Guest Editorial
This Special Issue of IEEE Transactions on Microwave Theory and Techniques (TMTT) is comprised of the extended papers from the 2022 IEEE Microwave Theory and Technology Society (IEEE MTT-S) International Microwave Symposium (IMS2022), held in Denver, CO, USA, in June 2022. The IEEE MTT-S Internation...
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Veröffentlicht in: | IEEE transactions on microwave theory and techniques 2023-01, Vol.71 (1), p.157 |
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description | This Special Issue of IEEE Transactions on Microwave Theory and Techniques (TMTT) is comprised of the extended papers from the 2022 IEEE Microwave Theory and Technology Society (IEEE MTT-S) International Microwave Symposium (IMS2022), held in Denver, CO, USA, in June 2022. The IEEE MTT-S International Microwave Symposium is the world’s major event on microwave technologies annually organized by the IEEE MTT-S as the society’s premier flagship conference. The conference represents a unique opportunity to bring together researchers and practitioners with diverse technical backgrounds to share the most recent advances in MHz-to-THz technologies and systems. After two years of the COVID-19 pandemic, IMS2022 came back to being an in-person-only event that was held on June 19–24, 2022, at the Colorado Convention Center, Denver. |
doi_str_mv | 10.1109/TMTT.2022.3228625 |
format | Article |
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The IEEE MTT-S International Microwave Symposium is the world’s major event on microwave technologies annually organized by the IEEE MTT-S as the society’s premier flagship conference. The conference represents a unique opportunity to bring together researchers and practitioners with diverse technical backgrounds to share the most recent advances in MHz-to-THz technologies and systems. After two years of the COVID-19 pandemic, IMS2022 came back to being an in-person-only event that was held on June 19–24, 2022, at the Colorado Convention Center, Denver.</description><identifier>ISSN: 0018-9480</identifier><identifier>EISSN: 1557-9670</identifier><identifier>DOI: 10.1109/TMTT.2022.3228625</identifier><language>eng</language><publisher>New York: The Institute of Electrical and Electronics Engineers, Inc. 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source | IEEE Electronic Library (IEL) |
title | Guest Editorial |
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