Recovery limitation due to metal loss to fiberglass particles during printed circuit board leaching and probable mechanisms
Absolute recoveries of target metals are rarely achieved in printed circuit board (PCB) leaching operations and this is ultimately a threat to complete cyclic material use. Leaching pulps contain high fractions of fiberglass particles, a ceramic material whose behavior in leaching pulps has not been...
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| Veröffentlicht in: | Journal of material cycles and waste management 2024, Vol.26 (1), p.313-321 |
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| creator | Oluokun, Oluwayimika Olasunkanmi Otunniyi, Iyiola Olatunji |
| description | Absolute recoveries of target metals are rarely achieved in printed circuit board (PCB) leaching operations and this is ultimately a threat to complete cyclic material use. Leaching pulps contain high fractions of fiberglass particles, a ceramic material whose behavior in leaching pulps has not been studied but generally considered inert to lixiviants. Tests in this work, under basic and acidic lixiviants, show this is not so. Copper and zinc ions and ammine complexes, as well as iron ions were confirmed lost to fiberglass particles from basic and acid PCB leach solutions. Copper loss reached 0.695 mg per gram fiberglass particles in solution. Different mechanisms may apply in these interactions. Under the amine leaching, based on pH
pzc
study of fiberglass, it can be inferred that physisorption is responsible for losses observed. pH
pzc
of fiberglass was found to be 7.1. Hence, cationic complexes such as Cu(NH
3
)
2
2+
and Zn(NH
3
)
2
2+
under alkaline leaching conditions can be adsorbed. Under acid leaching, ion exchange is possible for losses observed. Fiberglass particles adsorb or exchange target metal ions during acidic and alkaline PCB leaching, thus limiting maximum possible recovery during recycling. These mechanisms are probable to understand and manage this loss. |
| doi_str_mv | 10.1007/s10163-023-01822-5 |
| format | Article |
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pzc
study of fiberglass, it can be inferred that physisorption is responsible for losses observed. pH
pzc
of fiberglass was found to be 7.1. Hence, cationic complexes such as Cu(NH
3
)
2
2+
and Zn(NH
3
)
2
2+
under alkaline leaching conditions can be adsorbed. Under acid leaching, ion exchange is possible for losses observed. Fiberglass particles adsorb or exchange target metal ions during acidic and alkaline PCB leaching, thus limiting maximum possible recovery during recycling. These mechanisms are probable to understand and manage this loss.</description><identifier>ISSN: 1438-4957</identifier><identifier>EISSN: 1611-8227</identifier><identifier>DOI: 10.1007/s10163-023-01822-5</identifier><language>eng</language><publisher>Tokyo: Springer Japan</publisher><subject>Acid leaching ; Alkaline leaching ; Ammonia ; Circuit boards ; Civil Engineering ; Copper ; Copper loss ; Engineering ; Environmental Management ; Fiberglass ; Heavy metals ; Ion exchange ; Leaching ; Metal ions ; Original Article ; Printed circuit boards ; Printed circuits ; Waste Management/Waste Technology</subject><ispartof>Journal of material cycles and waste management, 2024, Vol.26 (1), p.313-321</ispartof><rights>The Author(s), under exclusive licence to Springer Nature Japan KK, part of Springer Nature 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c270t-1b3c65f339553557d98d72e23a80d4c01eb537d585f466ce2aacca13e7f08ca63</cites><orcidid>0000-0002-6445-5640</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s10163-023-01822-5$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s10163-023-01822-5$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,776,780,27901,27902,41464,42533,51294</link.rule.ids></links><search><creatorcontrib>Oluokun, Oluwayimika Olasunkanmi</creatorcontrib><creatorcontrib>Otunniyi, Iyiola Olatunji</creatorcontrib><title>Recovery limitation due to metal loss to fiberglass particles during printed circuit board leaching and probable mechanisms</title><title>Journal of material cycles and waste management</title><addtitle>J Mater Cycles Waste Manag</addtitle><description>Absolute recoveries of target metals are rarely achieved in printed circuit board (PCB) leaching operations and this is ultimately a threat to complete cyclic material use. Leaching pulps contain high fractions of fiberglass particles, a ceramic material whose behavior in leaching pulps has not been studied but generally considered inert to lixiviants. Tests in this work, under basic and acidic lixiviants, show this is not so. Copper and zinc ions and ammine complexes, as well as iron ions were confirmed lost to fiberglass particles from basic and acid PCB leach solutions. Copper loss reached 0.695 mg per gram fiberglass particles in solution. Different mechanisms may apply in these interactions. Under the amine leaching, based on pH
