Effect of trace Ge on interfacial reaction and shear strength of Sn-0.7Cu solder joints during isothermal aging and thermal cycling
To improve the interfacial and mechanical properties of Sn-0.7Cu solder, we tried to add minor Ge into it and investigated the interfacial behavior and mechanical properties using ball solder joints during high-temperature isothermal aging and thermal cycling. After soldering, Ge addition promoted t...
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| Veröffentlicht in: | Journal of materials science. Materials in electronics 2022-07, Vol.33 (21), p.17137-17151 |
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| container_title | Journal of materials science. Materials in electronics |
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| creator | Yang, Weiran Ding, Yu Liao, Mingqing Wang, Fengjiang |
| description | To improve the interfacial and mechanical properties of Sn-0.7Cu solder, we tried to add minor Ge into it and investigated the interfacial behavior and mechanical properties using ball solder joints during high-temperature isothermal aging and thermal cycling. After soldering, Ge addition promoted the formation of SnGe solid solution, improved the shear strength of solder joints, and also decreased the thickness of interfacial intermetallic compounds (IMCs) in solder joints. After the following isothermal aging, the evolution on IMC thickness showed that the IMC growth followed linear with square root of aging time, and Ge addition slowed down the diffusion rates of Sn and Cu atoms and the growth of interfacial Cu
6
Sn
5
and Cu
3
Sn IMCs. During thermal cycling, the addition of Ge also improved the shear strength and reliability of solder joints by inhibiting the growth of interfacial IMCs. Furthermore, the growth rate of IMCs during thermal cycling was much slower than that in isothermal aging. We defined the difference between them with factor
K
because it can be attributed to the fact that the activation of Cu and Sn atoms was difficult enough to make the diffusion impossible in the low-temperature stage of thermal cycling. |
| doi_str_mv | 10.1007/s10854-022-08589-9 |
| format | Article |
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6
Sn
5
and Cu
3
Sn IMCs. During thermal cycling, the addition of Ge also improved the shear strength and reliability of solder joints by inhibiting the growth of interfacial IMCs. Furthermore, the growth rate of IMCs during thermal cycling was much slower than that in isothermal aging. We defined the difference between them with factor
K
because it can be attributed to the fact that the activation of Cu and Sn atoms was difficult enough to make the diffusion impossible in the low-temperature stage of thermal cycling.</description><identifier>ISSN: 0957-4522</identifier><identifier>EISSN: 1573-482X</identifier><identifier>DOI: 10.1007/s10854-022-08589-9</identifier><language>eng</language><publisher>New York: Springer US</publisher><subject>Aging ; Characterization and Evaluation of Materials ; Chemistry and Materials Science ; Copper ; Diffusion rate ; Germanium ; High temperature ; Interface reactions ; Intermetallic compounds ; Low temperature ; Materials Science ; Mechanical properties ; Optical and Electronic Materials ; Shear strength ; Soldered joints ; Soldering ; Solders ; Solid solutions ; Thermal cycling ; Thickness ; Tin ; Tin base alloys</subject><ispartof>Journal of materials science. Materials in electronics, 2022-07, Vol.33 (21), p.17137-17151</ispartof><rights>The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature 2022</rights><rights>The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature 2022.