Fabrication and Performance of 300 mm Wafer Scale Silicon Microchannel Cooler
This paper describes the design, fabrication, and thermal performance of 300 mm diameter wafer-scale Si microchannel coolers that demonstrated a junction temperature rise of less than 18°C when dissipating about 14 kW of power. A thermal test wafer, which included hot-spot regions to mimic high-powe...
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| Veröffentlicht in: | IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2023-04, Vol.13 (4), p.1-1 |
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| container_title | IEEE transactions on components, packaging, and manufacturing technology (2011) |
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| creator | Colgan, Evan G. Schleupen, Kai Mann, Phillip Kuder, Robert Nah, Jae-Woong Sakuma, Katsuyuki Alvarez, Victor Turlapati, Lavanya Wong, Danny Lukashov, Stanislav Cordes, Steve Speidell, James |
| description | This paper describes the design, fabrication, and thermal performance of 300 mm diameter wafer-scale Si microchannel coolers that demonstrated a junction temperature rise of less than 18°C when dissipating about 14 kW of power. A thermal test wafer, which included hot-spot regions to mimic high-power compute cores, was attached to the wafer-scale microchannel cooler with Pb-Sn solder. Glass manifold layers were attached to the microchannel wafer using a frit material. The average apparent heat transfer coefficient, h app , was about 104,000 W/(K-m 2 ). |
| doi_str_mv | 10.1109/TCPMT.2023.3266666 |
| format | Article |
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A thermal test wafer, which included hot-spot regions to mimic high-power compute cores, was attached to the wafer-scale microchannel cooler with Pb-Sn solder. Glass manifold layers were attached to the microchannel wafer using a frit material. 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The average apparent heat transfer coefficient, h app , was about 104,000 W/(K-m 2 ).</description><subject>Coolants</subject><subject>Coolers</subject><subject>Cooling</subject><subject>Frit</subject><subject>Glass</subject><subject>Heat transfer coefficients</subject><subject>High power density</subject><subject>Lead</subject><subject>liquid cooling</subject><subject>Manifolds</subject><subject>Microchannels</subject><subject>Semiconductor device modeling</subject><subject>Silicon</subject><subject>Tin</subject><subject>wafer-scale integration</subject><issn>2156-3950</issn><issn>2156-3985</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2023</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNpNkEFLAzEQhYMoWGr_gHgIeN46mWx2k6MsVoUWC614DNk0wS27m5ptD_57U1vEd5k5vDfz-Ai5ZTBlDNTDulou1lME5FOOxVEXZIRMFBlXUlz-7QKuyWQYtpAkJJTAR2QxM3VsrNk3oaem39Cliz7EzvTW0eApB6BdRz-Md5GurGkdXTVtY5N70dgY7Kfpe9fSKoTWxRty5U07uMl5jsn77GldvWTzt-fX6nGeWczLfZYzqHnupeECaou2FjaVTpWstEyhk7bA2iq_EQg8L6WUBk2N3CnPuPeCj8n96e4uhq-DG_Z6Gw6xTy81SmRQqDLH5MKTK_Uchui83sWmM_FbM9BHcvqXnD6S02dyKXR3CjXOuX8BBqBQ8h9aaGhD</recordid><startdate>20230401</startdate><enddate>20230401</enddate><creator>Colgan, Evan G.</creator><creator>Schleupen, Kai</creator><creator>Mann, Phillip</creator><creator>Kuder, Robert</creator><creator>Nah, Jae-Woong</creator><creator>Sakuma, Katsuyuki</creator><creator>Alvarez, Victor</creator><creator>Turlapati, Lavanya</creator><creator>Wong, Danny</creator><creator>Lukashov, Stanislav</creator><creator>Cordes, Steve</creator><creator>Speidell, James</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. 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| source | IEEE Electronic Library (IEL) |
| subjects | Coolants Coolers Cooling Frit Glass Heat transfer coefficients High power density Lead liquid cooling Manifolds Microchannels Semiconductor device modeling Silicon Tin wafer-scale integration |
| title | Fabrication and Performance of 300 mm Wafer Scale Silicon Microchannel Cooler |
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