APDS modified several bisphenol A polyimides with low dielectric constant under high frequency

In the area of Polymer dielectric materials, those with low dielectric constant and low dielectric loss have potential to be applied in high-frequency signal transmissions, such as antennae of mobile phones and millimeter-wave radars. This study is focused on producing fluorinated polyimide (PI) fil...

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Veröffentlicht in:Journal of polymer research 2023-11, Vol.30 (11), Article 407
Hauptverfasser: Li, Heming, Wang, Xinming, Gong, Yuze, Zhao, Hongbin, Liu, Zhaobin, Tao, Lin, Dastan, Davoud, Ma, Ke, Hu, Zhizhi, Sun, Mingming
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container_issue 11
container_start_page
container_title Journal of polymer research
container_volume 30
creator Li, Heming
Wang, Xinming
Gong, Yuze
Zhao, Hongbin
Liu, Zhaobin
Tao, Lin
Dastan, Davoud
Ma, Ke
Hu, Zhizhi
Sun, Mingming
description In the area of Polymer dielectric materials, those with low dielectric constant and low dielectric loss have potential to be applied in high-frequency signal transmissions, such as antennae of mobile phones and millimeter-wave radars. This study is focused on producing fluorinated polyimide (PI) film with modified organosilicon (APDS). In this work, APDS was used to PI film. The spatial hindrance of Trifluoromethyl can reduce the high frequency dielectric loss of modified PI film. The length of molecular chain was decreased as increasing the proportion of APDS, which reduced the quantity of polar imide rings in unit volume. Meanwhile, the Si-O-Si bond combination in backbone decreased the integer polarity of PI film, which resulted in the decrease of tan δ. The values of ε and tan δ were 2.48 and 0.00335 respectively under 10 GHz. The values of ε and tanδ were reduced to 6.6% and 36.5% respectively compared with base membrane. Thus, this work provides a simple method to reduce the dielectric constant and dielectric loss of PI film. Meanwhile, the relationship between dielectric properties and molecular structure was proved. PI molecules were separated by low dielectric groups, which resulted in a decrease in dielectric constant and dielectric loss.
doi_str_mv 10.1007/s10965-023-03788-2
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This study is focused on producing fluorinated polyimide (PI) film with modified organosilicon (APDS). In this work, APDS was used to PI film. The spatial hindrance of Trifluoromethyl can reduce the high frequency dielectric loss of modified PI film. The length of molecular chain was decreased as increasing the proportion of APDS, which reduced the quantity of polar imide rings in unit volume. Meanwhile, the Si-O-Si bond combination in backbone decreased the integer polarity of PI film, which resulted in the decrease of tan δ. The values of ε and tan δ were 2.48 and 0.00335 respectively under 10 GHz. The values of ε and tanδ were reduced to 6.6% and 36.5% respectively compared with base membrane. Thus, this work provides a simple method to reduce the dielectric constant and dielectric loss of PI film. Meanwhile, the relationship between dielectric properties and molecular structure was proved. 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subjects Bisphenol A
Cellular telephone equipment industry
Characterization and Evaluation of Materials
Chemistry
Chemistry and Materials Science
Dielectric loss
Dielectric properties
Dielectrics
Electric properties
Electrical conductivity
High frequencies
Industrial Chemistry/Chemical Engineering
Millimeter waves
Molecular chains
Molecular structure
Original Paper
Permittivity
Phenols
Polyimide resins
Polyimides
Polymer Sciences
Silicon compounds
title APDS modified several bisphenol A polyimides with low dielectric constant under high frequency
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