The effect of number of chemical bonds on intrinsic adhesive strength of a silane coupling agent with metals: A first-principles study

This paper presents a comparative investigation on intrinsic adhesive strength of a silane coupling agent with metal surfaces through first-principles calculations based on density functional theory. Focusing on a typical silane coupling agent, 3-aminopropyl triethoxy silane (APS), pure copper, and...

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Veröffentlicht in:Journal of materials research 2022-02, Vol.37 (4), p.923-932
Hauptverfasser: Uetsuji, Yasutomo, Fukui, Naoki, Yagi, Takahiro, Nakamura, Yoshinobu
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container_issue 4
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creator Uetsuji, Yasutomo
Fukui, Naoki
Yagi, Takahiro
Nakamura, Yoshinobu
description This paper presents a comparative investigation on intrinsic adhesive strength of a silane coupling agent with metal surfaces through first-principles calculations based on density functional theory. Focusing on a typical silane coupling agent, 3-aminopropyl triethoxy silane (APS), pure copper, and aluminum were selected as the bonding metal. A simple interface model of the silane coupling monomer on the metal surface was constructed under a tensile loading condition. When the number of chemical bonds at the interface is one, Cu has a smaller breaking strain of the bond with oxygen in the APS molecule than Al and demonstrates lower adhesive strength. On the other hand, as the number of bonds increases, the interface becomes stronger and the failure mode changes from interfacial debonding to intramolecular cohesive fracture. As a result, the adhesive strength is improved, and the effect is remarkable especially on the Cu surface. Graphical abstract
doi_str_mv 10.1557/s43578-022-00496-3
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fullrecord <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_journals_2708280562</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>2708280562</sourcerecordid><originalsourceid>FETCH-LOGICAL-c319t-fd906d0a637888ea998bb166bc5b5d371ce1f2bd279caa014724ebaed6af9ed53</originalsourceid><addsrcrecordid>eNp9kMtOHDEQRa0oSEwgP5CVpaxN_Ox2Z4cQj0hIbGBtue3yjFGPe2K7QfwA342HQWLHqkqqe09VXYR-MXrGlOr_FClUrwnlnFAqh46Ib2jFqZRECd59RyuqtSR8YPIY_SjlkVKmaC9X6PV-AxhCAFfxHHBatiPkfec2sI3OTnicky94TjimmmMq0WHrN1DiE-BSM6R13ewNFpc42QTYzctuimmN7RpSxc-xzbdQ7VT-4nMcYi6V7BrJxd0EpTEW_3KKjkITwM-PeoIeri7vL27I7d31v4vzW-IEGyoJfqCdp7YTvdYa7DDocWRdNzo1Ki965oAFPnreD85aymTPJYwWfGfDAF6JE_T7wN3l-f8CpZrHecmprTS8p5prqjreVPygcnkuJUMw7d6tzS-GUbPP2xzyNi1v8563Ec0kDqayf24N-RP9hesN-luF6A</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2708280562</pqid></control><display><type>article</type><title>The effect of number of chemical bonds on intrinsic adhesive strength of a silane coupling agent with metals: A first-principles study</title><source>SpringerLink Journals - AutoHoldings</source><creator>Uetsuji, Yasutomo ; Fukui, Naoki ; Yagi, Takahiro ; Nakamura, Yoshinobu</creator><creatorcontrib>Uetsuji, Yasutomo ; Fukui, Naoki ; Yagi, Takahiro ; Nakamura, Yoshinobu</creatorcontrib><description>This paper presents a comparative investigation on intrinsic adhesive strength of a silane coupling agent with metal surfaces through first-principles calculations based on density functional theory. Focusing on a typical silane coupling agent, 3-aminopropyl triethoxy silane (APS), pure copper, and aluminum were selected as the bonding metal. A simple interface model of the silane coupling monomer on the metal surface was constructed under a tensile loading condition. When the number of chemical bonds at the interface is one, Cu has a smaller breaking strain of the bond with oxygen in the APS molecule than Al and demonstrates lower adhesive strength. On the other hand, as the number of bonds increases, the interface becomes stronger and the failure mode changes from interfacial debonding to intramolecular cohesive fracture. As a result, the adhesive strength is improved, and the effect is remarkable especially on the Cu surface. Graphical abstract</description><identifier>ISSN: 0884-2914</identifier><identifier>EISSN: 2044-5326</identifier><identifier>DOI: 10.1557/s43578-022-00496-3</identifier><language>eng</language><publisher>Cham: Springer International