Pulse-pressure diffusion bonding of Ti-6Al-4 V alloy with nanostructured Cu-W multilayer film as interlayer

Nano-multilayer films have demonstrated high viability as filler metals for low-temperature bonding applications. This article proposes a novel Cu/W nano-multilayer film as filler material for pulsed pressure diffusion bonding of Ti-6Al-4 V alloy. Cu/W nano-multilayer filler metal with a single layer thickness of 4 μm had a modulation ratio of 1:1. The effect of heating rate on the properties of joints was investigated. The typical joint structure was mainly composed of Ti-6Al-4 V base metal region, Cu x Ti y intermetallic compound mixed region, and Cu/W elemental region. By increasing the rate of heating, Cu diffused into the Ti-6Al-4 V base metal, reducing the formation of brittle compounds in the bonding and enhancing the tensile strength of the joint. At the heating rate of 30 ℃/s, the tensile strength of joint reached a maximum of 76.7 MPa. Cu/W nano-multilayer film has excellent potential for rapid diffusion bonding application.