Investigation into ameliorative dielectric properties of silicon/poly(vinylidene fluoride) composites by engineering insulating aluminum oxide shell as an interlayer

Flexible electronic materials with high‐dielectric constant ( ɛ ) and breakdown strength ( E b ) but low loss is pursued. Encapsulation of conductive fillers with various insulating shells represents a promising strategy to inhibit dielectric loss or leakage current. In this work, aluminum oxide (Al...

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Veröffentlicht in:	Journal of applied polymer science 2023-10, Vol.140 (40), p.1-16
Hauptverfasser:	Lin, Na, Yin, Ronghua, Zhou, Wenying, Zhang, Mengyuan, Kong, Fanrong, Gong, Ming, Lei, Xiaoyan, Cao, Zichen, Di‐wu, Jingyu, Li, Weiwei, Zhao, Yingying
Format:	Artikel
Sprache:	eng
Schlagworte:	Aluminum Aluminum oxide Composite materials Core-shell structure Dielectric breakdown Dielectric loss Dielectric properties Dielectric strength Electronic materials Encapsulation Fillers Fluorides Interlayers Leakage current Materials science Polymers Polyvinylidene fluorides Silicon Sol-gel processes Vinylidene fluoride
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