Publishing</publisher><subject>Adhesive strength ; Aluminum ; Applied and Technical Physics ; Biomaterials ; Bonding agents ; Bonding strength ; Chemical bonds ; Chemistry and Materials Science ; Copper ; Coupling agents ; Density functional theory ; Failure modes ; First principles ; Inorganic Chemistry ; Materials Engineering ; Materials research ; Materials Science ; Metal surfaces ; Nanotechnology ; Silanes</subject><ispartof>Journal of materials research, 2022-02, Vol.37 (4), p.923-932</ispartof><rights>The Author(s), under exclusive licence to The Materials Research Society 2022</rights><rights>The Author(s), under exclusive licence to The Materials Research Society 2022.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c319t-fd906d0a637888ea998bb166bc5b5d371ce1f2bd279caa014724ebaed6af9ed53</citedby><cites>FETCH-LOGICAL-c319t-fd906d0a637888ea998bb166bc5b5d371ce1f2bd279caa014724ebaed6af9ed53</cites><orcidid>0000-0003-4145-3391</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1557/s43578-022-00496-3$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1557/s43578-022-00496-3$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,780,784,27924,27925,41488,42557,51319</link.rule.ids></links><search><creatorcontrib>Uetsuji, Yasutomo</creatorcontrib><creatorcontrib>Fukui, Naoki</creatorcontrib><creatorcontrib>Yagi, Takahiro</creatorcontrib><creatorcontrib>Nakamura, Yoshinobu</creatorcontrib><title>The effect of number of chemical bonds on intrinsic adhesive strength of a silane coupling agent with metals: A first-principles study</title><title>Journal of materials research</title><addtitle>Journal of Materials Research</addtitle><description>This paper presents a comparative investigation on intrinsic adhesive strength of a silane coupling agent with metal surfaces through first-principles calculations based on density functional theory. Focusing on a typical silane coupling agent, 3-aminopropyl triethoxy silane (APS), pure copper, and aluminum were selected as the bonding metal. A simple interface model of the silane coupling monomer on the metal surface was constructed under a tensile loading condition. When the number of chemical bonds at the interface is one, Cu has a smaller breaking strain of the bond with oxygen in the APS molecule than Al and demonstrates lower adhesive strength. On the other hand, as the number of bonds increases, the interface becomes stronger and the failure mode changes from interfacial debonding to intramolecular cohesive fracture. As a result, the adhesive strength is improved, and the effect is remarkable especially on the Cu surface. Graphical abstract</description><subject>Adhesive strength</subject><subject>Aluminum</subject><subject>Applied and Technical Physics</subject><subject>Biomaterials</subject><subject>Bonding agents</subject><subject>Bonding strength</subject><subject>Chemical bonds</subject><subject>Chemistry and Materials Science</subject><subject>Copper</subject><subject>Coupling agents</subject><subject>Density functional theory</subject><subject>Failure modes</subject><subject>First principles</subject><subject>Inorganic Chemistry</subject><subject>Materials Engineering</subject><subject>Materials research</subject><subject>Materials Science</subject><subject>Metal surfaces</subject><subject>Nanotechnology</subject><subject>Silanes</subject><issn>0884-2914</issn><issn>2044-5326</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2022</creationdate><recordtype>article</recordtype><recordid>eNp9kMtOHDEQRa0oSEwgP5CVpaxN_Ox2Z4cQj0hIbGBtue3yjFGPe2K7QfwA342HQWLHqkqqe09VXYR-MXrGlOr_FClUrwnlnFAqh46Ib2jFqZRECd59RyuqtSR8YPIY_SjlkVKmaC9X6PV-AxhCAFfxHHBatiPkfec2sI3OTnicky94TjimmmMq0WHrN1DiE-BSM6R13ewNFpc42QTYzctuimmN7RpSxc-xzbdQ7VT-4nMcYi6V7BrJxd0EpTEW_3KKjkITwM-PeoIeri7vL27I7d31v4vzW-IEGyoJfqCdp7YTvdYa7DDocWRdNzo1Ki965oAFPnreD85aymTPJYwWfGfDAF6JE_T7wN3l-f8CpZrHecmprTS8p5prqjreVPygcnkuJUMw7d6tzS-GUbPP2xzyNi1v8563Ec0kDqayf24N-RP9hesN-luF6A</recordid><startdate>20220228</startdate><enddate>20220228</enddate><creator>Uetsuji, Yasutomo</creator><creator>Fukui, Naoki</creator><creator>Yagi, Takahiro</creator><creator>Nakamura, Yoshinobu</creator><general>Springer International Publishing</general><general>Springer Nature B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope><orcidid>https://orcid.org/0000-0003-4145-3391</orcidid></search><sort><creationdate>20220228</creationdate><title>The