13.1: The design and preparation of flexible MiniLED plate with nano‐Ag paste

The development and preparation process of a flexible MiniLED line subgrade board on a white reflective sheet was carried out in this paper using silk‐printing nanoscale silver paste assisted bonding technology. The design of the line conductivity parameter ‐ nanoscale silver paste parameter model,...

Ausführliche Beschreibung

Bibliographische Detailangaben

Veröffentlicht in:	SID International Symposium Digest of technical papers 2023-04, Vol.54 (S1), p.114-117
Hauptverfasser:	Wang, Xiaohui, Wang, Daiqing, Li, Jianlin, Zheng, He, Kano, Ryohei, Zou, Qiang, Yue, Chunbo
Format:	Artikel
Sprache:	eng
Schlagworte:	Backlights Flexible Nano Silver Circuit Parameters Screen Printing Silver
Online-Zugang:	Volltext
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