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c319t-56a0bd9aaf80ab6002a7d6337dca44c5389382b24a4e4b1ce8c1d5b612a537b73</citedby><cites>FETCH-LOGICAL-c319t-56a0bd9aaf80ab6002a7d6337dca44c5389382b24a4e4b1ce8c1d5b612a537b73</cites><orcidid>0000-0002-0613-8129</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s10854-022-08589-9$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s10854-022-08589-9$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,780,784,27924,27925,41488,42557,51319</link.rule.ids></links><search><creatorcontrib>Yang, Weiran</creatorcontrib><creatorcontrib>Ding, Yu</creatorcontrib><creatorcontrib>Liao, Mingqing</creatorcontrib><creatorcontrib>Wang, Fengjiang</creatorcontrib><title>Effect of trace Ge on interfacial reaction and shear strength of Sn-0.7Cu solder joints during isothermal aging and thermal cycling</title><title>Journal of materials science. Materials in electronics</title><addtitle>J Mater Sci: Mater Electron</addtitle><description>To improve the interfacial and mechanical properties of Sn-0.7Cu solder, we tried to add minor Ge into it and investigated the interfacial behavior and mechanical properties using ball solder joints during high-temperature isothermal aging and thermal cycling. After soldering, Ge addition promoted the formation of SnGe solid solution, improved the shear strength of solder joints, and also decreased the thickness of interfacial intermetallic compounds (IMCs) in solder joints. After the following isothermal aging, the evolution on IMC thickness showed that the IMC growth followed linear with square root of aging time, and Ge addition slowed down the diffusion rates of Sn and Cu atoms and the growth of interfacial Cu
6
Sn
5
and Cu
3
Sn IMCs. During thermal cycling, the addition of Ge also improved the shear strength and reliability of solder joints by inhibiting the growth of interfacial IMCs. Furthermore, the growth rate of IMCs during thermal cycling was much slower than that in isothermal aging. We defined the difference between them with factor
K
because it can be attributed to the fact that the activation of Cu and Sn atoms was difficult enough to make the diffusion impossible in the low-temperature stage of thermal cycling.</description><subject>Aging</subject><subject>Characterization and Evaluation of Materials</subject><subject>Chemistry and Materials Science</subject><subject>Copper</subject><subject>Diffusion rate</subject><subject>Germanium</subject><subject>High temperature</subject><subject>Interface reactions</subject><subject>Intermetallic compounds</subject><subject>Low temperature</subject><subject>Materials Science</subject><subject>Mechanical properties</subject><subject>Optical and Electronic Materials</subject><subject>Shear strength</subject><subject>Soldered joints</subject><subject>Soldering</subject><subject>Solders</subject><subject>Solid solutions</subject><subject>Thermal cycling</subject><subject>Thickness</subject><subject>Tin</subject><subject>Tin base alloys</subject><issn>0957-4522</issn><issn>1573-482X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2022</creationdate><recordtype>article</recordtype><sourceid>AFKRA</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><recordid>eNp9kD1PwzAURS0EEqXwB5gsMbv4K7Ezoqp8SJUYAInNenGcNlWaFNsZOvPHcQiIjelZV-_cJx-ErhldMErVbWBUZ5JQzkl66IIUJ2jGMiWI1Pz9FM1okSkiM87P0UUIO0ppLoWeoc9VXTsbcV_j6ME6_OBw3-Gmi87XYBtosXdgY5NC6Coctg48DtG7bhO3I_bSEbpQywGHvq2cx7s-wQFXg2-6DW5CH7fO71MPbMZgLPlN7NG2KbtEZzW0wV39zDl6u1-9Lh_J-vnhaXm3JlawIpIsB1pWBUCtKZQ5pRxUlQuhKgtS2kzoQmhecgnSyZJZpy2rsjJnHDKhSiXm6GbqPfj-Y3Ahml0_-C6dNDzXihYqqUxbfNqyvg_Bu9ocfLMHfzSMmlG2mWSbJNt8yzZFgsQEhcP4bef_qv-hvgDU9YM6</recordid><startdate>20220701</startdate><enddate>20220701</enddate><creator>Yang, Weiran</creator><creator>Ding, Yu</creator><creator>Liao, Mingqing</creator><creator>Wang, Fengjiang</creator><general>Springer US</general><general>Springer Nature B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>F28</scope><scope>FR3</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>KB.</scope><scope>L7M</scope><scope>P5Z</scope><scope>P62</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>S0W</scope><orcidid>https://orcid.org/0000-0002-0613-8129</orcidid></search><sort><creationdate>20220701</creationdate><title>Effect of trace Ge on interfacial reaction and shear strength of Sn-0.7Cu solder joints during isothermal aging and thermal cycling</title><author>Yang, Weiran ; Ding, Yu ; Liao, Mingqing ; Wang, Fengjiang</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c319t-56a0bd9aaf80ab6002a7d6337dca44c5389382b24a4e4b1ce8c1d5b612a537b73</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2022</creationdate><topic>Aging</topic><topic>Characterization and Evaluation