effect of number of chemical bonds on intrinsic adhesive strength of a silane coupling agent with metals: A first-principles study</title><author>Uetsuji, Yasutomo ; Fukui, Naoki ; Yagi, Takahiro ; Nakamura, Yoshinobu</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c319t-fd906d0a637888ea998bb166bc5b5d371ce1f2bd279caa014724ebaed6af9ed53</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2022</creationdate><topic>Adhesive strength</topic><topic>Aluminum</topic><topic>Applied and Technical Physics</topic><topic>Biomaterials</topic><topic>Bonding agents</topic><topic>Bonding strength</topic><topic>Chemical bonds</topic><topic>Chemistry and Materials Science</topic><topic>Copper</topic><topic>Coupling agents</topic><topic>Density functional theory</topic><topic>Failure modes</topic><topic>First principles</topic><topic>Inorganic Chemistry</topic><topic>Materials Engineering</topic><topic>Materials research</topic><topic>Materials Science</topic><topic>Metal surfaces</topic><topic>Nanotechnology</topic><topic>Silanes</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Uetsuji, Yasutomo</creatorcontrib><creatorcontrib>Fukui, Naoki</creatorcontrib><creatorcontrib>Yagi, Takahiro</creatorcontrib><creatorcontrib>Nakamura, Yoshinobu</creatorcontrib><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Journal of materials research</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Uetsuji, Yasutomo</au><au>Fukui, Naoki</au><au>Yagi, Takahiro</au><au>Nakamura, Yoshinobu</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>The effect of number of chemical bonds on intrinsic adhesive strength of a silane coupling agent with metals: A first-principles study</atitle><jtitle>Journal of materials research</jtitle><stitle>Journal of Materials Research</stitle><date>2022-02-28</date><risdate>2022</risdate><volume>37</volume><issue>4</issue><spage>923</spage><epage>932</epage><pages>923-932</pages><issn>0884-2914</issn><eissn>2044-5326</eissn><abstract>This paper presents a comparative investigation on intrinsic adhesive strength of a silane coupling agent with metal surfaces through first-principles calculations based on density functional theory. Focusing on a typical silane coupling agent, 3-aminopropyl triethoxy silane (APS), pure copper, and aluminum were selected as the bonding metal. A simple interface model of the silane coupling monomer on the metal surface was constructed under a tensile loading condition. When the number of chemical bonds at the interface is one, Cu has a smaller breaking strain of the bond with oxygen in the APS molecule than Al and demonstrates lower adhesive strength. On the other hand, as the number of bonds increases, the interface becomes stronger and the failure mode changes from interfacial debonding to intramolecular cohesive fracture. As a result, the adhesive strength is improved, and the effect is remarkable especially on the Cu surface. Graphical abstract</abstract><cop>Cham</cop><pub>Springer International Publishing</pub><doi>10.1557/s43578-022-00496-3</doi><tpages>10</tpages><orcidid>https://orcid.org/0000-0003-4145-3391</orcidid></addata></record>
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subjects Adhesive strength
Aluminum
Applied and Technical Physics
Biomaterials
Bonding agents
Bonding strength
Chemical bonds
Chemistry and Materials Science
Copper
Coupling agents
Density functional theory
Failure modes
First principles
Inorganic Chemistry
Materials Engineering
Materials research
Materials Science
Metal surfaces
Nanotechnology
Silanes
title The effect of number of chemical bonds on intrinsic adhesive strength of a silane coupling agent with metals: A first-principles study
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-19T13%3A01%3A52IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=The%20effect%20of%20number%20of%20chemical%20bonds%20on%20intrinsic%20adhesive%20strength%20of%20a%20silane%20coupling%20agent%20with%20metals:%20A%20first-principles%20study&rft.jtitle=Journal%20of%20materials%20research&rft.au=Uetsuji,%20Yasutomo&rft.date=2022-02-28&rft.volume=37&rft.issue=4&rft.spage=923&rft.epage=932&rft.pages=923-932&rft.issn=0884-2914&rft.eissn=2044-5326&rft_id=info:doi/10.1557/s43578-022-00496-3&rft_dat=%3Cproquest_cross%3E2708280562%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=2708280562&rft_id=info:pmid/&rfr_iscdi=true