Technologies for Forming Electrodynamic Structures for Millimeter-Wave and Terahertz Vacuum Microelectronic Devices (Review)

The electrodynamic microstructure technologies for production of millimeter and submillimeter-wave vacuum microelectronic devices are reviewed, including photolithography, deep reactive ion etching, computer numerical control micro- and nanomilling, electro-erosive micromachining, and additive techn...

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Veröffentlicht in:	Journal of communications technology & electronics 2022-10, Vol.67 (10), p.1189-1197
Hauptverfasser:	Starodubov, A. V., Nozhkin, D. A., Rasulov, I. I., Serdobintsev, A. A., Kozhevnikov, I. O., Galushka, V. V., Sakharov, V. K., Bessonov, D. A., Galkin, A. D., Bakhteev, I. Sh, Molchanov, S. Yu, German, S. V., Ryskin, N. M.
Format:	Artikel
Sprache:	eng
Schlagworte:	3D printing Communications Engineering Engineering Integrated circuit fabrication Laser ablation Laser beam melting Laser sintering Magnetron sputtering Microelectronics Micromachining Millimeter waves Networks Numerical controls Photolithography Reactive ion etching Submillimeter waves Surface roughness Three dimensional printing TO THE 85th ANNIVERSARY OF N.I. SINITSYN Tolerances
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