Nanoparticles migration effects on enhancing cooling process of triangular electronic chips using novel E-shaped porous cavity

An optimized configuration for cooling triangular heat chips through the flow and heat transfer of a SiO 2 -based nanofluid via a porous E-shaped enclosure is analyzed computationally. The left wall of the enclosure is wavy. The upper and bottom walls are cold, while the remaining ones are adiabatic...

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Veröffentlicht in:	Computational particle mechanics 2023-08, Vol.10 (4), p.793-808
Hauptverfasser:	shafiei, A., Hajjar, A., Ghasemiasl, R., Armaghani, T., Rashad, A., Nabwey, H. A.
Format:	Artikel
Sprache:	eng
Schlagworte:	Aspect ratio Classical and Continuum Physics Computational Science and Engineering Cooling Enclosures Engineering Finite volume method Fluid flow Heat transfer Mathematical models Nanofluids Nanoparticles Performance evaluation Silicon dioxide Temperature dependence Theoretical and Applied Mechanics Thermophysical models Thermophysical properties
Online-Zugang:	Volltext
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