Additive manufacturing of polyaniline blends for lightweight structures with tunable conductivity
Printable feedstocks that can produce lightweight, robust, and ductile structures with tunable and switchable conductivity are of considerable interest for numerous application spaces. Combining the specific properties of commodity thermoplastics with the unique electrical and redox properties of co...
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| Veröffentlicht in: | Journal of materials chemistry. C, Materials for optical and electronic devices Materials for optical and electronic devices, 2023-03, Vol.11 (13), p.444-4414 |
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| container_title | Journal of materials chemistry. C, Materials for optical and electronic devices |
| container_volume | 11 |
| creator | DiTullio, Brandon T Kuang, Xiao Österholm, Anna M Lang, Augustus W Kinlen, Patrick J Stingelin, Natalie Qi, H. Jerry Reynolds, John R |
| description | Printable feedstocks that can produce lightweight, robust, and ductile structures with tunable and switchable conductivity are of considerable interest for numerous application spaces. Combining the specific properties of commodity thermoplastics with the unique electrical and redox properties of conducting polymers (CPs) presents new opportunities for the field of printed (bio)electronics. Here, we report on the direct ink write (DIW) printing of ink formulations based on polyaniline-dinonylnaphthalene sulfonic acid (PANI-DNNSA), which has been synthesized in bulk quantities (∼400 g). DNNSA imparts solubility to PANI up to 50 mg mL
−1
, which allows the use of various additives to tune the rheological behavior of the inks without significantly compromising the electrical properties of the printed structures, which reach conductivities in the range of |
| doi_str_mv | 10.1039/d2tc04183a |
| format | Article |
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−1
, which allows the use of various additives to tune the rheological behavior of the inks without significantly compromising the electrical properties of the printed structures, which reach conductivities in the range of <10
−7
-10
0
S cm
−1
as a function of ink formulation and post treatment used. Fumed silica (FS) and ultra-high molecular weight polystyrene (UHMW-PS) additives are leveraged to endow printability and shape retention to inks, as well as to compare the use of traditional rheological modifiers with commodity thermoplastics on CP feedstocks for tailored DIW printing. We show that the incorporation of UHMW-PS into these ink formulations is critical for obtaining high crack resistance in printed structures. This work serves as a guide for future ink designs of CPs with commodity thermoplastics and their subsequent DIW printing to yield conductive architectures and devices for various applications.
Printable feedstocks that can produce lightweight, robust, and ductile structures with tunable and switchable conductivity are of considerable interest for numerous application spaces.</description><identifier>ISSN: 2050-7526</identifier><identifier>EISSN: 2050-7534</identifier><identifier>DOI: 10.1039/d2tc04183a</identifier><language>eng</language><publisher>Cambridge: Royal Society of Chemistry</publisher><subject>Additives ; Commodities ; Conducting polymers ; Crack propagation ; Electrical properties ; Formulations ; Inks ; Lightweight ; Polyanilines ; Polystyrene resins ; Printing ; Raw materials ; Rheological properties ; Rheology ; Silica fume ; Sulfonic acid ; Thermoplastic resins</subject><ispartof>Journal of materials chemistry. C, Materials for optical and electronic devices, 2023-03, Vol.11 (13), p.444-4414</ispartof><rights>Copyright Royal Society of Chemistry 2023</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c281t-ea3e5a2cc42ca0e57accf01d09506b70b1677a92677850fbb10e846938e6a5b83</citedby><cites>FETCH-LOGICAL-c281t-ea3e5a2cc42ca0e57accf01d09506b70b1677a92677850fbb10e846938e6a5b83</cites><orcidid>0000-0002-1414-4545 ; 0000-0002-3212-5284 ; 0000-0002-7417-4869 ; 0000-0001-6621-8238</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,27924,27925</link.rule.ids></links><search><creatorcontrib>DiTullio, Brandon T</creatorcontrib><creatorcontrib>Kuang, Xiao</creatorcontrib><creatorcontrib>Österholm, Anna