Performance Analysis of Custom Dual-Finger 250 nm InP HBT Devices for Implementation of 255 GHz Amplifiers

Performance Analysis of Custom Dual-Finger 250 nm InP HBT Devices for Implementation of 255 GHz Amplifiers

The performances of WR-3.4 monolithic amplifiers fabricated using dual-finger 6 µm InP HBT devices are investigated. While one amplifier uses the dual-finger devices formed by simply connecting two existing standard single-finger HBTs, the second amplifier uses newly formed devices that share a comm...

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Veröffentlicht in:Electronics (Basel) 2022-08, Vol.11 (16), p.2614
Hauptverfasser: Koh, Yoon Kyeong, Kim, Yang Woo, Kim, Moonil
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Amplification
Amplifiers
Amplifiers (Electronics)
Circuit design
Design and construction
Geometry
Methods
Transistors
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Kim, Moonil
description The performances of WR-3.4 monolithic amplifiers fabricated using dual-finger 6 µm InP HBT devices are investigated. While one amplifier uses the dual-finger devices formed by simply connecting two existing standard single-finger HBTs, the second amplifier uses newly formed devices that share a common collector metal on a single merged device isolation area. The amplifiers using two types of devices based on the identical matching networks are fabricated for on-wafer probing tests. The custom merged-device amplifier shows clear performance advantages over the separate-device amplifier, showing a peak gain of 10.5 dB and the maximum output power of 5.2 dBm at 255 GHz.
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subjects Amplification
Amplifiers
Amplifiers (Electronics)
Circuit design
Design and construction
Geometry
Methods
Transistors
title Performance Analysis of Custom Dual-Finger 250 nm InP HBT Devices for Implementation of 255 GHz Amplifiers
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