High‐temperature resistance and excellent electrical insulation in epoxy resin blends
The packaging insulation material was a crucial component to guarantee the stable and safe operation of electronic devices. Epoxy resin, one of the most popular packaging materials, was widely used as an electronic packaging material because of its good corrosion resistance and electrical insulation...
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| Veröffentlicht in: | Journal of applied polymer science 2023-09, Vol.140 (35), p.n/a |
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| container_title | Journal of applied polymer science |
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| creator | Zhang, Changhai Liu, Zeyang Zhang, Tiandong Wang, Xubin Yin, Chao Liu, Xianli Chi, Qingguo |
| description | The packaging insulation material was a crucial component to guarantee the stable and safe operation of electronic devices. Epoxy resin, one of the most popular packaging materials, was widely used as an electronic packaging material because of its good corrosion resistance and electrical insulation, low price, and easy processing and molding. However, the unsatisfied heat resistance cannot meet the requirements of the rapid development of third‐generation power semiconductors, so it was meaningful to modify the epoxy resin with both excellent heat resistance and insulation. In this paper, tetrafunctional epoxy resin AG70 and phenolic epoxy resin F51 was blended in different proportions to combine their individual advantages, and the microstructure and electrical/thermal properties of epoxy resin blends had been systematically studied. The results showed that with the increase of blending ratio of AG70 with F51, both high glass transition temperature of 213.3°C and electric breakdown of 206.1 kV/mm were achieved when the blending ratio was 5:5, displaying excellent overall performances and exhibiting great application potential in electronic and microelectronic industries. |
| doi_str_mv | 10.1002/app.54359 |
| format | Article |
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Epoxy resin, one of the most popular packaging materials, was widely used as an electronic packaging material because of its good corrosion resistance and electrical insulation, low price, and easy processing and molding. However, the unsatisfied heat resistance cannot meet the requirements of the rapid development of third‐generation power semiconductors, so it was meaningful to modify the epoxy resin with both excellent heat resistance and insulation. In this paper, tetrafunctional epoxy resin AG70 and phenolic epoxy resin F51 was blended in different proportions to combine their individual advantages, and the microstructure and electrical/thermal properties of epoxy resin blends had been systematically studied. The results showed that with the increase of blending ratio of AG70 with F51, both high glass transition temperature of 213.3°C and electric breakdown of 206.1 kV/mm were achieved when the blending ratio was 5:5, displaying excellent overall performances and exhibiting great application potential in electronic and microelectronic industries.</description><identifier>ISSN: 0021-8995</identifier><identifier>EISSN: 1097-4628</identifier><identifier>DOI: 10.1002/app.54359</identifier><language>eng</language><publisher>Hoboken, USA: John Wiley & Sons, Inc</publisher><subject>Blending ; Corrosion resistance ; Electrical insulation ; electrical performance ; Electrical resistance ; Electronic packaging ; epoxy resin ; Epoxy resins ; Glass transition temperature ; Heat resistance ; Materials science ; Phenolic epoxy resins ; Polymer blends ; Polymers ; space charge ; Thermal resistance ; Thermodynamic properties</subject><ispartof>Journal of applied polymer science, 2023-09, Vol.140 (35), p.n/a</ispartof><rights>2023 Wiley Periodicals LLC.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c2979-6b2ca4ee6d7e6544a027294d05fc1acf68597bf20cdc92ccfe2a92da25393bdc3</citedby><cites>FETCH-LOGICAL-c2979-6b2ca4ee6d7e6544a027294d05fc1acf68597bf20cdc92ccfe2a92da25393bdc3</cites><orcidid>0000-0002-7124-9570</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://onlinelibrary.wiley.com/doi/pdf/10.1002%2Fapp.54359$$EPDF$$P50$$Gwiley$$H</linktopdf><linktohtml>$$Uhttps://onlinelibrary.wiley.com/doi/full/10.1002%2Fapp.54359$$EHTML$$P50$$Gwiley$$H</linktohtml><link.rule.ids>314,780,784,1417,27924,27925,45574,45575</link.rule.ids></links><search><creatorcontrib>Zhang, Changhai</creatorcontrib><creatorcontrib>Liu, Zeyang</creatorcontrib><creatorcontrib>Zhang, Tiandong</creatorcontrib><creatorcontrib>Wang, Xubin</creatorcontrib><creatorcontrib>Yin, Chao</creatorcontrib><creatorcontrib>Liu, Xianli</creatorcontrib><creatorcontrib>Chi, Qingguo</creatorcontrib><title>High‐temperature resistance and excellent electrical insulation in epoxy resin blends</title><title>Journal of applied polymer science</title><description>The packaging insulation material was a crucial component to guarantee the stable and safe operation of electronic devices. Epoxy resin, one of the most popular packaging materials, was widely used as an electronic packaging material because of its good corrosion resistance and electrical insulation, low price, and easy processing and molding. However, the unsatisfied heat resistance cannot meet the requirements of the rapid development of third‐generation power semiconductors, so it was meaningful to modify the epoxy resin with both excellent heat resistance and insulation. In this paper, tetrafunctional epoxy resin AG70 and phenolic epoxy resin F51 was blended in different proportions to combine their individual advantages, and the microstructure and electrical/thermal properties of epoxy resin blends had been systematically studied. The results showed that with the increase of blending ratio of AG70 with F51, both high glass transition temperature of 213.3°C and electric breakdown of 206.1 kV/mm were achieved when the blending ratio was 5:5, displaying excellent overall performances and exhibiting great application potential in electronic and microelectronic industries.