Enhancing thermal conductivity of epoxy composites via f‐BN@f‐MgO hybrid fillers assisted by hot pressing

High thermal conductive polymeric composites are extremely desired for the thermal management of electronic devices due to the rapid development of the modern microelectronic industry. Herein, the functionalized boron nitride (BN) and magnesium oxide (MgO) hybrid fillers (f‐BN@f‐MgO) were synthesize...

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Veröffentlicht in:	Polymer composites 2023-05, Vol.44 (5), p.2966-2976
Hauptverfasser:	Wu, Xudong, Yu, Haojie, Wang, Li, Meng, Xingguang, Huang, Zhikun, Liu, Xiaowei, Gong, Xiaodan, Liu, Jinyi
Format:	Artikel
Sprache:	eng
Schlagworte:	Boron nitride Composite materials Electronic devices epoxy composite Fillers Heat transfer Hot pressing hybrid filler Magnesium oxide Superconductors (materials) surface modification Thermal conductivity Thermal management Thermal resistance Thermal stability
Online-Zugang:	Volltext
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