of Materials</topic><topic>Chemistry and Materials Science</topic><topic>Copper</topic><topic>Diffusion rate</topic><topic>Germanium</topic><topic>High temperature</topic><topic>Interface reactions</topic><topic>Intermetallic compounds</topic><topic>Low temperature</topic><topic>Materials Science</topic><topic>Mechanical properties</topic><topic>Optical and Electronic Materials</topic><topic>Shear strength</topic><topic>Soldered joints</topic><topic>Soldering</topic><topic>Solders</topic><topic>Solid solutions</topic><topic>Thermal cycling</topic><topic>Thickness</topic><topic>Tin</topic><topic>Tin base alloys</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Yang, Weiran</creatorcontrib><creatorcontrib>Ding, Yu</creatorcontrib><creatorcontrib>Liao, Mingqing</creatorcontrib><creatorcontrib>Wang, Fengjiang</creatorcontrib><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central UK/Ireland</collection><collection>Advanced Technologies & Aerospace Collection</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>SciTech Premium Collection</collection><collection>Materials Research Database</collection><collection>Materials Science Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Advanced Technologies & Aerospace Database</collection><collection>ProQuest Advanced Technologies & Aerospace Collection</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>DELNET Engineering & Technology Collection</collection><jtitle>Journal of materials science. Materials in electronics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Yang, Weiran</au><au>Ding, Yu</au><au>Liao, Mingqing</au><au>Wang, Fengjiang</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Effect of trace Ge on interfacial reaction and shear strength of Sn-0.7Cu solder joints during isothermal aging and thermal cycling</atitle><jtitle>Journal of materials science. Materials in electronics</jtitle><stitle>J Mater Sci: Mater Electron</stitle><date>2022-07-01</date><risdate>2022</risdate><volume>33</volume><issue>21</issue><spage>17137</spage><epage>17151</epage><pages>17137-17151</pages><issn>0957-4522</issn><eissn>1573-482X</eissn><abstract>To improve the interfacial and mechanical properties of Sn-0.7Cu solder, we tried to add minor Ge into it and investigated the interfacial behavior and mechanical properties using ball solder joints during high-temperature isothermal aging and thermal cycling. After soldering, Ge addition promoted the formation of SnGe solid solution, improved the shear strength of solder joints, and also decreased the thickness of interfacial intermetallic compounds (IMCs) in solder joints. After the following isothermal aging, the evolution on IMC thickness showed that the IMC growth followed linear with square root of aging time, and Ge addition slowed down the diffusion rates of Sn and Cu atoms and the growth of interfacial Cu
6
Sn
5
and Cu
3
Sn IMCs. During thermal cycling, the addition of Ge also improved the shear strength and reliability of solder joints by inhibiting the growth of interfacial IMCs. Furthermore, the growth rate of IMCs during thermal cycling was much slower than that in isothermal aging. We defined the difference between them with factor
K
because it can be attributed to the fact that the activation of Cu and Sn atoms was difficult enough to make the diffusion impossible in the low-temperature stage of thermal cycling.</abstract><cop>New York</cop><pub>Springer US</pub><doi>10.1007/s10854-022-08589-9</doi><tpages>15</tpages><orcidid>https://orcid.org/0000-0002-0613-8129</orcidid></addata></record> |
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| subjects | Aging Characterization and Evaluation of Materials Chemistry and Materials Science Copper Diffusion rate Germanium High temperature Interface reactions Intermetallic compounds Low temperature Materials Science Mechanical properties Optical and Electronic Materials Shear strength Soldered joints Soldering Solders Solid solutions Thermal cycling Thickness Tin Tin base alloys |
| title | Effect of trace Ge on interfacial reaction and shear strength of Sn-0.7Cu solder joints during isothermal aging and thermal cycling |
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