Development of near hermetic silicon/glass cavities for packaging of integrated lithium micro batteries
A technology was developed for fabrication of very thin, chip-sized lithium secondary micro batteries. With help of wafer level processing the batteries can be directly integrated into silicon chips or MEMS devices. The batteries were packaged in 200 μm deep cavities of the silicon wafer and encapsu...
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| Veröffentlicht in: | Microsystem technologies 2010-07, Vol.16 (7), p.1119-1129 |
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| creator | Marquardt, Krystan Hahn, Robert Blechert, Martin Lehmann, Marco Töpper, Michael Wilke, Martin Semionyk, Peter von Suchodoletz, Maria Reichl, Herbert |
| description | A technology was developed for fabrication of very thin, chip-sized lithium secondary micro batteries. With help of wafer level processing the batteries can be directly integrated into silicon chips or MEMS devices. The batteries were packaged in 200 μm deep cavities of the silicon wafer and encapsulated with a glass substrate. Battery demonstrators were realized with 7 and 12 mm square and round foot prints. Near hermetic packaging was accomplished with the help of a UV curable epoxy seal that should ensure several years of battery lifetime. Bonding parameters, shear force and the water permeation rate of the adhesive were investigated. A capacity of 3 mAh/cm
2
and an energy density of 10 mWh/cm
2
were achieved. The electrical contact between the battery and the contact pads of the housing was investigated in detail. Electrical tests were made with encapsulated micro batteries and compared with macroscopic lithium polymer batteries. A reduction in capacity of approximately 10% was measured after 100 cycles. |
| doi_str_mv | 10.1007/s00542-009-0954-7 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_journals_2917923086</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>2917923086</sourcerecordid><originalsourceid>FETCH-LOGICAL-c346t-119258eb359e727e432587dab969e45868697fd337cade0086bc476785c545d53</originalsourceid><addsrcrecordid>eNp1kEtPwzAQhC0EEqXwA7hZQhxDbSeO7SMqT6kSFzhbrrNJXfLCdivx73GVCk6c9rDzzc4OQteU3FFCxCIQwguWEaIyoniRiRM0o0XOMiq5PEUzoooyE0SU5-gihC1JjJL5DDUPsId2GDvoIx5q3IPxeAO-g-gsDq51dugXTWtCwNbsXXQQcD14PBr7aRrXNwfK9REabyJUuHVx43Yd7pz1A16bGMEn5hKd1aYNcHWcc_Tx9Pi-fMlWb8-vy_tVZvOijBmlinEJ65wrEExA-oBLUZm1KhUUXJayVKKu8lxYUwEhslzbQpRCcssLXvF8jm4m39EPXzsIUW-Hne_TSc0UFYrliUkqOqlSxhA81Hr0rjP-W1OiD33qqU-d-tSHPrVIzO3R2QRr2tqb3rrwC7Jkzxg5JGCTLqRV34D_S_C_-Q-VDYVq</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2917923086</pqid></control><display><type>article</type><title>Development of near hermetic silicon/glass cavities for packaging of integrated lithium micro batteries</title><source>ProQuest Central UK/Ireland</source><source>SpringerLink Journals - AutoHoldings</source><source>ProQuest Central</source><creator>Marquardt, Krystan ; Hahn, Robert ; Blechert, Martin ; Lehmann, Marco ; Töpper, Michael ; Wilke, Martin ; Semionyk, Peter ; von Suchodoletz, Maria ; Reichl, Herbert</creator><creatorcontrib>Marquardt, Krystan ; Hahn, Robert ; Blechert, Martin ; Lehmann, Marco ; Töpper, Michael ; Wilke, Martin ; Semionyk, Peter ; von Suchodoletz, Maria ; Reichl, Herbert</creatorcontrib><description>A technology was developed for fabrication of very thin, chip-sized lithium secondary micro batteries. With help of wafer level processing the batteries can be directly integrated into silicon chips or MEMS devices. The batteries were packaged in 200 μm deep cavities of the silicon wafer and encapsulated with a glass substrate. Battery demonstrators were realized with 7 and 12 mm square and round foot prints. Near hermetic packaging was accomplished with the help of a UV curable epoxy seal that should ensure several years of battery lifetime. Bonding parameters, shear force and the water permeation rate of the adhesive were investigated. A capacity of 3 mAh/cm
2
and an energy density of 10 mWh/cm
2