</description><subject>Blending</subject><subject>Corrosion resistance</subject><subject>Electrical insulation</subject><subject>electrical performance</subject><subject>Electrical resistance</subject><subject>Electronic packaging</subject><subject>epoxy resin</subject><subject>Epoxy resins</subject><subject>Glass transition temperature</subject><subject>Heat resistance</subject><subject>Materials science</subject><subject>Phenolic epoxy resins</subject><subject>Polymer blends</subject><subject>Polymers</subject><subject>space charge</subject><subject>Thermal resistance</subject><subject>Thermodynamic properties</subject><issn>0021-8995</issn><issn>1097-4628</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2023</creationdate><recordtype>article</recordtype><recordid>eNp1kLFOwzAQhi0EEqUw8AaRmBjS2k7sxGNVAUWqRAcQo-XYF0jlOsF2BN14BJ6RJyE0rEz3S_f9d9KH0CXBM4Ixnauum7E8Y-IITQgWRZpzWh6jybAjaSkEO0VnIWwxJoRhPkHPq-bl9fvzK8KuA69i7yHxEJoQldOQKGcS-NBgLbiYgAUdfaOVTRoXeqti07ohJtC1H_tDzyXVgJpwjk5qZQNc_M0perq9eVyu0vXD3f1ysU41FYVIeUW1ygG4KYCzPFeYFlTkBrNaE6VrXjJRVDXF2mhBta6BKkGNoiwTWWV0NkVX493Ot289hCi3be_d8FLSMudlWdCMD9T1SGnfhuChlp1vdsrvJcHy15scvMmDt4Gdj-x7Y2H_PygXm83Y-AGvr3Hr</recordid><startdate>20230915</startdate><enddate>20230915</enddate><creator>Zhang, Changhai</creator><creator>Liu, Zeyang</creator><creator>Zhang, Tiandong</creator><creator>Wang, Xubin</creator><creator>Yin, Chao</creator><creator>Liu, Xianli</creator><creator>Chi, Qingguo</creator><general>John Wiley & Sons, Inc</general><general>Wiley Subscription Services, Inc</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>8FD</scope><scope>JG9</scope><orcidid>https://orcid.org/0000-0002-7124-9570</orcidid></search><sort><creationdate>20230915</creationdate><title>High‐temperature resistance and excellent electrical insulation in epoxy resin blends</title><author>Zhang, Changhai ; Liu, Zeyang ; Zhang, Tiandong ; Wang, Xubin ; Yin, Chao ; Liu, Xianli ; Chi, Qingguo</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c2979-6b2ca4ee6d7e6544a027294d05fc1acf68597bf20cdc92ccfe2a92da25393bdc3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2023</creationdate><topic>Blending</topic><topic>Corrosion resistance</topic><topic>Electrical insulation</topic><topic>electrical performance</topic><topic>Electrical resistance</topic><topic>Electronic packaging</topic><topic>epoxy resin</topic><topic>Epoxy resins</topic><topic>Glass transition temperature</topic><topic>Heat resistance</topic><topic>Materials science</topic><topic>Phenolic epoxy resins</topic><topic>Polymer blends</topic><topic>Polymers</topic><topic>space charge</topic><topic>Thermal resistance</topic><topic>Thermodynamic properties</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Zhang, Changhai</creatorcontrib><creatorcontrib>Liu, Zeyang</creatorcontrib><creatorcontrib>Zhang, Tiandong</creatorcontrib><creatorcontrib>Wang, Xubin</creatorcontrib><creatorcontrib>Yin, Chao</creatorcontrib><creatorcontrib>Liu, Xianli</creatorcontrib><creatorcontrib>Chi, Qingguo</creatorcontrib><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Journal of applied polymer science</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Zhang, Changhai</au><au>Liu, Zeyang</au><au>Zhang, Tiandong</au><au>Wang, Xubin</au><au>Yin, Chao</au><au>Liu, Xianli</au><au>Chi, Qingguo</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>High‐temperature resistance and excellent electrical insulation in epoxy resin blends</atitle><jtitle>Journal of applied polymer science</jtitle><date>2023-09-15</date><risdate>2023</risdate><volume>140</volume><issue>35</issue><epage>n/a</epage><issn>0021-8995</issn><eissn>1097-4628</eissn><abstract>The packaging insulation material was a crucial component to guarantee the stable and safe operation of electronic devices. Epoxy resin, one of the most popular packaging materials, was widely used as an electronic packaging material because of its good corrosion resistance and electrical insulation, low price, and easy processing and molding. However, the unsatisfied heat resistance cannot meet the requirements of the rapid development of third‐generation power semiconductors, so it was meaningful to modify the epoxy resin with both excellent heat resistance and insulation. In this paper, tetrafunctional epoxy resin AG70 and phenolic epoxy resin F51 was blended in different proportions to combine their individual advantages, and the microstructure and electrical/thermal properties of epoxy resin blends had been systematically studied. The results showed that with the increase of blending ratio of AG70 with F51, both high glass transition temperature of 213.3°C and electric breakdown of 206.1 kV/mm were achieved when the blending ratio was 5:5, displaying excellent overall performances and exhibiting great application potential in electronic and microelectronic industries.</abstract><cop>Hoboken, USA</cop><pub>John Wiley & Sons, Inc</pub><doi>10.1002/app.54359</doi><tpages>12</tpages><orcidid>https://orcid.org/0000-0002-7124-9570</orcidid></addata></record> |
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| source | Wiley Journals |
| subjects | Blending Corrosion resistance Electrical insulation electrical performance Electrical resistance Electronic packaging epoxy resin Epoxy resins Glass transition temperature Heat resistance Materials science Phenolic epoxy resins Polymer blends Polymers space charge Thermal resistance Thermodynamic properties |
| title | High‐temperature resistance and excellent electrical insulation in epoxy resin blends |
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