Femtosecond laser-induced silicon surface morphology in water confinement

This article investigates the use of femtosecond laser induced surface morphology on silicon wafer surface in water confinement. Unlike irradiation of silicon surfaces in the air, there are no laser induced periodic structures, but irregular roughness is formed when the silicon wafer is ablated unde...

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Veröffentlicht in:	Microsystem technologies : sensors, actuators, systems integration actuators, systems integration, 2009-07, Vol.15 (7), p.1045-1049
Hauptverfasser:	Han, Yukun, Lin, Cheng-Hsiang, Xiao, Hai, Tsai, Hai-Lung
Format:	Artikel
Sprache:	eng
Schlagworte:	Ablation Applied sciences Confinement Electromagnetism Electronics Electronics and Microelectronics Engineering Exact sciences and technology Industrial applications Instrumentation Instruments, apparatus, components and techniques common to several branches of physics and astronomy Lasers Mechanical Engineering Mechanical engineering. Machine design Mechanical instruments, equipment and techniques Microelectronic fabrication (materials and surfaces technology) Micromachining Micromechanical devices and systems Morphology Nanotechnology Periodic structures Physics Precision engineering, watch making Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Silicon Silicon wafers Surface properties Technical Paper
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Zusammenfassung:	This article investigates the use of femtosecond laser induced surface morphology on silicon wafer surface in water confinement. Unlike irradiation of silicon surfaces in the air, there are no laser induced periodic structures, but irregular roughness is formed when the silicon wafer is ablated under water. The unique discovery of a smoothly processed silicon surface in water confinement under certain laser parameter combinations may help improve laser direct micromachining surface quality in industrial applications.
ISSN:	0946-7076 1432-1858
DOI:	10.1007/s00542-009-0880-8