pzc
study of fiberglass, it can be inferred that physisorption is responsible for losses observed. pH
pzc
of fiberglass was found to be 7.1. Hence, cationic complexes such as Cu(NH
3
)
2
2+
and Zn(NH
3
)
2
2+
under alkaline leaching conditions can be adsorbed. Under acid leaching, ion exchange is possible for losses observed. Fiberglass particles adsorb or exchange target metal ions during acidic and alkaline PCB leaching, thus limiting maximum possible recovery during recycling. These mechanisms are probable to understand and manage this loss.</description><subject>Acid leaching</subject><subject>Alkaline leaching</subject><subject>Ammonia</subject><subject>Circuit boards</subject><subject>Civil Engineering</subject><subject>Copper</subject><subject>Copper loss</subject><subject>Engineering</subject><subject>Environmental Management</subject><subject>Fiberglass</subject><subject>Heavy metals</subject><subject>Ion exchange</subject><subject>Leaching</subject><subject>Metal ions</subject><subject>Original Article</subject><subject>Printed circuit boards</subject><subject>Printed circuits</subject><subject>Waste Management/Waste Technology</subject><issn>1438-4957</issn><issn>1611-8227</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2024</creationdate><recordtype>article</recordtype><sourceid>BENPR</sourceid><recordid>eNp9kEtLxDAUhYMoOI7-AVcB19U8mqZdyuALBgTRdUiT25kMaTsmGUH886ZWcOciyT3k3JPcD6FLSq4pIfImUkIrXhCWF60ZK8QRWtCK0iILeZzrktdF2Qh5is5i3BHCGsLlAn29gBk_IHxi73qXdHLjgO0BcBpxD0l77McYJ9W5FsLG66z2OiRnPMTsDG7Y4H3eE1hsXDAHl3A76mCxB22207UebLaMrW495FSz1YOLfTxHJ532ES5-zyV6u797XT0W6-eHp9XtujBMklTQlptKdJw3QnAhpG1qKxkwrmtiS0MotIJLK2rRlVVlgGltjKYcZEdqoyu-RFdzbv7D-wFiUrvxEIb8pMoUGs55lWEsEZtdJuSJA3QqT9Xr8KkoURNkNUNWGbL6gaxEbuJzU5wQbCD8Rf_T9Q34XoGg</recordid><startdate>2024</startdate><enddate>2024</enddate><creator>Oluokun, Oluwayimika Olasunkanmi</creator><creator>Otunniyi, Iyiola Olatunji</creator><general>Springer Japan</general><general>Springer Nature B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>3V.</scope><scope>7SR</scope><scope>7ST</scope><scope>7WY</scope><scope>7WZ</scope><scope>7XB</scope><scope>87Z</scope><scope>88I</scope><scope>8BQ</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>8FK</scope><scope>8FL</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AEUYN</scope><scope>AFKRA</scope><scope>ATCPS</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BEZIV</scope><scope>BGLVJ</scope><scope>BHPHI</scope><scope>C1K</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>FR3</scope><scope>FRNLG</scope><scope>F~G</scope><scope>GNUQQ</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>K60</scope><scope>K6~</scope><scope>KB.</scope><scope>KR7</scope><scope>L.-</scope><scope>M0C</scope><scope>M2P</scope><scope>PATMY</scope><scope>PDBOC</scope><scope>PQBIZ</scope><scope>PQBZA</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PYCSY</scope><scope>Q9U</scope><scope>SOI</scope><orcidid>https://orcid.org/0000-0002-6445-5640</orcidid></search><sort><creationdate>2024</creationdate><title>Recovery limitation due to metal loss to fiberglass particles during printed circuit board leaching and probable mechanisms</title><author>Oluokun, Oluwayimika Olasunkanmi ; Otunniyi, Iyiola Olatunji</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c270t-1b3c65f339553557d98d72e23a80d4c01eb537d585f466ce2aacca13e7f08ca63</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2024</creationdate><topic>Acid leaching</topic><topic>Alkaline leaching</topic><topic>Ammonia</topic><topic>Circuit boards</topic><topic>Civil Engineering</topic><topic>Copper</topic><topic>Copper loss</topic><topic>Engineering</topic><topic>Environmental Management</topic><topic>Fiberglass</topic><topic>Heavy metals</topic><topic>Ion exchange</topic><topic>Leaching</topic><topic>Metal ions</topic><topic>Original Article</topic><topic>Printed circuit boards</topic><topic>Printed circuits</topic><topic>Waste Management/Waste Technology</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Oluokun, Oluwayimika Olasunkanmi</creatorcontrib><creatorcontrib>Otunniyi, Iyiola Olatunji</creatorcontrib><collection>CrossRef</collection><collection>ProQuest Central (Corporate)</collection><collection>Engineered Materials Abstracts</collection><collection>Environment Abstracts</collection><collection>ABI/INFORM Collection</collection><collection>ABI/INFORM Global (PDF only)</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>ABI/INFORM