Comparison of Electroless Ni-P and Co-W-P Diffusion Properties Against GaAs Substrate

The thermal stability of electroless nickel-phosphorus (Ni-P) film and cobalt-tungsten–phosphorus (Co-W-P) film deposited on GaAs substrate was investigated. X-ray photoelectron spectroscopy and x-ray diffraction measurements indicated that the Ni-P film changed from amorphous to crystalline by anne...

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Veröffentlicht in:Journal of electronic materials 2023-06, Vol.52 (6), p.4080-4090
Hauptverfasser: Nishizawa, Koichiro, Matsumoto, Ayumu, Nakagawa, Yasuyuki, Sakuma, Hitoshi, Goto, Seiki, Fukumuro, Naoki, Yae, Shinji
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container_end_page 4090
container_issue 6
container_start_page 4080
container_title Journal of electronic materials
container_volume 52
creator Nishizawa, Koichiro
Matsumoto, Ayumu
Nakagawa, Yasuyuki
Sakuma, Hitoshi
Goto, Seiki
Fukumuro, Naoki
Yae, Shinji
description The thermal stability of electroless nickel-phosphorus (Ni-P) film and cobalt-tungsten–phosphorus (Co-W-P) film deposited on GaAs substrate was investigated. X-ray photoelectron spectroscopy and x-ray diffraction measurements indicated that the Ni-P film changed from amorphous to crystalline by annealing at 240°C for 1 h due to the diffusion of Ni into the GaAs substrate and the increase in P concentration in the Ni-P film. On the other hand, the crystallinity of the Co-W-P film did not change by annealing at 240°C for 1 h. Cross-sectional observation showed that the thickness of the crystallized Ni-P film did not change from 3 to 1000 h of high-temperature storage at 270°C, and no void was observed in the Ni-P film. Migration of Ni atoms could be suppressed by the crystallization of the Ni-P film. On the other hand, voids were formed in the Co-W-P film after high-temperature storage at 270°C for 100 h. Since the Co-W-P film consists of nanoscale crystalline and amorphous phases, atoms diffuse from the amorphous portion to the GaAs substrate. Graphical Abstract
doi_str_mv 10.1007/s11664-023-10380-3
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X-ray photoelectron spectroscopy and x-ray diffraction measurements indicated that the Ni-P film changed from amorphous to crystalline by annealing at 240°C for 1 h due to the diffusion of Ni into the GaAs substrate and the increase in P concentration in the Ni-P film. On the other hand, the crystallinity of the Co-W-P film did not change by annealing at 240°C for 1 h. Cross-sectional observation showed that the thickness of the crystallized Ni-P film did not change from 3 to 1000 h of high-temperature storage at 270°C, and no void was observed in the Ni-P film. Migration of Ni atoms could be suppressed by the crystallization of the Ni-P film. On the other hand, voids were formed in the Co-W-P film after high-temperature storage at 270°C for 100 h. Since the Co-W-P film consists of nanoscale crystalline and amorphous phases, atoms diffuse from the amorphous portion to the GaAs substrate. 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Electron. Mater</addtitle><description>The thermal stability of electroless nickel-phosphorus (Ni-P) film and cobalt-tungsten–phosphorus (Co-W-P) film deposited on GaAs substrate was investigated. X-ray photoelectron spectroscopy and x-ray diffraction measurements indicated that the Ni-P film changed from amorphous to crystalline by annealing at 240°C for 1 h due to the diffusion of Ni into the GaAs substrate and the increase in P concentration in the Ni-P film. On the other hand, the crystallinity of the Co-W-P film did not change by annealing at 240°C for 1 h. Cross-sectional observation showed that the thickness of the crystallized Ni-P film did not change from 3 to 1000 h of high-temperature storage at 270°C, and no void was observed in the Ni-P film. Migration of Ni atoms could be suppressed by the crystallization of the Ni-P film. On the other hand, voids were formed in the Co-W-P film after high-temperature storage at 270°C for 100 h. Since the Co-W-P film consists of nanoscale crystalline and amorphous phases, atoms diffuse from the amorphous portion to the GaAs substrate. 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Electron. Mater</stitle><date>2023-06-01</date><risdate>2023</risdate><volume>52</volume><issue>6</issue><spage>4080</spage><epage>4090</epage><pages>4080-4090</pages><issn>0361-5235</issn><eissn>1543-186X</eissn><abstract>The thermal stability of electroless nickel-phosphorus (Ni-P) film and cobalt-tungsten–phosphorus (Co-W-P) film deposited on GaAs substrate was investigated. X-ray photoelectron spectroscopy and x-ray diffraction measurements indicated that the Ni-P film changed from amorphous to crystalline by annealing at 240°C for 1 h due to the diffusion of Ni into the GaAs substrate and the increase in P concentration in the Ni-P film. On the other hand, the crystallinity of the Co-W-P film did not change by annealing at 240°C for 1 h. Cross-sectional observation showed that the thickness of the crystallized Ni-P film did not change from 3 to 1000 h of high-temperature storage at 270°C, and no void was observed in the Ni-P film. Migration of Ni atoms could be suppressed by the crystallization of the Ni-P film. On the other hand, voids were formed in the Co-W-P film after high-temperature storage at 270°C for 100 h. Since the Co-W-P film consists of nanoscale crystalline and amorphous phases, atoms diffuse from the amorphous portion to the GaAs substrate. Graphical Abstract</abstract><cop>New York</cop><pub>Springer US</pub><doi>10.1007/s11664-023-10380-3</doi><tpages>11</tpages><orcidid>https://orcid.org/0000-0003-1181-4811</orcidid><orcidid>https://orcid.org/0000-0002-4077-6757</orcidid><orcidid>https://orcid.org/0000-0002-8607-7476</orcidid><orcidid>https://orcid.org/0000-0002-7731-4150</orcidid></addata></record>
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source Springer Nature - Complete Springer Journals
subjects Annealing
Atomic properties
Atoms & subatomic particles
Characterization and Evaluation of Materials
Chemistry and Materials Science
Cobalt
Crystallization
Diffusion
Electrodes
Electronics and Microelectronics
Gallium arsenide
High temperature
Instrumentation
Ion beams
Materials Science
Nickel
Optical and Electronic Materials
Original Research Article
Phosphorus
Photoelectrons
Plating
Radiation
Solid State Physics
Spectrum analysis
Substrates
Thermal stability
Transistors
title Comparison of Electroless Ni-P and Co-W-P Diffusion Properties Against GaAs Substrate
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