Influence of Pad Design on Assembly Reliability of Surface Mounted Devices
During the reflow process in surface mount technology (SMT), a passive component misplaced on a pad would be self-aligned or tombstoned due to a restoring force which is driven by surface tension of molten solder. In this study, the influence of pad design on assembly defect rate was experimentally...
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| Veröffentlicht in: | International journal of precision engineering and manufacturing-green technology 2023-09, Vol.10 (5), p.1235-1248 |
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| container_title | International journal of precision engineering and manufacturing-green technology |
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| creator | Park, Dong-Woon Yu, Myeong-Hyeon Kim, Do-Hyung Jang, Dong-Min Jang, Jin-Woo Lee, Seung-Yeong Kim, Hak-Sung |
| description | During the reflow process in surface mount technology (SMT), a passive component misplaced on a pad would be self-aligned or tombstoned due to a restoring force which is driven by surface tension of molten solder. In this study, the influence of pad design on assembly defect rate was experimentally and analytically investigated using computational fluid dynamics (CFD) simulation. The assembly defect rate of the SMT was experimentally derived from the design of experiments (DOE) considering the pad design and the misplacement of the passive component. The restoring force and moment acting on the chip resistor were calculated using CFD simulation considering the fluidic forces of the molten lead-free solder paste during the reflow process according to the amount of the misplacement and the pad design parameters. |
| doi_str_mv | 10.1007/s40684-022-00466-4 |
| format | Article |
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In this study, the influence of pad design on assembly defect rate was experimentally and analytically investigated using computational fluid dynamics (CFD) simulation. The assembly defect rate of the SMT was experimentally derived from the design of experiments (DOE) considering the pad design and the misplacement of the passive component. The restoring force and moment acting on the chip resistor were calculated using CFD simulation considering the fluidic forces of the molten lead-free solder paste during the reflow process according to the amount of the misplacement and the pad design parameters.</description><identifier>ISSN: 2288-6206</identifier><identifier>EISSN: 2198-0810</identifier><identifier>DOI: 10.1007/s40684-022-00466-4</identifier><language>eng</language><publisher>Heidelberg: Springer Nature B.V</publisher><subject>Assembly ; Computational fluid dynamics ; Contact angle ; Defects ; Design ; Design defects ; Design of experiments ; Design parameters ; Fluid dynamics ; Hydrodynamics ; Lead free ; Manufacturers ; Passive components ; Roads & highways ; Self alignment ; Semiconductors ; Solders ; Surface tension ; Surface-mounted devices</subject><ispartof>International journal of precision engineering and manufacturing-green technology, 2023-09, Vol.10 (5), p.1235-1248</ispartof><rights>The Author(s), under exclusive licence to Korean Society for Precision Engineering 2022. 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| subjects | Assembly Computational fluid dynamics Contact angle Defects Design Design defects Design of experiments Design parameters Fluid dynamics Hydrodynamics Lead free Manufacturers Passive components Roads & highways Self alignment Semiconductors Solders Surface tension Surface-mounted devices |
| title | Influence of Pad Design on Assembly Reliability of Surface Mounted Devices |
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