Defect inspection in semiconductor images using FAST-MCD method and neural network

Most defect inspection methods used in semiconductor manufacturing require design layout or golden die images. Unlike methods that require such additional information, this paper presents a method for automatic inspection of defects in semiconductor images with a single image. First, we devise a met...

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Veröffentlicht in:	International journal of advanced manufacturing technology 2023-11, Vol.129 (3-4), p.1547-1565
Hauptverfasser:	Yu, Jinkyu, Han, Songhee, Lee, Chang-Ock
Format:	Artikel
Sprache:	eng
Schlagworte:	CAE) and Design Computer-Aided Engineering (CAD Defects Design defects Engineering Image classification Image segmentation Industrial and Production Engineering Inspection Mechanical Engineering Media Management Methods Neural networks Original Article
Online-Zugang:	Volltext
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