Global (Alumni Edition)</collection><collection>Science Database (Alumni Edition)</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central (Alumni) (purchase pre-March 2016)</collection><collection>ABI/INFORM Collection (Alumni Edition)</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest One Sustainability</collection><collection>ProQuest Central UK/Ireland</collection><collection>Agricultural & Environmental Science Collection</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Business Premium Collection</collection><collection>Technology Collection</collection><collection>Natural Science Collection</collection><collection>Environmental Sciences and Pollution Management</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>Engineering Research Database</collection><collection>Business Premium Collection (Alumni)</collection><collection>ABI/INFORM Global (Corporate)</collection><collection>ProQuest Central Student</collection><collection>SciTech Premium Collection</collection><collection>Materials Research Database</collection><collection>ProQuest Business Collection (Alumni Edition)</collection><collection>ProQuest Business Collection</collection><collection>Materials Science Database</collection><collection>Civil Engineering Abstracts</collection><collection>ABI/INFORM Professional Advanced</collection><collection>ABI/INFORM Global</collection><collection>Science Database</collection><collection>Environmental Science Database</collection><collection>Materials Science Collection</collection><collection>One Business (ProQuest)</collection><collection>ProQuest One Business (Alumni)</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>Environmental Science Collection</collection><collection>ProQuest Central Basic</collection><collection>Environment Abstracts</collection><jtitle>Journal of material cycles and waste management</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Oluokun, Oluwayimika Olasunkanmi</au><au>Otunniyi, Iyiola Olatunji</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Recovery limitation due to metal loss to fiberglass particles during printed circuit board leaching and probable mechanisms</atitle><jtitle>Journal of material cycles and waste management</jtitle><stitle>J Mater Cycles Waste Manag</stitle><date>2024</date><risdate>2024</risdate><volume>26</volume><issue>1</issue><spage>313</spage><epage>321</epage><pages>313-321</pages><issn>1438-4957</issn><eissn>1611-8227</eissn><abstract>Absolute recoveries of target metals are rarely achieved in printed circuit board (PCB) leaching operations and this is ultimately a threat to complete cyclic material use. Leaching pulps contain high fractions of fiberglass particles, a ceramic material whose behavior in leaching pulps has not been studied but generally considered inert to lixiviants. Tests in this work, under basic and acidic lixiviants, show this is not so. Copper and zinc ions and ammine complexes, as well as iron ions were confirmed lost to fiberglass particles from basic and acid PCB leach solutions. Copper loss reached 0.695 mg per gram fiberglass particles in solution. Different mechanisms may apply in these interactions. Under the amine leaching, based on pH
pzc
study of fiberglass, it can be inferred that physisorption is responsible for losses observed. pH
pzc
of fiberglass was found to be 7.1. Hence, cationic complexes such as Cu(NH
3
)
2
2+
and Zn(NH
3
)
2
2+
under alkaline leaching conditions can be adsorbed. Under acid leaching, ion exchange is possible for losses observed. Fiberglass particles adsorb or exchange target metal ions during acidic and alkaline PCB leaching, thus limiting maximum possible recovery during recycling. These mechanisms are probable to understand and manage this loss.</abstract><cop>Tokyo</cop><pub>Springer Japan</pub><doi>10.1007/s10163-023-01822-5</doi><tpages>9</tpages><orcidid>https://orcid.org/0000-0002-6445-5640</orcidid></addata></record> |
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| ispartof | Journal of material cycles and waste management, 2024, Vol.26 (1), p.313-321 |
| issn | 1438-4957 1611-8227 |
| language | eng |
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| source | Springer Nature - Complete Springer Journals |
| subjects | Acid leaching Alkaline leaching Ammonia Circuit boards Civil Engineering Copper Copper loss Engineering Environmental Management Fiberglass Heavy metals Ion exchange Leaching Metal ions Original Article Printed circuit boards Printed circuits Waste Management/Waste Technology |
| title | Recovery limitation due to metal loss to fiberglass particles during printed circuit board leaching and probable mechanisms |
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