Influence of Pad Design on Assembly Reliability of Surface Mounted Devices

During the reflow process in surface mount technology (SMT), a passive component misplaced on a pad would be self-aligned or tombstoned due to a restoring force which is driven by surface tension of molten solder. In this study, the influence of pad design on assembly defect rate was experimentally...

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Veröffentlicht in:	International journal of precision engineering and manufacturing-green technology 2023-09, Vol.10 (5), p.1235-1248
Hauptverfasser:	Park, Dong-Woon, Yu, Myeong-Hyeon, Kim, Do-Hyung, Jang, Dong-Min, Jang, Jin-Woo, Lee, Seung-Yeong, Kim, Hak-Sung
Format:	Artikel
Sprache:	eng
Schlagworte:	Assembly Computational fluid dynamics Contact angle Defects Design Design defects Design of experiments Design parameters Fluid dynamics Hydrodynamics Lead free Manufacturers Passive components Roads & highways Self alignment Semiconductors Solders Surface tension Surface-mounted devices
Online-Zugang:	Volltext
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