Temperature effects on electrical resistivity of selected ceramics for high‐temperature packaging applications

We report the results of the characterization of the electrical resistivity of selected ceramic materials, namely aluminum nitride (AlN), silicon nitride (Si₃N₄), beryllium oxide (BeO), yttrium oxide (Y₂O₃), and non‐ceramic silicon dioxide (SiO2), which are candidates for packaging silicon carbide (...

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Veröffentlicht in:	Journal of the American Ceramic Society 2024-04, Vol.107 (4), p.2295-2303
Hauptverfasser:	Deucher, Thomas M., Okojie, Robert S.
Format:	Artikel
Sprache:	eng
Schlagworte:	Aluminum nitride Beryllium oxide ceramic Ceramics Electrical properties Electrical resistivity high temperature insulating leakage current Packaging Sensors Silicon carbide Silicon dioxide Silicon nitride Surface resistivity Temperature effects Thermal conductivity Thermal expansion Yttrium oxide
Online-Zugang:	Volltext
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