Solid/Solid State Interfacial Reactions in the Sn-9Zn/Cu-Based Alloys (C1990 HP, Alloy 25, and C194) Couples
We investigated the kinetics of the intermetallic compound (IMC) growth during the solid/solid state reaction at 125–175°C for 100–2000 h between Sn-9 wt.% Zn (SZ) with Cu-3.28 wt.%Ti (C1990 HP), Cu-2.0 wt.% Be (Alloy 25), and Cu-2.3 wt.% Fe (C194) alloys, respectively. The results revealed that bot...
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| Veröffentlicht in: | JOM (1989) 2023-06, Vol.75 (6), p.1889-1901 |
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| container_title | JOM (1989) |
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| creator | Laksono, Andromeda Dwi Al-Audhah, Lutfi Yunus Wahab Chen, Chih-Ming Ho, Yu Xuan Yen, Yee-Wen |
| description | We investigated the kinetics of the intermetallic compound (IMC) growth during the solid/solid state reaction at 125–175°C for 100–2000 h between Sn-9 wt.% Zn (SZ) with Cu-3.28 wt.%Ti (C1990 HP), Cu-2.0 wt.% Be (Alloy 25), and Cu-2.3 wt.% Fe (C194) alloys, respectively. The results revealed that both the CuZn
5
and Cu
5
Zn
8
phases were formed at early stage and the CuZn
5
phase was transformed to the Cu
5
Zn
8
phase when the aging temperature and time were increased in the SZ/C1990 HP couples. The CuZn
5
and Cu
5
Zn
8
phases were formed, and no phase transformation was observed in the SZ/Alloy 25 couples. In the SZ/C194 couples, only Cu
5
Zn
8
phase formed at early stage of aging. The Sn tunneling phenomena promoted Cu-Sn IMC formed at a higher temperature and longer aging time. The Cu
6
Sn
5
phase was formed around the Sn-rich matrix and consumed the Cu atom from the C194 substrate. A diffusion-controlled mechanism was responsible for IMC growth in all couples. The activation energy for overall IMCs was 51.1 kJ/mol on SZ/C1990 HP, 45.7 kJ/mol on SZ/Alloy 25 couples, and 87.0 kJ/mol on SZ/C194. |
| doi_str_mv | 10.1007/s11837-023-05827-1 |
| format | Article |
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5
and Cu
5
Zn
8
phases were formed at early stage and the CuZn
5
phase was transformed to the Cu
5
Zn
8
phase when the aging temperature and time were increased in the SZ/C1990 HP couples. The CuZn
5
and Cu
5
Zn
8
phases were formed, and no phase transformation was observed in the SZ/Alloy 25 couples. In the SZ/C194 couples, only Cu
5
Zn
8
phase formed at early stage of aging. The Sn tunneling phenomena promoted Cu-Sn IMC formed at a higher temperature and longer aging time. The Cu
6
Sn
5
phase was formed around the Sn-rich matrix and consumed the Cu atom from the C194 substrate. A diffusion-controlled mechanism was responsible for IMC growth in all couples. The activation energy for overall IMCs was 51.1 kJ/mol on SZ/C1990 HP, 45.7 kJ/mol on SZ/Alloy 25 couples, and 87.0 kJ/mol on SZ/C194.</description><identifier>ISSN: 1047-4838</identifier><identifier>EISSN: 1543-1851</identifier><identifier>DOI: 10.1007/s11837-023-05827-1</identifier><language>eng</language><publisher>New York: Springer US</publisher><subject>Advanced Technology for Electronic Packaging and Interconnection Materials ; Aging ; Alloys ; Chemistry/Food Science ; Copper ; Copper base alloys ; Earth Sciences ; Engineering ; Environment ; Hydrochloric acid ; Interface reactions ; Intermetallic compounds ; Mechanical properties ; Phase transitions ; Physics ; Solid state ; Substrates ; Temperature ; Thermal cycling ; Tin</subject><ispartof>JOM (1989), 2023-06, Vol.75 (6), p.1889-1901</ispartof><rights>The Minerals, Metals & Materials Society 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.</rights><rights>Copyright Springer Nature B.V. Jun 2023</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c319t-55b4459fc126523b21dca43444c9ba2db5181ccf44a3dc5a82b5ee723043eacf3</citedby><cites>FETCH-LOGICAL-c319t-55b4459fc126523b21dca43444c9ba2db5181ccf44a3dc5a82b5ee723043eacf3</cites><orcidid>0000-0001-6469-6666</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s11837-023-05827-1$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s11837-023-05827-1$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,776,780,27901,27902,41464,42533,51294</link.rule.ids></links><search><creatorcontrib>Laksono, Andromeda Dwi</creatorcontrib><creatorcontrib>Al-Audhah, Lutfi Yunus Wahab</creatorcontrib><creatorcontrib>Chen, Chih-Ming</creatorcontrib><creatorcontrib>Ho, Yu Xuan</creatorcontrib><creatorcontrib>Yen, Yee-Wen</creatorcontrib><title>Solid/Solid State Interfacial Reactions in the Sn-9Zn/Cu-Based Alloys (C1990 HP, Alloy 25, and C194) Couples</title><title>JOM (1989)</title><addtitle>JOM</addtitle><description>We investigated the kinetics of the intermetallic compound (IMC) growth during the solid/solid state reaction at 125–175°C for 100–2000 h between Sn-9 wt.% Zn (SZ) with Cu-3.28 wt.%Ti (C1990 HP), Cu-2.0 wt.% Be (Alloy 25), and Cu-2.3 wt.% Fe (C194) alloys, respectively. The results revealed that both the CuZn