were achieved. The electrical contact between the battery and the contact pads of the housing was investigated in detail. Electrical tests were made with encapsulated micro batteries and compared with macroscopic lithium polymer batteries. A reduction in capacity of approximately 10% was measured after 100 cycles.</description><identifier>ISSN: 0946-7076</identifier><identifier>EISSN: 1432-1858</identifier><identifier>DOI: 10.1007/s00542-009-0954-7</identifier><language>eng</language><publisher>Berlin/Heidelberg: Springer-Verlag</publisher><subject>Applied sciences ; Electric contacts ; Electrolytes ; Electronic packaging ; Electronics ; Electronics and Microelectronics ; Encapsulation ; Energy storage ; Engineering ; Exact sciences and technology ; Glass substrates ; Instrumentation ; Instruments, apparatus, components and techniques common to several branches of physics and astronomy ; Lithium ; Machine components ; Mechanical Engineering ; Mechanical engineering. Machine design ; Mechanical instruments, equipment and techniques ; Microbatteries ; Microelectronic fabrication (materials and surfaces technology) ; Micromechanical devices and systems ; Nanotechnology ; Package design ; Packaging ; Physics ; Polymers ; Precision engineering, watch making ; Seals and gaskets ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Semiconductors ; Shear forces ; Silicon ; Silicon wafers ; Technical Paper ; Thin films ; Ultraviolet radiation</subject><ispartof>Microsystem technologies, 2010-07, Vol.16 (7), p.1119-1129</ispartof><rights>Springer-Verlag 2009</rights><rights>2015 INIST-CNRS</rights><rights>Springer-Verlag 2009.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c346t-119258eb359e727e432587dab969e45868697fd337cade0086bc476785c545d53</citedby><cites>FETCH-LOGICAL-c346t-119258eb359e727e432587dab969e45868697fd337cade0086bc476785c545d53</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s00542-009-0954-7$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://www.proquest.com/docview/2917923086?pq-origsite=primo$$EHTML$$P50$$Gproquest$$H</linktohtml><link.rule.ids>310,311,315,781,785,790,791,21393,23935,23936,25145,27929,27930,33749,41493,42562,43810,51324,64390,64394,72474</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=22912205$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Marquardt, Krystan</creatorcontrib><creatorcontrib>Hahn, Robert</creatorcontrib><creatorcontrib>Blechert, Martin</creatorcontrib><creatorcontrib>Lehmann, Marco</creatorcontrib><creatorcontrib>Töpper, Michael</creatorcontrib><creatorcontrib>Wilke, Martin</creatorcontrib><creatorcontrib>Semionyk, Peter</creatorcontrib><creatorcontrib>von Suchodoletz, Maria</creatorcontrib><creatorcontrib>Reichl, Herbert</creatorcontrib><title>Development of near hermetic silicon/glass cavities for packaging of integrated lithium micro batteries</title><title>Microsystem technologies</title><addtitle>Microsyst Technol</addtitle><description>A technology was developed for fabrication of very thin, chip-sized lithium secondary micro batteries. With help of wafer level processing the batteries can be directly integrated into silicon chips or MEMS devices. The batteries were packaged in 200 μm deep cavities of the silicon wafer and encapsulated with a glass substrate. Battery demonstrators were realized with 7 and 12 mm square and round foot prints. Near hermetic packaging was accomplished with the help of a UV curable epoxy seal that should ensure several years of battery lifetime. Bonding parameters, shear force and the water permeation rate of the adhesive were investigated. A capacity of 3 mAh/cm
2
and an energy density of 10 mWh/cm
2
were achieved. The electrical contact between the battery and the contact pads of the housing was investigated in detail. Electrical tests were made with encapsulated micro batteries and compared with macroscopic lithium polymer batteries. A reduction in capacity of approximately 10% was measured after 100 cycles.</description><subject>Applied sciences</subject><subject>Electric contacts</subject><subject>Electrolytes</subject><subject>Electronic packaging</subject><subject>Electronics</subject><subject>Electronics and Microelectronics</subject><subject>Encapsulation</subject><subject>Energy storage</subject><subject>Engineering</subject><subject>Exact sciences and technology</subject><subject>Glass substrates</subject><subject>Instrumentation</subject><subject>Instruments, apparatus, components and techniques common to several branches of physics and astronomy</subject><subject>Lithium</subject><subject>Machine components</subject><subject>Mechanical Engineering</subject><subject>Mechanical engineering. Machine design</subject><subject>Mechanical