Evaluation of Solder Joint Reliability in 3D Packaging Memory Devices under Thermal Shock

In 3D packaging memory devices, solder joints are critical links between the chip and the printed circuit board (PCB). Under severe working conditions, cracks inevitably occur due to thermal shock. If cracks grow in the solder joint, the chip will be disconnected with the PCB, causing its function f...

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Veröffentlicht in:	Electronics (Basel) 2022-08, Vol.11 (16), p.2556
Hauptverfasser:	Zhou, Shuai, Lin, Zhenpei, Qiu, Baojun, Wang, Han, Xiong, Jingang, He, Chang, Zhou, Bei, Pan, Yiliang, Huang, Renbin, Bao, Yiliang, Cai, Nian
Format:	Artikel
Sprache:	eng
Schlagworte:	Accumulation Analysis Circuit boards Circuit printing Crack initiation Crack propagation Deformation Epoxy resins Failure analysis Failure mechanisms Fatigue Fatigue cracks Fatigue failure Fatigue testing machines Fatigue tests Finite element analysis Finite element method Materials Mechanical properties Memory devices Metal fatigue Packaging Printed circuits Reliability analysis Solder and soldering Soldered joints Solders Temperature Testing Thermal expansion Thermal fatigue Thermal shock
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