Unraveling Adsorption Behaviors of Levelers for Bottom-Up Copper Filling in Through-Silicon-Via

A leveler is one of the most important additives for achieving defect-free Cu-filled through-silicon-via (TSV). In this study, we experimentally investigated TSV filling performance in the presence of three levelers, i.e., pyrrolidone, imine and diazonium. A detailed analysis of the mass change in t...

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Veröffentlicht in:	Electronic materials letters 2022-11, Vol.18 (6), p.583-591
Hauptverfasser:	Jin, SangHoon, Kim, Sung-Min, Jo, Yugeun, Lee, Woon Young, Lee, Sang-Yul, Lee, Min Hyung
Format:	Artikel
Sprache:	eng
Schlagworte:	Additives Adsorption Characterization and Evaluation of Materials Characterization and Modeling Chemistry and Materials Science Condensed Matter Physics Copper Defects Materials Science Molecular structure Nanotechnology Nanotechnology and Microengineering Optical and Electronic Materials Original Article - Theory Silicon
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