</topic><topic>Electrical Engineering</topic><topic>Electrodes</topic><topic>Engineering</topic><topic>Filters</topic><topic>Insertion loss</topic><topic>Piezoelectric films</topic><topic>Positive temperature coefficient</topic><topic>Radio frequency</topic><topic>Resonant frequencies</topic><topic>Resonators</topic><topic>Signal,Image and Speech Processing</topic><topic>Silicon dioxide</topic><topic>Temperature compensation</topic><topic>Temperature effects</topic><topic>Wireless communications</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Wu, Xiushan</creatorcontrib><creatorcontrib>Xu, Lin</creatorcontrib><creatorcontrib>Shi, Ge</creatorcontrib><creatorcontrib>Zhou, Xiaowei</creatorcontrib><creatorcontrib>Cai, Jianping</creatorcontrib><collection>CrossRef</collection><collection>Electronics &amp; Communications Abstracts</collection><collection>Meteorological &amp; Geoastrophysical Abstracts</collection><collection>Technology Research Database</collection><collection>Meteorological &amp; Geoastrophysical Abstracts - Academic</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Analog integrated circuits and signal processing</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Wu, Xiushan</au><au>Xu, Lin</au><au>Shi, Ge</au><au>Zhou, Xiaowei</au><au>Cai, Jianping</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Design and modeling of film bulk acoustic resonator considering temperature compensation for 5G communication</atitle><jtitle>Analog integrated circuits and signal processing</jtitle><stitle>Analog Integr Circ Sig Process</stitle><date>2024-02-01</date><risdate>2024</risdate><volume>118</volume><issue>2</issue><spage>219</spage><epage>230</epage><pages>219-230</pages><issn>0925-1030</issn><eissn>1573-1979</eissn><abstract>The new generation of communication systems requires radio frequency (RF) filters with better performance indicators, and traditional RF filters can no longer satisfy the requirements of increasingly sophisticated wireless communication equipment. Piezoelectric Film bulk acoustic resonators (FBARs) have gradually become a focus of communication system research. In this study, the temperature effect was considered in the FBAR electrical model. SiO 2 with a positive temperature coefficient was placed under the bottom electrode to perform temperature compensation. COMSOL software was used to study the shape of the electrode of the FBAR unit, the irregular shape of the electrode could obtain a smoother resonant frequency curve, and the common cavity and back erosion structure of the FBAR unit were studied, to extract the corresponding dielectric loss and mechanical loss of the piezoelectric layer, and to optimize the one-dimensional electrical model further. The optimized electrical model was used to design an FBAR filter. The center frequency was 3.52 GHz, the bandwidth was 115 MHz, the insertion loss was 0.87 dB, the in-band ripple was 1.32 dB, the out-of-band rejection was better than − 40 dB, and the absolute value of temperature coefficient of frequency was 7.09 ppm/°C, basically achieving the expected performance, which can be applied to the design of RF filters in mobile phones and other wireless terminals where the temperature requirement is harsh, and provides a solution for frequency selection and control in the field of high frequency communication.</abstract><cop>New York</cop><pub>Springer US</pub><doi>10.1007/s10470-023-02210-7</doi><tpages>12</tpages></addata></record>
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subjects Bulk acoustic wave devices
Cell phones
Circuits and Systems
Communication
Communications equipment
Communications systems
Compensation
Design
Dielectric loss
Electrical Engineering
Electrodes
Engineering
Filters
Insertion loss
Piezoelectric films
Positive temperature coefficient
Radio frequency
Resonant frequencies
Resonators
Signal,Image and Speech Processing
Silicon dioxide
Temperature compensation
Temperature effects
Wireless communications
title Design and modeling of film bulk acoustic resonator considering temperature compensation for 5G communication
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-21T17%3A29%3A02IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Design%20and%20modeling%20of%20film%20bulk%20acoustic%20resonator%20considering%20temperature%20compensation%20for%205G%20communication&rft.jtitle=Analog%20integrated%20circuits%20and%20signal%20processing&rft.au=Wu,%20Xiushan&rft.date=2024-02-01&rft.volume=118&rft.issue=2&rft.spage=219&rft.epage=230&rft.pages=219-230&rft.issn=0925-1030&rft.eissn=1573-1979&rft_id=info:doi/10.1007/s10470-023-02210-7&rft_dat=%3Cproquest_cross%3E2930595284%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=2930595284&rft_id=info:pmid/&rfr_iscdi=true