Strengthening and toughening 3D printing of photocured resins by thermal expansion microspheres
High cross‐linking density thermally cured epoxy resin typically results in brittle nature. 3D printing technology of a photocurable resin modified by thermally expandable microspheres is proposed in this paper to overcome these limitations. The addition of appropriate amounts of thermally expandabl...
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Veröffentlicht in: | Journal of applied polymer science 2023-02, Vol.140 (8), p.n/a |
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creator | Kang, Xiaoqing Li, Xiaogang Li, Yuexuan Duan, Yugang |
description | High cross‐linking density thermally cured epoxy resin typically results in brittle nature. 3D printing technology of a photocurable resin modified by thermally expandable microspheres is proposed in this paper to overcome these limitations. The addition of appropriate amounts of thermally expandable microspheres into the UV‐cured epoxy resin can improve the tensile strength, bending strength, elongation at break, and impact strength. Therefore, thermally expandable microspheres can strengthen and toughen the epoxy resin. In addition, the effects of different amounts of UV‐cured resins modified with thermally expandable microspheres on various mechanical properties are systematically analyzed. Moreover, the toughening mechanism of thermally expandable microspheres and their influence on thermal performance are also studied.
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XXX</description><subject>Bend strength</subject><subject>Elongation</subject><subject>Epoxy resins</subject><subject>Impact strength</subject><subject>Materials science</subject><subject>Mechanical properties</subject><subject>Microspheres</subject><subject>photocured resin</subject><subject>Photocuring</subject><subject>Polymers</subject><subject>Tensile strength</subject><subject>Thermal expansion</subject><subject>thermally expandable microspheres</subject><subject>Three dimensional printing</subject><subject>toughening mechanism</subject><issn>0021-8995</issn><issn>1097-4628</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2023</creationdate><recordtype>article</recordtype><recordid>eNp1kMlOwzAQhi0EEqVw4A0sceKQ1kvsxMeqrFIlKgFny0kmbarWDnYiyNvjkl45zfbN9iN0S8mMEsLmpm1nggsqz9CEEpUlqWT5OZrEGk1ypcQlugphRwilgsgJ0u-dB7vptmAbu8HGVrhz_eYU8gfc-sZ2R9_VuN26zpW9hwp7CI0NuBhwbPUHs8fw0xobGmfxoSm9C23MQ7hGF7XZB7g52Sn6fHr8WL4kq7fn1-VilZSMZTJJc5ZWFIwRKRWSmTxjtCpAiJpAbbgqGBe54kUlszI1JUAhVEpUDariIHjJp-hunNt699VD6PTO9d7GlTrOF1JkUZ5I3Y_U8cDgodbxvYPxg6ZEH_XTUT_9p19k5yP73exh-B_Ui_V67PgFHJVzNg</recordid><startdate>20230220</startdate><enddate>20230220</enddate><creator>Kang, Xiaoqing</creator><creator>Li, Xiaogang</creator><creator>Li, Yuexuan</creator><creator>Duan, Yugang</creator><general>John Wiley & Sons, Inc</general><general>Wiley Subscription Services, Inc</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20230220</creationdate><title>Strengthening and toughening 3D printing of photocured resins by thermal expansion microspheres</title><author>Kang, Xiaoqing ; Li, Xiaogang ; Li, Yuexuan ; Duan, Yugang</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c2276-4824d1eaa541562a8721dbe55f0efa39b235893bd67c4aceeb59409fe9d3e53c3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2023</creationdate><topic>Bend strength</topic><topic>Elongation</topic><topic>Epoxy resins</topic><topic>Impact strength</topic><topic>Materials science</topic><topic>Mechanical properties</topic><topic>Microspheres</topic><topic>photocured resin</topic><topic>Photocuring</topic><topic>Polymers</topic><topic>Tensile strength</topic><topic>Thermal expansion</topic><topic>thermally expandable microspheres</topic><topic>Three dimensional printing</topic><topic>toughening mechanism</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Kang, Xiaoqing</creatorcontrib><creatorcontrib>Li, Xiaogang</creatorcontrib><creatorcontrib>Li, Yuexuan</creatorcontrib><creatorcontrib>Duan, Yugang</creatorcontrib><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Journal of applied polymer science</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Kang, Xiaoqing</au><au>Li, Xiaogang</au><au>Li, Yuexuan</au><au>Duan, Yugang</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Strengthening and toughening 3D printing of photocured resins by thermal expansion microspheres</atitle><jtitle>Journal of applied polymer science</jtitle><date>2023-02-20</date><risdate>2023</risdate><volume>140</volume><issue>8</issue><epage>n/a</epage><issn>0021-8995</issn><eissn>1097-4628</eissn><abstract>High cross‐linking density thermally cured epoxy resin typically results in brittle nature. 3D printing technology of a photocurable resin modified by thermally expandable microspheres is proposed in this paper to overcome these limitations. The addition of appropriate amounts of thermally expandable microspheres into the UV‐cured epoxy resin can improve the tensile strength, bending strength, elongation at break, and impact strength. Therefore, thermally expandable microspheres can strengthen and toughen the epoxy resin. In addition, the effects of different amounts of UV‐cured resins modified with thermally expandable microspheres on various mechanical properties are systematically analyzed. Moreover, the toughening mechanism of thermally expandable microspheres and their influence on thermal performance are also studied.
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subjects | Bend strength Elongation Epoxy resins Impact strength Materials science Mechanical properties Microspheres photocured resin Photocuring Polymers Tensile strength Thermal expansion thermally expandable microspheres Three dimensional printing toughening mechanism |
title | Strengthening and toughening 3D printing of photocured resins by thermal expansion microspheres |
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