instruments, equipment and techniques</subject><subject>Microbatteries</subject><subject>Microelectronic fabrication (materials and surfaces technology)</subject><subject>Micromechanical devices and systems</subject><subject>Nanotechnology</subject><subject>Package design</subject><subject>Packaging</subject><subject>Physics</subject><subject>Polymers</subject><subject>Precision engineering, watch making</subject><subject>Seals and gaskets</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Semiconductors</subject><subject>Shear forces</subject><subject>Silicon</subject><subject>Silicon wafers</subject><subject>Technical Paper</subject><subject>Thin films</subject><subject>Ultraviolet radiation</subject><issn>0946-7076</issn><issn>1432-1858</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2010</creationdate><recordtype>article</recordtype><sourceid>AFKRA</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><recordid>eNp1kEtPwzAQhC0EEqXwA7hZQhxDbSeO7SMqT6kSFzhbrrNJXfLCdivx73GVCk6c9rDzzc4OQteU3FFCxCIQwguWEaIyoniRiRM0o0XOMiq5PEUzoooyE0SU5-gihC1JjJL5DDUPsId2GDvoIx5q3IPxeAO-g-gsDq51dugXTWtCwNbsXXQQcD14PBr7aRrXNwfK9REabyJUuHVx43Yd7pz1A16bGMEn5hKd1aYNcHWcc_Tx9Pi-fMlWb8-vy_tVZvOijBmlinEJ65wrEExA-oBLUZm1KhUUXJayVKKu8lxYUwEhslzbQpRCcssLXvF8jm4m39EPXzsIUW-Hne_TSc0UFYrliUkqOqlSxhA81Hr0rjP-W1OiD33qqU-d-tSHPrVIzO3R2QRr2tqb3rrwC7Jkzxg5JGCTLqRV34D_S_C_-Q-VDYVq</recordid><startdate>20100701</startdate><enddate>20100701</enddate><creator>Marquardt, Krystan</creator><creator>Hahn, Robert</creator><creator>Blechert, Martin</creator><creator>Lehmann, Marco</creator><creator>Töpper, Michael</creator><creator>Wilke, Martin</creator><creator>Semionyk, Peter</creator><creator>von Suchodoletz, Maria</creator><creator>Reichl, Herbert</creator><general>Springer-Verlag</general><general>Springer</general><general>Springer Nature B.V</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>HCIFZ</scope><scope>KB.</scope><scope>L6V</scope><scope>M7S</scope><scope>P5Z</scope><scope>P62</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PTHSS</scope></search><sort><creationdate>20100701</creationdate><title>Development of near hermetic silicon/glass cavities for packaging of integrated lithium micro batteries</title><author>Marquardt, Krystan ; Hahn, Robert ; Blechert, Martin ; Lehmann, Marco ; Töpper, Michael ; Wilke, Martin ; Semionyk, Peter ; von Suchodoletz, Maria ; Reichl, Herbert</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c346t-119258eb359e727e432587dab969e45868697fd337cade0086bc476785c545d53</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2010</creationdate><topic>Applied sciences</topic><topic>Electric contacts</topic><topic>Electrolytes</topic><topic>Electronic packaging</topic><topic>Electronics</topic><topic>Electronics and Microelectronics</topic><topic>Encapsulation</topic><topic>Energy storage</topic><topic>Engineering</topic><topic>Exact sciences and technology</topic><topic>Glass substrates</topic><topic>Instrumentation</topic><topic>Instruments, apparatus, components and techniques common to several branches of physics and astronomy</topic><topic>Lithium</topic><topic>Machine components</topic><topic>Mechanical Engineering</topic><topic>Mechanical engineering. Machine design</topic><topic>Mechanical instruments, equipment and techniques</topic><topic>Microbatteries</topic><topic>Microelectronic fabrication (materials and surfaces technology)</topic><topic>Micromechanical devices and systems</topic><topic>Nanotechnology</topic><topic>Package design</topic><topic>Packaging</topic><topic>Physics</topic><topic>Polymers</topic><topic>Precision engineering, watch making</topic><topic>Seals and gaskets</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Semiconductors</topic><topic>Shear forces</topic><topic>Silicon</topic><topic>Silicon wafers</topic><topic>Technical Paper</topic><topic>Thin films</topic><topic>Ultraviolet radiation</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Marquardt, Krystan</creatorcontrib><creatorcontrib>Hahn, Robert</creatorcontrib><creatorcontrib>Blechert, Martin</creatorcontrib><creatorcontrib>Lehmann, Marco</creatorcontrib><creatorcontrib>Töpper, Michael</creatorcontrib><creatorcontrib>Wilke, Martin</creatorcontrib><creatorcontrib>Semionyk, Peter</creatorcontrib><creatorcontrib>von Suchodoletz, Maria</creatorcontrib><creatorcontrib>Reichl, Herbert</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central