5
and Cu
5
Zn
8
phases were formed at early stage and the CuZn
5
phase was transformed to the Cu
5
Zn
8
phase when the aging temperature and time were increased in the SZ/C1990 HP couples. The CuZn
5
and Cu
5
Zn
8
phases were formed, and no phase transformation was observed in the SZ/Alloy 25 couples. In the SZ/C194 couples, only Cu
5
Zn
8
phase formed at early stage of aging. The Sn tunneling phenomena promoted Cu-Sn IMC formed at a higher temperature and longer aging time. The Cu
6
Sn
5
phase was formed around the Sn-rich matrix and consumed the Cu atom from the C194 substrate. A diffusion-controlled mechanism was responsible for IMC growth in all couples. The activation energy for overall IMCs was 51.1 kJ/mol on SZ/C1990 HP, 45.7 kJ/mol on SZ/Alloy 25 couples, and 87.0 kJ/mol on SZ/C194.</description><subject>Advanced Technology for Electronic Packaging and Interconnection Materials</subject><subject>Aging</subject><subject>Alloys</subject><subject>Chemistry/Food Science</subject><subject>Copper</subject><subject>Copper base alloys</subject><subject>Earth Sciences</subject><subject>Engineering</subject><subject>Environment</subject><subject>Hydrochloric acid</subject><subject>Interface reactions</subject><subject>Intermetallic compounds</subject><subject>Mechanical properties</subject><subject>Phase transitions</subject><subject>Physics</subject><subject>Solid state</subject><subject>Substrates</subject><subject>Temperature</subject><subject>Thermal cycling</subject><subject>Tin</subject><issn>1047-4838</issn><issn>1543-1851</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2023</creationdate><recordtype>article</recordtype><sourceid>BENPR</sourceid><recordid>eNp9kE9LAzEQxYMoWKtfwFPAi0JjM_nTTY51USsUFKsXLyGbzeqWdbcm20O_vbErePMyMzzeb2Z4CJ0DvQZKs2kEUDwjlHFCpWIZgQM0Aik4ASXhMM1UZEQoro7RSYxrmiChYYSaVdfU5XRf8aq3vccPbe9DZV1tG_zsrevrro24bnH_4fGqJfqtneZbcmOjL_G8abpdxJc5aE3x4mkyKJjJCbZtiZMurnDebTeNj6foqLJN9Ge_fYxe725f8gVZPt4_5PMlcRx0T6QshJC6csBmkvGCQems4EIIpwvLykKCAucqISwvnbSKFdL7jHEqePq34mN0MezdhO5r62Nv1t02tOmkYQqUzpiY8eRig8uFLsbgK7MJ9acNOwPU_KRqhlRNStXsUzWQID5AMZnbdx_-Vv9DfQO_mXZr</recordid><startdate>20230601</startdate><enddate>20230601</enddate><creator>Laksono, Andromeda Dwi</creator><creator>Al-Audhah, Lutfi Yunus Wahab</creator><creator>Chen, Chih-Ming</creator><creator>Ho, Yu Xuan</creator><creator>Yen, Yee-Wen</creator><general>Springer US</general><general>Springer Nature B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>3V.</scope><scope>4T-</scope><scope>4U-</scope><scope>7SR</scope><scope>7TA</scope><scope>7WY</scope><scope>7XB</scope><scope>883</scope><scope>88I</scope><scope>8BQ</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>8FK</scope><scope>8FL</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BEZIV</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>FRNLG</scope><scope>GNUQQ</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>K60</scope><scope>K6~</scope><scope>KB.</scope><scope>L.-</scope><scope>M0F</scope><scope>M2P</scope><scope>PDBOC</scope><scope>PQBIZ</scope><scope>PQBZA</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>Q9U</scope><scope>S0X</scope><orcidid>https://orcid.org/0000-0001-6469-6666</orcidid></search><sort><creationdate>20230601</creationdate><title>Solid/Solid State Interfacial Reactions in the Sn-9Zn/Cu-Based Alloys (C1990 HP, Alloy 25, and C194) Couples</title><author>Laksono, Andromeda Dwi ; Al-Audhah, Lutfi Yunus Wahab ; Chen, Chih-Ming ; Ho, Yu Xuan ; Yen, Yee-Wen</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c319t-55b4459fc126523b21dca43444c9ba2db5181ccf44a3dc5a82b5ee723043eacf3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2023</creationdate><topic>Advanced Technology for Electronic Packaging and Interconnection Materials</topic><topic>Aging</topic><topic>Alloys</topic><topic>Chemistry/Food Science</topic><topic>Copper</topic><topic>Copper base alloys</topic><topic>Earth Sciences</topic><topic>Engineering</topic><topic>Environment</topic><topic>Hydrochloric acid</topic><topic>Interface reactions</topic><topic>Intermetallic compounds</topic><topic>Mechanical properties</topic><topic>Phase transitions</topic><topic>Physics</topic><topic>Solid