Composites of cis‐ and trans‐polyisoprene blend filled with silver nanoparticles: Dynamic mechanical, mechanical, and thermal analysis

In this article, polymer nanocomposites of polyisoprene with specific blend ratio 25/75 wt% of cis‐polyisoprene (CPI) and trans‐polyisoprene (TPI) with varying concentration (0.1, 1, and 5 wt%) of so synthesized silver nanoparticles (AgNPs) have been prepared and characterized through x‐ray diffraction, transmission electron microscope and scanning electron microscope. Experimental results on dynamic mechanical analysis show that addition of AgNPs to CPI/TPI blend reduces storage modulus, activation energy and fragility while enhances damping, however, glass transition temperature remains unaffected. Other mechanical properties such as toughness and tensile strength first increases on addition of AgNPs in the CPI/TPI blend, but a decrease is noticed on further increase of AgNPs concentration. Young's modulus shows a drastic decrease on addition of AgNPs into CPI/TPI blend, however, an increase is observed at higher concentration of AgNPs. Thermal analysis results show that thermal conductivity enhances with the enhancement in concentration of AgNPs into CPI/TPI blend. Highlights Addition of AgNPs into CPI/TPI blend reduces storage modulus, activation energy and fragility Incorporation of AgNPs into CPI/TPI blend enhances damping but does not change glass transition temperature. Increase in concentration of AgNPs in CPI/TPI blend increases the thermal conductivity. In this article, polymer nanocomposites of CPI/TPI specific blend with AgNPs have been prepared and characterized through DMA and TCA.