UK/Ireland</collection><collection>Advanced Technologies & Aerospace Collection</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>SciTech Premium Collection</collection><collection>Materials Science Database</collection><collection>ProQuest Engineering Collection</collection><collection>Engineering Database</collection><collection>Advanced Technologies & Aerospace Database</collection><collection>ProQuest Advanced Technologies & Aerospace Collection</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>Engineering Collection</collection><jtitle>Microsystem technologies</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Marquardt, Krystan</au><au>Hahn, Robert</au><au>Blechert, Martin</au><au>Lehmann, Marco</au><au>Töpper, Michael</au><au>Wilke, Martin</au><au>Semionyk, Peter</au><au>von Suchodoletz, Maria</au><au>Reichl, Herbert</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Development of near hermetic silicon/glass cavities for packaging of integrated lithium micro batteries</atitle><jtitle>Microsystem technologies</jtitle><stitle>Microsyst Technol</stitle><date>2010-07-01</date><risdate>2010</risdate><volume>16</volume><issue>7</issue><spage>1119</spage><epage>1129</epage><pages>1119-1129</pages><issn>0946-7076</issn><eissn>1432-1858</eissn><abstract>A technology was developed for fabrication of very thin, chip-sized lithium secondary micro batteries. With help of wafer level processing the batteries can be directly integrated into silicon chips or MEMS devices. The batteries were packaged in 200 μm deep cavities of the silicon wafer and encapsulated with a glass substrate. Battery demonstrators were realized with 7 and 12 mm square and round foot prints. Near hermetic packaging was accomplished with the help of a UV curable epoxy seal that should ensure several years of battery lifetime. Bonding parameters, shear force and the water permeation rate of the adhesive were investigated. A capacity of 3 mAh/cm
2
and an energy density of 10 mWh/cm
2
were achieved. The electrical contact between the battery and the contact pads of the housing was investigated in detail. Electrical tests were made with encapsulated micro batteries and compared with macroscopic lithium polymer batteries. A reduction in capacity of approximately 10% was measured after 100 cycles.</abstract><cop>Berlin/Heidelberg</cop><pub>Springer-Verlag</pub><doi>10.1007/s00542-009-0954-7</doi><tpages>11</tpages></addata></record> |
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| ispartof | Microsystem technologies, 2010-07, Vol.16 (7), p.1119-1129 |
| issn | 0946-7076 1432-1858 |
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| source | ProQuest Central UK/Ireland; SpringerLink Journals - AutoHoldings; ProQuest Central |
| subjects | Applied sciences Electric contacts Electrolytes Electronic packaging Electronics Electronics and Microelectronics Encapsulation Energy storage Engineering Exact sciences and technology Glass substrates Instrumentation Instruments, apparatus, components and techniques common to several branches of physics and astronomy Lithium Machine components Mechanical Engineering Mechanical engineering. Machine design Mechanical instruments, equipment and techniques Microbatteries Microelectronic fabrication (materials and surfaces technology) Micromechanical devices and systems Nanotechnology Package design Packaging Physics Polymers Precision engineering, watch making Seals and gaskets Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Semiconductors Shear forces Silicon Silicon wafers Technical Paper Thin films Ultraviolet radiation |
| title | Development of near hermetic silicon/glass cavities for packaging of integrated lithium micro batteries |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-12T02%3A58%3A54IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Development%20of%20near%20hermetic%20silicon/glass%20cavities%20for%20packaging%20of%20integrated%20lithium%20micro%20batteries&rft.jtitle=Microsystem%20technologies&rft.au=Marquardt,%20Krystan&rft.date=2010-07-01&rft.volume=16&rft.issue=7&rft.spage=1119&rft.epage=1129&rft.pages=1119-1129&rft.issn=0946-7076&rft.eissn=1432-1858&rft_id=info:doi/10.1007/s00542-009-0954-7&rft_dat=%3Cproquest_cross%3E2917923086%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=2917923086&rft_id=info:pmid/&rfr_iscdi=true |