Effect of DL-alanine as an auxiliary complexing agent in TSV copper film CMP

The quality of the chemical mechanical polishing (CMP) process of the reactive Through Silicon Via (TSV) copper (Cu) film depends in large part on the slurry's planarization characteristic. Due to their non-polluting and excellent performance qualities, amino acid chemical additives have been e...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	Journal of materials research 2023-06, Vol.38 (12), p.3172-3186
Hauptverfasser:	Wang, Shuai, Wang, Ru, Liu, Bin, Dong, Yanwei, Zheng, Tao, Shi, Yunhui
Format:	Artikel
Sprache:	eng
Schlagworte:	Additives Alanine Amino acids Applied and Technical Physics Biomaterials Chemical-mechanical polishing Chemistry and Materials Science Copper Glycine Inorganic Chemistry Integrated circuits Interconnections Materials Engineering Materials research Materials Science Metal films Nanotechnology Photoelectrons Reagents Slurries Surface properties
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!