M</creatorcontrib><creatorcontrib>Lang, Augustus W</creatorcontrib><creatorcontrib>Kinlen, Patrick J</creatorcontrib><creatorcontrib>Stingelin, Natalie</creatorcontrib><creatorcontrib>Qi, H. Jerry</creatorcontrib><creatorcontrib>Reynolds, John R</creatorcontrib><title>Additive manufacturing of polyaniline blends for lightweight structures with tunable conductivity</title><title>Journal of materials chemistry. C, Materials for optical and electronic devices</title><description>Printable feedstocks that can produce lightweight, robust, and ductile structures with tunable and switchable conductivity are of considerable interest for numerous application spaces. Combining the specific properties of commodity thermoplastics with the unique electrical and redox properties of conducting polymers (CPs) presents new opportunities for the field of printed (bio)electronics. Here, we report on the direct ink write (DIW) printing of ink formulations based on polyaniline-dinonylnaphthalene sulfonic acid (PANI-DNNSA), which has been synthesized in bulk quantities (∼400 g). DNNSA imparts solubility to PANI up to 50 mg mL
−1
, which allows the use of various additives to tune the rheological behavior of the inks without significantly compromising the electrical properties of the printed structures, which reach conductivities in the range of <10
−7
-10
0
S cm
−1
as a function of ink formulation and post treatment used. Fumed silica (FS) and ultra-high molecular weight polystyrene (UHMW-PS) additives are leveraged to endow printability and shape retention to inks, as well as to compare the use of traditional rheological modifiers with commodity thermoplastics on CP feedstocks for tailored DIW printing. We show that the incorporation of UHMW-PS into these ink formulations is critical for obtaining high crack resistance in printed structures. This work serves as a guide for future ink designs of CPs with commodity thermoplastics and their subsequent DIW printing to yield conductive architectures and devices for various applications.
Printable feedstocks that can produce lightweight, robust, and ductile structures with tunable and switchable conductivity are of considerable interest for numerous application spaces.</description><subject>Additives</subject><subject>Commodities</subject><subject>Conducting polymers</subject><subject>Crack propagation</subject><subject>Electrical properties</subject><subject>Formulations</subject><subject>Inks</subject><subject>Lightweight</subject><subject>Polyanilines</subject><subject>Polystyrene resins</subject><subject>Printing</subject><subject>Raw materials</subject><subject>Rheological properties</subject><subject>Rheology</subject><subject>Silica fume</subject><subject>Sulfonic acid</subject><subject>Thermoplastic resins</subject><issn>2050-7526</issn><issn>2050-7534</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2023</creationdate><recordtype>article</recordtype><recordid>eNpFkM1LAzEQxYMoWGov3oWAN2F1kmyy2WOpn1DwUs9LNpu0KdtsTbIt_e_dWqlzeDMwv3kDD6FbAo8EWPnU0KQhJ5KpCzSiwCErOMsvzzMV12gS4xqGkkRIUY6QmjaNS25n8Eb53iqd-uD8EncWb7v2oLxrnTe4bo1vIrZdwK1brtLeHBXHFPrjhYl479IKp96rAcW6882wcDuXDjfoyqo2mslfH6Ov15fF7D2bf759zKbzTFNJUmYUM1xRrXOqFRheKK0tkAZKDqIuoCaiKFRJB5UcbF0TMDIXJZNGKF5LNkb3J99t6L57E1O17vrgh5cVLUqaQ55zNlAPJ0qHLsZgbLUNbqPCoSJQHVOsnuli9pvidIDvTnCI-sz9p8x-AMqycE4</recordid><startdate>20230330</startdate><enddate>20230330</enddate><creator>DiTullio, Brandon T</creator><creator>Kuang, Xiao</creator><creator>Österholm, Anna M</creator><creator>Lang, Augustus W</creator><creator>Kinlen, Patrick J</creator><creator>Stingelin, Natalie</creator><creator>Qi, H. Jerry</creator><creator>Reynolds, John R</creator><general>Royal Society of Chemistry</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7U5</scope><scope>8FD</scope><scope>L7M</scope><orcidid>https://orcid.org/0000-0002-1414-4545</orcidid><orcidid>https://orcid.org/0000-0002-3212-5284</orcidid><orcidid>https://orcid.org/0000-0002-7417-4869</orcidid><orcidid>https://orcid.org/0000-0001-6621-8238</orcidid></search><sort><creationdate>20230330</creationdate><title>Additive manufacturing of polyaniline blends for lightweight structures with tunable conductivity</title><author>DiTullio, Brandon T ; Kuang, Xiao ; Österholm, Anna M ; Lang, Augustus W ; Kinlen, Patrick J ; Stingelin, Natalie ; Qi, H. Jerry ; Reynolds, John R</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c281t-ea3e5a2cc42ca0e57accf01d09506b70b1677a92677850fbb10e846938e6a5b83</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2023</creationdate><topic>Additives</topic><topic>Commodities</topic><topic>Conducting polymers</topic><topic>Crack propagation</topic><topic>Electrical properties</topic><topic>Formulations</topic><topic>Inks</topic><topic>Lightweight</topic><topic>Polyanilines</topic><topic>Polystyrene resins</topic><topic>Printing</topic><topic>Raw materials</topic><topic>Rheological properties</topic><topic>Rheology</topic><topic>Silica fume</topic><topic>Sulfonic acid</topic><topic>Thermoplastic resins</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>DiTullio, Brandon T</creatorcontrib><creatorcontrib>Kuang, Xiao</creatorcontrib><creatorcontrib>Österholm, Anna M</creatorcontrib><creatorcontrib>Lang, Augustus W</creatorcontrib><creatorcontrib>Kinlen, Patrick J</creatorcontrib><creatorcontrib>Stingelin, Natalie</creatorcontrib><creatorcontrib>Qi, H. 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C, Materials for optical and electronic devices</jtitle><date>2023-03-30</date><risdate>2023</risdate><volume>11</volume><issue>13</issue><spage>444</spage><epage>4414</epage><pages>444-4414</pages><issn>2050-7526</issn><eissn>2050-7534</eissn><abstract>Printable feedstocks that can produce lightweight, robust, and ductile structures with tunable and switchable conductivity are of considerable interest for numerous application spaces. Combining the specific properties of commodity thermoplastics with the unique electrical and redox properties of conducting polymers (CPs) presents new opportunities for the field of printed (bio)electronics. Here, we report on the direct ink write (DIW) printing of ink formulations based on polyaniline-dinonylnaphthalene sulfonic acid (PANI-DNNSA), which has been synthesized in bulk quantities (∼400 g). DNNSA imparts solubility to PANI up to 50 mg mL
−1
, which allows the use of various additives to tune the rheological behavior of the inks without significantly compromising the electrical properties of the printed structures, which reach conductivities in the range of <10
−7
-10
0
S cm
−1
as a function of ink formulation and post treatment used. Fumed silica (FS) and ultra-high molecular weight polystyrene (UHMW-PS) additives are leveraged to endow printability and shape retention to inks, as well as to compare the use of traditional rheological modifiers with commodity thermoplastics on CP feedstocks for tailored DIW printing. We show that the incorporation of UHMW-PS into these ink formulations is critical for obtaining high crack resistance in printed structures. This work serves as a guide for future ink designs of CPs with commodity thermoplastics and their subsequent DIW printing to yield conductive architectures and devices for various applications.
Printable feedstocks that can produce lightweight, robust, and ductile structures with tunable and switchable conductivity are of considerable interest for numerous application spaces.</abstract><cop>Cambridge</cop><pub>Royal Society of Chemistry</pub><doi>10.1039/d2tc04183a</doi><tpages>11</tpages><orcidid>https://orcid.org/0000-0002-1414-4545</orcidid><orcidid>https://orcid.org/0000-0002-3212-5284</orcidid><orcidid>https://orcid.org/0000-0002-7417-4869</orcidid><orcidid>https://orcid.org/0000-0001-6621-8238</orcidid></addata></record> |
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| ispartof | Journal of materials chemistry. C, Materials for optical and electronic devices, 2023-03, Vol.11 (13), p.444-4414 |
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| language | eng |
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| source | Royal Society Of Chemistry Journals 2008- |
| subjects | Additives Commodities Conducting polymers Crack propagation Electrical properties Formulations Inks Lightweight Polyanilines Polystyrene resins Printing Raw materials Rheological properties Rheology Silica fume Sulfonic acid Thermoplastic resins |
| title | Additive manufacturing of polyaniline blends for lightweight structures with tunable conductivity |
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