3D modeling of inductive and capacitive coupling between surface‐mounted multilayer‐capacitors
Electronic based systems (EBS) tend to become smaller in size while at the same time their functionality, complexity, and operating frequencies increase. Therefore, accurate and broadband characterization of the electric behavior of the components of such EBS is becoming more and more important for...
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Veröffentlicht in: | International journal of numerical modelling 2023-05, Vol.36 (3), p.n/a |
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Hauptverfasser: | , , , , , , , , |
Format: | Artikel |
Sprache: | eng |
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