state</topic><topic>Substrates</topic><topic>Temperature</topic><topic>Thermal cycling</topic><topic>Tin</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Laksono, Andromeda Dwi</creatorcontrib><creatorcontrib>Al-Audhah, Lutfi Yunus Wahab</creatorcontrib><creatorcontrib>Chen, Chih-Ming</creatorcontrib><creatorcontrib>Ho, Yu Xuan</creatorcontrib><creatorcontrib>Yen, Yee-Wen</creatorcontrib><collection>CrossRef</collection><collection>ProQuest Central (Corporate)</collection><collection>Docstoc</collection><collection>University Readers</collection><collection>Engineered Materials Abstracts</collection><collection>Materials Business File</collection><collection>ABI/INFORM Collection</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>ABI/INFORM Trade & Industry (Alumni Edition)</collection><collection>Science Database (Alumni Edition)</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central (Alumni) (purchase pre-March 2016)</collection><collection>ABI/INFORM Collection (Alumni Edition)</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest Central UK/Ireland</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Business Premium Collection</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>Business Premium Collection (Alumni)</collection><collection>ProQuest Central Student</collection><collection>SciTech Premium Collection</collection><collection>Materials Research Database</collection><collection>ProQuest Business Collection (Alumni Edition)</collection><collection>ProQuest Business Collection</collection><collection>Materials Science Database</collection><collection>ABI/INFORM Professional Advanced</collection><collection>ABI/INFORM Trade & Industry</collection><collection>Science Database</collection><collection>Materials Science Collection</collection><collection>ProQuest One Business</collection><collection>ProQuest One Business (Alumni)</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central Basic</collection><collection>SIRS Editorial</collection><jtitle>JOM (1989)</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Laksono, Andromeda Dwi</au><au>Al-Audhah, Lutfi Yunus Wahab</au><au>Chen, Chih-Ming</au><au>Ho, Yu Xuan</au><au>Yen, Yee-Wen</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Solid/Solid State Interfacial Reactions in the Sn-9Zn/Cu-Based Alloys (C1990 HP, Alloy 25, and C194) Couples</atitle><jtitle>JOM (1989)</jtitle><stitle>JOM</stitle><date>2023-06-01</date><risdate>2023</risdate><volume>75</volume><issue>6</issue><spage>1889</spage><epage>1901</epage><pages>1889-1901</pages><issn>1047-4838</issn><eissn>1543-1851</eissn><abstract>We investigated the kinetics of the intermetallic compound (IMC) growth during the solid/solid state reaction at 125–175°C for 100–2000 h between Sn-9 wt.% Zn (SZ) with Cu-3.28 wt.%Ti (C1990 HP), Cu-2.0 wt.% Be (Alloy 25), and Cu-2.3 wt.% Fe (C194) alloys, respectively. The results revealed that both the CuZn
5
and Cu
5
Zn
8
phases were formed at early stage and the CuZn
5
phase was transformed to the Cu
5
Zn
8
phase when the aging temperature and time were increased in the SZ/C1990 HP couples. The CuZn
5
and Cu
5
Zn
8
phases were formed, and no phase transformation was observed in the SZ/Alloy 25 couples. In the SZ/C194 couples, only Cu
5
Zn
8
phase formed at early stage of aging. The Sn tunneling phenomena promoted Cu-Sn IMC formed at a higher temperature and longer aging time. The Cu
6
Sn
5
phase was formed around the Sn-rich matrix and consumed the Cu atom from the C194 substrate. A diffusion-controlled mechanism was responsible for IMC growth in all couples. The activation energy for overall IMCs was 51.1 kJ/mol on SZ/C1990 HP, 45.7 kJ/mol on SZ/Alloy 25 couples, and 87.0 kJ/mol on SZ/C194.</abstract><cop>New York</cop><pub>Springer US</pub><doi>10.1007/s11837-023-05827-1</doi><tpages>13</tpages><orcidid>https://orcid.org/0000-0001-6469-6666</orcidid></addata></record> |
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| source | SpringerLink Journals - AutoHoldings |
| subjects | Advanced Technology for Electronic Packaging and Interconnection Materials Aging Alloys Chemistry/Food Science Copper Copper base alloys Earth Sciences Engineering Environment Hydrochloric acid Interface reactions Intermetallic compounds Mechanical properties Phase transitions Physics Solid state Substrates Temperature Thermal cycling Tin |
| title | Solid/Solid State Interfacial Reactions in the Sn-9Zn/Cu-Based Alloys (C1990 HP, Alloy 25, and C194) Couples |
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