Monitoring Chip Branch Failure in Multichip IGBT Modules Based on Gate Charge

The reliability of the multichip insulated gate bipolar transistor (IGBT) modules has been a concern. Condition monitoring is an effective approach to enhance reliability and improve the quality of customer service. This article proposes a method for monitoring the chip branch failure due to bond wi...

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Veröffentlicht in:	IEEE transactions on industrial electronics (1982) 2023-05, Vol.70 (5), p.5214-5223
Hauptverfasser:	Wang, Kaihong, Sun, Pengju, Zhu, Binxin, Luo, Quanming, Du, Xiong
Format:	Artikel
Sprache:	eng
Schlagworte:	Capacitors Chip branch failure Circuits Condition monitoring Customer services Electric potential Emitters Fatigue Fatigue failure gate charge Insulated gate bipolar transistors Logic gates Modules Monitoring multichip insulated gate bipolar transistor (IGBT) modules Parameter sensitivity Reliability Reliability aspects Semiconductor devices Voltage Wires
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