Investigation of the Dependence of the Silicon Needle Shape on the KOH Solution Concentration during Anisotropic Wet Etching

The most common and available method used to fabricate needles from single-crystal silicon wafers is anisotropic wet etching. The dependence of the shape and sizes of the needles on the etching solution concentration when using a mask of one type (round, square, or some other shape) has not been ful...

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Veröffentlicht in:	Semiconductors (Woodbury, N.Y.) N.Y.), 2023, Vol.57 (1), p.52-57
Hauptverfasser:	Novak, A. V., Sokolov, A. M., Rumyantsev, A. V., Novak, V. R.
Format:	Artikel
Sprache:	eng
Schlagworte:	Anisotropy Aqueous solutions Aspect ratio Crystal defects Etching Height Magnetic Materials Magnetism Physics Physics and Astronomy Pyramids Silicon Silicon wafers Single crystals Technological Processes and Routes
Online-Zugang:	Volltext
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